Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Effect of Test Parameter on Ball Shear Properties for BGA and Flip Chip Packages

BGA 및 Flip Chip 패키지의 볼전단 특성에 미치는 시험변수의 영향

  • 구자명 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2005.06.23
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Abstract

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

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