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http://dx.doi.org/10.6117/kmeps.2014.21.2.013

Overview on Thermal Management Technology for High Power Device Packaging  

Kim, Kwang-Seok (성균관대학교 나노과학기술학과)
Choi, Don-Hyun (성균관대학교 신소재공학과)
Jung, Seung-Boo (성균관대학교 신소재공학과)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.2, 2014 , pp. 13-21 More about this Journal
Abstract
Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.
Keywords
Power device packaging; Power electronics; Interconnection; Thermal interface materials; Thermal management;
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