• 월간포장계
• /
• 통권374호
• /
• pp.36-43
• /
• 2024

• 월간포장계
• /
• 통권374호
• /
• pp.59-64
• /
• 2024

• 마이크로전자및패키징학회지
• /
• 제27권3호
• /
• pp.21-27
• /
• 2020

The importance of floating photovoltaic systems has recently been emerging to address some issues arising from the installation of conventional ground-mounted photovoltaics. Floating photovoltaics have a few advantages such as cutting down land usage, reducing water evaporation or creating algae. Though there is still necessity to supplement with technical issues: mechanical stability, reliability and long-term durability of floaters and modules. In this paper, we focus the current level of packaging development and introduce research trends that could be applied to next-generation floating photovoltaics.

• 마이크로전자및패키징학회지
• /
• 제21권2호
• /
• pp.23-29
• /
• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• 한국포장학회지
• /
• 제25권3호
• /
• pp.89-94
• /
• 2019

Among the many packaging materials used in cushion packaging, there is a lack of optimum design for the tray cup pad used in fruit packaging for export and domestic distribution. It causes over-packaging due to excessive material input, and this could be solved by applying various parameters needed to optimize the design of the tray cup pad considering the packaging material and the quantity of fruits in the box. In the case of a tray cup for fruits, the economic efficiency of material and thickness should be considered. Therefore, it is possible to design a tray cup pad depending on the packaging material used by applying appropriate design parameters. The static and dynamic characteristics of the materials used for packaging of pears were analyzed by using the FEM (finite element Method) simulation technique to derive the optimal design parameters. And by applying the appropriate design parameters considering the quantity of fruit and distribution environment, it is possible to design an appropriate fruit tray cup pad. In this study, as a result of simulating the contact stresses between the fruit and the tray cup for the PP, PE, and PS materials used in the fruit tray cup, the material with the lowest contact stress was PP and the value was found to be 398 Pa. The contact displacement between fruit and tray cup using this material was about 0.0463 mm, which was the lowest value compared with other materials. Also the resonance frequency band of tray cup made of PP material was below 36.81 Hz, and the strain energy was below 12.20 J. The resonant frequency band of the pear is more than 80 Hz and it could be applied to all the tray cup materials as compared with the resonance band of 38.81 Hz or less which is the resonance band of all tray cup pads for packaging. Finally, PP is the most suitable material for the tray cup pad.

• 마이크로전자및패키징학회지
• /
• 제22권4호
• /
• pp.7-14
• /
• 2015

Research and application of three dimensional packaging technology in electronics have been increasing according to the trend of high density, high capacity and light weight in electronics. In this paper, TSV fabrication and research trend in three dimensional packaging are reported. Low alpha solder bumping which can solve the soft error problem in electronics is also introduced. In detail, this paper includes fabrication of TSV, functional layers deposition, Cu filling in TSV by electroplating using PPR (periodic pulse reverse) and 3 step PPR processes, and low alpha solder bumping on TSV by solder ball. TSV and low alpha solder bumping technologies need more studies and improvements, and the drawbacks of three dimensional packaging can be solved gradually through continuous attentions and researches.

• 마이크로전자및패키징학회지
• /
• 제21권2호
• /
• pp.13-21
• /
• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
• /
• pp.1071-1074
• /
• 2008

By carefully selecting the structure of dyes, especially the metal complex dyes, and studying the properties of the prototype display. It was found some dyes electrophoresis and display well. The dyes ink with good stability during electrophoresis when the electrode was protected. while the response time is about 300 ms.

• Preventive Nutrition and Food Science
• /
• 제4권2호
• /
• pp.152-158
• /
• 1999

Polystyrene is frequently used for food packaging because of its eaxy processing rigidity , and low cost. Styrene, which is present in detectable amouts in the polymer, is usually considered to be the substance responsible for the possible tainting of a polystyrene-packed food by migration. The contamination of foods and beverages by trace amounts of materials which have migrated from plastics use din packaging is a concern both on the grounds of adversely affecting product quality and of food safety. These lead to increasing attention to the potentional hazards of a large variety of plastic materials and foods. In this paper we reviewed the history of Styrene and various analytical methods of sample preparation and detection to assess the extent to which styrene is present in food-grade polystrene materials and to what extent it leaked into foods and food stimulants.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2006년도 하계종합학술대회
• /
• pp.45-46
• /
• 2006

An ultrawide bandpass filter with sharp rejection and wider stopband is designed and implemented using multilayer ceramic configuration. The proposed filter is composed of a broadside coupled structure and a ring type filter with an embedded stripline stub. The measured results show that the fractional bandwidth and upper stopband of the proposed filter are 106 % and better than -30 dB, respectively. The insertion loss is less than 1 dB, and group delay is less than 0.3 ns in the passband. In addition, ring and broadside coupled gap structures are characterized and compared to the proposed structure.