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Failure Modes Classification and Countermeasures of Stacked IC Packages  

Song, G.H. (Department of Industrial Engineering, Ajou University)
Jang, J.S. (Department of Industrial Engineering, Ajou University)
Publication Information
Journal of Applied Reliability / v.16, no.4, 2016 , pp. 347-355 More about this Journal
Abstract
Purpose: With the advance of miniaturization of electronic products, stacked packages of high density semiconductors are commonly used. Potential failure modes and mechanisms of stacked packages are identified. Methods: Failure modes and mechanisms of thin chip stacked packages are determined through the categorization and failure analysis: delamination, non-wet, crack, ESD, EMI and the process related damages. Results: Those failure modes are not easy to find and require excessive amount time and effort for analysis and subsequent improvement. Conclusion: In this study, a method of estimating the failure rate based on the strength measurement is suggested.
Keywords
Stack IC Package; Fault Mode; System Interaction;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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