• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.1
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• pp.17-24
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• 2005

During handling unitized products, they are subjected to a variety environmental hazards. Shock and vibration hazards are generally considered the most damaging of the environmental hazards on a product, and it may encounter while passing through the distribution environment. A major cause of shock damage to products is drops during manual handling. The increasing use of unitization on pallets has been resulted in a reduction in the manual handling of products and with it a reduction in the shock hazards. This has caused and increasing interest in research focused on vibration caused damage. the use of pallets as a base for unitizing loads, aids in the mechanical handling, transportation and storage of products. Besides aiding in the handling, transportation and storage of products, a pallet also acts on and interface between the packaged goods and the distribution environment. The determination of the impact deformation of the cushioning materials such as tray cup (polymeric foam) and corrugated fiberboard pad must be carried out to design the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. In this study, the theoretical analysis of impact deformation for cushioning materials by dynamic vibration. The impact deformations of SW and DW corrugated fiberboard pad in acceleration amplitudes of 0.25 G-rms and 0.5 G-rms that were usually generated in transport vehicles during distribution environments were very small compare with the thickness of corrugated fiberboard pad. The maximum of vibration acceleration level of tray cup by vibration impact was about 3.2 G-rms. The theoretical allowable acceleration (G-factor) of the pear was 0.7102 G-rms, and the maximum dynamic deformation estimated within G-factor was about 1 mm.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.25-29
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• 1999

Time-temperature indicators (TTI) from three different companies obtained and were attached to food packages materials to evaluate degree of their color change according to storage time and temperature. Five temperature (-10 -5, 0, 5 and 10) was selected to represent standard freezing, refrigerating and room temperature, and evaluated performance by color change based on magnitude of color change and hunter system (L, a, b). Response end point was measured and recorded to find characteristic of each indicator. Comparison and discussion were conducted for accuracy and precision of each time-temperature. More research should be conducted at variable temperature and with various food to determine applicability of TTI on various storage condition.

• Journal of Biosystems Engineering
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• v.30 no.2 s.109
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• pp.89-94
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• 2005

The compression strength of corrugated fiberboard container for packaging the agricultural products rapidly decreases because of various environmental conditions during distribution of unitized products. Among various environmental conditions, the main factors affecting the compression strength of corrugated fiberboard are absorption of moisture, long-term accumulative load, and fatigue caused by shock and vibration. An estimated rate of damage for fruit during distribution is about from 30 to 40 percent owing to the shock and vibration. This study was carried out to characterize the durability of corrugated fiberboard container for packaging the fruit and vegetables under simulated transportation environment. The vibration test system was constructed to simulate the land transportation using truck. After the package with corrugated fiberboard container was vibrated by vibration test system at various experimental conditions, the compression test for the package was performed. The compression strength of corrugated fiberboard container decreased with loading weight and vibrating time. The multiple nonlinear regression equation for predicting the decreasing rate of compression strength of corrugated fiberboard containers were developed using four independent variables such as input acceleration level, input frequency, loading weight and vibrating time. The influence of loading weight on the decreasing rate of corrugated fiberboard container was larger than other variables.

• Food Science of Animal Resources
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• v.24 no.4
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• pp.367-372
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• 2004

Nitrite, a curing agent of meat products, is precursors of carcinogenic N-nitrosamines during processing of meat products or under human stomach conditions as well as having its own toxicity. Some researches have been conducted to evaluate the effects of ionizing radiation on the reduction of residual nitrite and N-nitrosamines in an aqueous model system and cured meat products with different packaging methods during storage. These results showed that the gamma irradiation was effective in reducing the residual nitrite and N-nitrosamines in an aqueous model system as well as meat products. Especially, irradiation combined with vacuum or modified atmosphere packaging was more effective in nitrite and N-nitrosamines reduction than aerobic packaging during storage. The objective of this review is to introduce the irradiation technology for the application of reducing the residual nitrite and N-nitrosamine contents in meat products.

• Journal of Korean Institute of Industrial Engineers
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• v.29 no.4
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• pp.271-282
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• 2003

Automotive occupant packaging has been a part of main ergonomics interests, especially, in terms of driver's posture. Previous research on driver's posture has mainly focused on the initial optimal posture for driving sedans. However, customer preferences on cars are shifting from sedans to RV and automobile manufacturing companies seek to understand temporal changes in drivers' posture according to driving environment. So the main aim of this study was to develop a driver's posture measurement system during driving and investigate casual changes due to duration, car type, traffic flow. Four male drivers participated in the experiments during one week. It was shown that considerable changes in their postures were caused with respect to driving environment, which implies that not only static optimal postures but their dynamic changes should be taken into consideration for proper design and evaluation of interior packaging. The research is expected to help packaging designers understand human drivers so as to improve their comfort.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.3
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• pp.251-258
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• 2010

This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI); the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI.