• Journal of Multimedia Information System
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• v.9 no.2
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• pp.137-144
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• 2022

This research aims to identify the relationship between visual perception and emotion by the types of fear responses elicited from warning images on cigarette packages as well as the effectiveness of the size of such images through questionnaires and eye-tracking experiments with twenty university students from the colleges based in Busan. The research distinguished and analyzed the warning images as rational appeals and emotional appeals by the degree of fear and disgust and the result concurred with the research conclusions of Maynard that people would naturally avoid eye contact when presented with a warning image on cigarette packages. Also, eye avoidance was highly identified with larger (75%) warning images. While the previous research mostly adopted the self-rated validation method, this research tried to make the methodology more objective by adopting both questionnaires and eye-tracking experiments. Through this research, authors contribute to finding effective warning images on cigarette packages in a way to increase public awareness of the dangers of smoking and discourage smoking. Further research is recommended to explore the effectiveness of using explicit images on cigarette packages by the types of smokers such as heavy smokers, normal smokers, and non-smokers.

• Journal of the Korean Data and Information Science Society
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• v.19 no.2
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• pp.487-496
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• 2008

Recently survival analysis becomes popular in a variety of fields so that a number of statistical packages are developed for analyzing the survival model. In this paper, several types of survival models are introduced and considered briefly. In addition, widely used three packages(SAS, SPSS, and STATA) for survival data are reviewed and their characteristics are investigated.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.487-488
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• 2006

In this paper, we analyzed the FBGA packages operating in high speeds and high frequency rates for DRAM. Using 3D simulations, we could extract s-parameters of packages. We realize that the proposed FBGA package does not operate properly at 3Gbps bacause the FBGA package have delta-I noise($V_{{\Delta}I-peak}$) of 132.0mV and crosstalk of 300mV, which is 25% of the operating clock level.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.2
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• pp.65-70
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• 2003

In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

• Journal of Applied Reliability
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• v.16 no.4
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• pp.347-355
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• 2016

Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Journal of the Korean Society of Costume
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• v.52 no.2
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• pp.81-90
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• 2002

There are increasing a foreign visitors since 88 Seoul Olympic game. Uniform is getting increased importance as one of the symbols which represent the characteristic of restaurant as well as gloves good impression to the customers and foreign tourist. This study aims at developing uniform packages (including table cloth, mat, napkin, end so on) that satisfy the customers' need and let foreign visitors recognize the outstanding beauty of Korean traditional pattern. For uniform design, It was selected a sumacsae of a the lotus flower motif and developed a textile pattern design by using CAD system. And then the developed textile design was printed a polyster100% fabric by using the digital textile printing system. Uniform packages designs were developed applying traditional sumacsae motif in order to capture a modern stance of beauty under using blue and pink color and same concept of modern image.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.345-350
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• 2002

In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• Proceedings of the Korean Society for Food Science of Animal Resources Conference
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• 2005.10a
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• pp.225-228
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• 2005

The aim of this study is to evaluate the microbial safety and physical qualities of Korean jerky, and the effect of nisin during storage. Jerky processed packages with or without nisin (100 IU or 500 IU) were stored at room temperature (25 $^{\circ}C$) for 60 days, and samples measured for quality at regular intervals throughout this storage period. In the case of 25$^{\circ}C$ storage, the number of mesophilic microorganisms in seasonedbeef packages without nisin increased markedly, but with nisin there was no observed increase. B. cereus cells showed similar trends, although coliform was not detected in all samples. At 25$^{\circ}C$ storage, changes in the cutting force of packages containing nisin showed no significant change, packages without nisin decreased markedly.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.