1 |
R. John, O. Vermesan and R. Bayerer, "High Temperature Power Electronics IGBT Modules for Electrical and Hybrid Vehicles", Proc. International Conference on High Temperature Electronics (HiTEC), Oxford, 199, International Microelectronics Assembly and Packaging Society (iMAPS) (2009).
|
2 |
Half etching method for high current PCB, TSS Inc. from http://www.tssg.com/substrate/special.html
|
3 |
Y. T. Lee, S. Shanmugan and D. Mutharasu, "Thermal Resistance of CNTs-Based Thermal Interface Material for High Power Solid State Device Packages", Appl. Phys. A., 114(4), 1145 (2014).
DOI
ScienceOn
|
4 |
J. Adam, "New Correlations Between Electrical Current and Temperature Rise in PCB Traces", Proc. 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMITHEM), San Jose, 292, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2004).
|
5 |
Y. Ling, "On Current Carrying Capacities of PCB Traces", Proc. 52nd Electronic Components and Technology Conference (ECTC), San Diego, 1683, IEEE Components, Packaging, and Manufacturing Society (CPMT) (2002).
|
6 |
H. Lu, C. Bailey and C. Yin, "Design for Reliability of Power Electronics Modules", Microelectron. Reliab., 49(9-11), 1250 (2009).
DOI
ScienceOn
|
7 |
M. Thoben, K. Mainka, R. Bayerer, I. Graf and M. Mnzer, "From Vehicle Drive Cycle to Reliability Testing of Power Modules for Hybrid Vehicle Inverter", Proc. 30th International Conference for Power Conversion and Intelligent Motion (PCIM) Europe, Nuremberg, 651, Mesago PCIM GmbH (2008).
|
8 |
R. Bayerer, T. Hermann, T. Licht, J. Lutz, and M. Feller, "Model for Power Cycling Lifetime of IGBT Modules- Various Factors Influencing Lifetime", Proc. 5th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, 1, IEEE Power Electronics Society (PELS) (2008).
|
9 |
D. Schweitzer, H. Pape and L. Chen, "Transient Measurement of The Junction-to-Case Thermal Resistance Using Structure Functions: Chances and Limits", Proc. 24th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, 191, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2008).
|
10 |
M. Knoerr, "Power Semiconductor Joining Through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability", Proc. 6th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, 1, IEEE Power Electronics Society (PELS) (2010).
|
11 |
L. Coppola, D. Huff, F. Wang, R. Burgos and D. Boroyevich, "Survey on High-Temperature Packaging Materials for SiCBased Power Electronics Modules", Proc. 38th IEEE Power Electronics Specialists Conference (PESC), Orlando, 2234, IEEE Power Electronics Society (PELS) (2007).
|
12 |
D. B. Miracle, "Metal Matrix Composites-From Science to Technological Significance", Comp. Sci. Technol., 65, 2526 (2005).
DOI
ScienceOn
|
13 |
J. Biela, U. Badstuebner and J. W. Kolar, "Impact of Power Density Maximization on Efficiency of DC-DC Converter Systems", IEEE Transactions on Power Electronics., 24(1), 288 (2009).
DOI
ScienceOn
|
14 |
Z. Xu, F. Xu, D. Jiang, W. Cao and F. Wang, "A High Temperature Traction Inverter with Reduced Cooling and Improved Efficiency for HEV Applications", Proc. 5th IEEE Energy Conversion Congress and Exposition (ECCE), Denver, 2786, IEEE Power Electronics Society (PELS) (2013).
|
15 |
Z. Liang, P. Ning, F. Wang and L. Marlino, "A Phase-Leg Power Module Packaged with Optimized Planar Interconnections and Integrated Double Sided Cooling", IEEE J. Emerging and Selected Topics in Power Electronics., PP(99), 1 (2014)
|
16 |
Z. Liang, P. Ning and F. Wang, "Development of Advanced All-SiC Power Modules", IEEE Trans. Power Electron., 29(5), 2289 (2014).
DOI
ScienceOn
|
17 |
S. Bader, W. Gust and H. Hieber, "Rapid Formation of Intermetallic Compounds by Interdiffusion in The Cu-Sn and Ni- Sn Systems", Acta. Metall. Mater., 43(1), 329 (1995).
|
18 |
U. Scheuermann, "Reliability of Planar SKiN Interconnect Technology", Proc. 7th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, 1, IEEE Power Electronics Society (PELS) (2012).
|
19 |
W. Steinhgl, G. Schindler, G. Steinlesberger, M. Traving and M. Engelhardt, "Comprehensive Study of The Resistivity of Copper Wires with Lateral Dimensions of 100 nm and Smaller", J. Appl. Phys., 97, 023706 (2005).
DOI
ScienceOn
|
20 |
S. Thomas, "Reliability of Cu Wire Bonding on Active Area for Automotive Applications", Proc. 11th Electronics Packaging Technology Conference (EPTC), Singapore, 363, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
|
21 |
K. Guth, D. Siepe, J. Grlich, H. Torwesten, R. Roth, F. Hille and F. Umbach, "New Assembly and Interconnects Beyond Sintering Methods", Proc. 6th International Conference on Integrated Power Electronics Systems (CIPS), Nuremberg, 232, IEEE Power Electronics Society (PELS) (2010).
|
22 |
J. M. Hornberger, E. Cilio, R. M. Schupbach, A. B. Lostetter and H. A. Mantooth, "A High-Temperature Multichip Power Module (MCPM) Inverter Utilizing Silicon Carbide (SiC) and Silicon on Insulator (SOI) Electronics", Proc. 37th IEEE Power Electronics Specialists Conference (PESC), Jeju, 1, IEEE Power Electronics Society (PELS) (2006).
|
23 |
Z. Liang, "Status and Trend of Automotive Power Packaging", Prc. 24th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Bruges, 325, IEEE Power Electronics Society (PELS) (2012).
|
24 |
E. Wolfgang, N. Selinger and G. Lugert, "High-Temperature Power Electronics: Challenges and Opportunities", Proc. 2nd International Conference on Integrated Power Electronics Systems (CIPS), Bremen, 43, IEEE Power Electronics Society (PELS) (2002).
|
25 |
M. Bakowski, "Roadmap for SiC power devices", Journal of Telecommunications and information technology, 3-4, 19 (2000).
|
26 |
Y. Liu, "Challenges of Power Electronic Packaging", in Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling, pp.1-8, Springer Science+Business Media, New York (2012).
|
27 |
N. Y. N. Shammas, "Present problems of power module packaging technology",Microelectron. Reliab., 43, 519 (2003).
DOI
ScienceOn
|
28 |
T. Funaki, J. Balda, J. Junghans, A. Kashyap, F. Barlow, A. Mantooth, T. Kimoto and T. Hikihara, "Power Conversion with SiC Devices at Extremely High Ambient Temperatures", Proc. 36th IEEE Power Electronics Specialists Conference (PESC), Recife, 2030, IEEE Power Electronics Society (PELS) (2005).
|
29 |
J. N. Calata, J. G. Bai, X. Liu, S. Wen and G.-Q. Lu, "Three- Dimensional Packaging for Power Semiconductor Devices and Modules", IEEE Transactions on Advanced Packaging, 28(3), 404 (2005).
DOI
ScienceOn
|
30 |
T. Stockmier, "From Packaging to 'Un'-Packaging-Trends in Power Semiconductor Modules", Proc. 20th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Orlando, 12, IEEE Power Electronics Society (PELS) (2008).
|
31 |
S. Dieckerhoff, T. Kirfe, T. Wernicke, C. Kallmayer, A. Ostmann, E. Jung, B. Wunderle and H. Reichl, "Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs", Proc. 38th IEEE Power Electronics Specialists Conference (PESC), Orlando, 1036, IEEE Power Electronics Society (PELS) (2007).
|
32 |
E. Milke and T. Mueller, "High Temperature Behaviour and Reliability of Al-Ribbon for Automotive Applications", Proc. 2nd Electronics System-Integration Technology Conference (ESTC), Greenwich, 417, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2008).
|
33 |
P. Hansen, and P. McCluskey, "Failure Models in Power Device Interconnects", Proc. 12th European Conference on Power Electronics and Applications (EPE), Aalborg, 1, IEEE Power Electronics Society (PELS) (2007).
|