• Journal of the East Asian Society of Dietary Life
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• v.23 no.4
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• pp.461-469
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• 2013

This research is performed to investigate the changes in the physicochemical properties and microbial growths of seasoned anchovies with various packaging materials (PET/CPP : polyethylene terephthalate/cast polypropylene, PET/EVOH : polyethylene terephthalate/ethylene-vinyl alcohol, PET/AL/LDPE: polyethylene terephthalate/aluminum/low density polyethylene), which are stored at various temperatures (25, 35, $45^{\circ}C$) for 60 days. Generally, it is being observed that changes in physicochemical properties (i.e., moisture content, color, brown intensity, TBA value, TMA, VBN etc) of seasoned anchovies are significant when stored at higher temperatures. Particularly, the packaging materials are found to influence substantially on the physicochemical properties of seasoned anchovies. With packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e., PET/CPP), the changes in physicochemical properties of seasoned anchovies are significant, while being low with low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). In addition, results of microbial growths in seasoned anchovies show that significant increases in total aerobic bacteria counts (about 100-fold after 60 day of storage) are observed in samples with packaging materials of high oxygen transmission rates and moisture vapor transmission rates (i.e, PET/CPP), while with only small increases for samples of low oxygen transmission rates and low moisture vapor transmission rates (i.e., PET/EVOH). Based on the changes in the physicochemical properties and results of microbial growths, it is being concluded that PET/EVOH film is suitable for the packaging of seasoned anchovies.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.42-58
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• 1999

Packaging materials and articles that are used in food contact applications can transfer constituents in the foodstuffs. This kind of risk of possible health hazards to consumers has been generally recognized for a long time with the consequence of establishing corresponding food regulations in most developed countries. However, the language of these laws, their interpretation, and their level of enforcement vary from country to country. Accordingly, the actual migrating levels from packaging materials can be varied depending on the migration testing methods as prescribed in the national legislation in each countries. Therefore, there are needs of elimination of non-tariff trade barriers raised by sanitary and phytosanitary or technical measures under the Final Act of the UR Agreement. In this connection, the EU and USA are currently in an ongoing process of legislation harmonization to overcome potential barriers to free trade. In general, regulations governing component transfer in the USA are more complicated and comprehensive than similar regulations in Europe. In future, standard migration testing procedures for microwave heat susceptor materials and for the use of fatty food simulant should be established and also harmonized among countries. The objective of this investigation is to compare the current regulations for migration testing for plastic containers and packaging materials in USA, EU and Korea or Japan. For those regulations, Korean standards are required to be kept up with the international standards. By doing this, the related Korean regulation could be amended along with the worldwide progress for harmonization.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.32-42
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• 2002

This study were conducted to reveal the awareness and competitiveness of Korean packaging industry in information technology(IT) and e-commerce. For the survey, 114 sample companies were selected representing all packaging materials, equipment and systems, institutes, consulting and trading companies. The trained interviewers spoke to the respondents who were at the position of packaging research and development and were considered knowledgeable about the level of IT in the company. The collected data were analyze in three major categories: IT fundamentals, usages, and company policy. From the results, packaging suppliers were at the very low level of IT fundamentals and uses compared to those of packaging users. The gap between packaging suppliers and users that access the Internet was seriously wide, and this trend was generally due to different size of company. Packaging suppliers were still at the basic level of information-oriented working environment.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.6 no.1
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• pp.37-40
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• 2000

This study was carried out to investigate dropping shock of household electric appliances during materials handling. Microwave oven($18{\ell}$), TV(16") and washing machine(6.2kg) were singled out as the study items. From the results of dropping test by KS A 1026(General Rules of Performance Testing for Packaged Freights), relative equations were gained as follow : y=0.0863x+10.032 for microwave oven, y=0.136x+7.85 for TV and y=0.214x+5.8 for washing machine (where y is G-factor and x is Dropping height). The maximum values of dropping shock during materials handling were measured to be $11{\sim}14G$ for microwave oven, $12{\sim}15G$ for TV and $10{\sim}12G$ for washing machine. The maximum shocks of microwave oven, TV and washing machine during materials handling were corresponding to dropping shocks of dropping height 45.98cm, 52.57cm and 28.97cm by KS A 1026.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.155-161
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• 2016

As one of traditional packaging materials, paper and paperboard are being more popular and beneficial thanks to their environmental sustainability and have been widely used in packaging applications, from light weight infusible tissue for tea/coffee bags to heavy duty boards for the distribution. Papermakers have to design the products having a desired customized function with their paper machine. Globally, the use of filler and pigment in papermaking is now a very common practice to meet the needs of customers. Many benefits can be achieved as a result of filler addition, which mainly includes cost and energy savings. The replacement of traditional mineral fillers and pigments with biodegradable and renewable carbohydrate polymers is a very interesting and promising research topic due to the concern of environmental impact. In this review paper, the use of traditional and novel carbohydrate fillers and pigments in cellulosic paper is highlighted. It is noteworthy that there are still some challenges and technical barriers associated with the use of these organic materials in point of structural stabilities and manufacturing costs, although most of them are available in market as the commercialized products. With the emerging nanotechnologies, it is believed that the use of carbohydrate-based filler and pigment for papermaking will increase and bring technical advantages to industry.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.1
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• pp.1-9
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• 2020

We evaluated the applicability of baking soda, charco'al, coffee, and green tea as a natural deodorant in Kimchi packaging. Moreover, to evaluate the potential usage of these deodorants in packaging materials and confirm their applicability in high-temperature melt-extrusion processing, the thermal stabilities of the deodorants were investigated, and heat-treated deodorants were evaluated in terms of the deodorizing function compared with non-treated deodorants. Aroma patterns were decreased after deodorizing treatment with all-natural deodorants. Dimethyl disulfide, methyl trisulfide, and diallyl disulfide, the most significant odorous Volatile organic compounds (VOCs) of Kimchi, decreased after treatment with the deodorants. In particular, baking soda and charcoal showed the highest efficiency in removing odorous compounds and VOCs from Kimchi, even after high-temperature processing. The acetic acid removal rates for both baking soda and charcoal were 99.9±0.0%. The heating process increases the deodorizing effects of baking soda. Sensory evaluation results showed that there is a significant increase (p < 0.05) in the overall preference for Kimchi samples packaged with charcoal and baking soda. This study provides useful information for the deodorization effects of natural deodorants for Kimchi smell and their applicability for packaging materials.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.1-8
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• 2022

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO₂ hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.