• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.37-42
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• 2000

The optical storage device has recently experienced significant improvements, especially for the aspects of high capacity and fast transfer rate. However, it is the fact that the optical storage device has the lower access time for the randomly scattered data compared to the hard disk drives. It is, therefore, necessary to develop a new type of optical storage system. In this study, we investigate the air bearing characteristics for the optical disk drives which have the swing arm actuator similar to the hard disk drives. Considering the requirements of the optical disk drives, we parameterize the shape of the air bearing surface and investigate its sensitivity to the flying characteristics for further optimized design outputs.

• Journal of Biosystems Engineering
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• v.37 no.1
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• pp.51-57
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• 2012

Purpose: The compression strength of corrugated fiberboard containers used to package agricultural products rapidly decreases owing to various environmental factors encountered during the distribution of unitized products. The main factors affecting compression strength are moisture absorption, long-term top load, and fatigue caused by shock and vibration during transport. This study characterized the durability of corrugated fiberboard containers for packaging fruits and vegetables under simulated transportation conditions. Methods: Compression tests were done after corrugated fiberboard containers containing fruit were vibrated by an electro-dynamic vibration test system using the power spectral density of routes typically traveled to transport fruits and vegetables in South Korea. Results: To predict loss of compression strength owing to vibration fatigue, a multiple nonlinear regression equation ($r^2=0.9217$, $RMSE=0.6347$) was developed using three independent variables of initial container compression strength, namely top stacked weight, loading weight, and vibration time. To test the applicability of our model, we compared our experimental results with those obtained during a road test in which peaches were transported in corrugated containers. Conclusions: The comparison revealed a highly significant ($p{\leq}0.05$) relationship between the experimental and road-test results.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Journal of the Korean Society of Food Culture
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• v.32 no.1
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• pp.39-51
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• 2017

The purpose of this study was to analyze the current status relating to food packaging and design for status of small and medium food enterprises. A company survey was conducted from June to October, 2015 and targeted 1300 small and medium domestic food enterprises. Finally, a total of 1300 (recovery rate 100%) useable data were selected. Statistical analyses were performed on the data utilizing the SPSS PASW Statistics 18.0 for Windows, such as descriptive statistics and frequency analysis. According to the results, awareness and importance of food labeling were high, but performance of English inscription of product name was relatively low. The most important reason for food labeling was 'providing correct information on food' 910 (72.8%). Accordingly, a system which can provide the latest information by continuously monitoring mandatory disclosure requirements for types of foods in individual countries is needed.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.45-51
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• 2001

The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.9-13
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• 2001

The effects of glass addition on the densification and the microwave properties of $(Ba_{0.5}Pb_{0.5})Nd_2Ti_5O_{14}$ dielectric system were studied. When 2~3 wt% of borosilicate glass were added, the density increased and the better microwave properties were obtained. When a sample was sintered at $950^{\circ}C$ with 3 wt% of glass, the quality factor and the temperature coefficient of the resonant frequency of the specimen were 4500 and +10 $ppm/^{\circ}C$, respectively. The dielectric constant, however, decreased from 90 to 75 with glass addition.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.5-9
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• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.