Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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The Characteristics of operating noises in the FBGA packages at high frequency

DRAM 패키지의 고주파 잡음 특성

  • Kim, Joon-Il (Department of Electronic Engineering, Sogang University) ;
  • Jee, Yong (Department of Electronic Engineering, Sogang University)
  • 김준일 (서강대학교 전자공학과) ;
  • 지용 (서강대학교 전자공학과)
  • Published : 2006.06.21
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Abstract

In this paper, we analyzed the FBGA packages operating in high speeds and high frequency rates for DRAM. Using 3D simulations, we could extract s-parameters of packages. We realize that the proposed FBGA package does not operate properly at 3Gbps bacause the FBGA package have delta-I noise($V_{{\Delta}I-peak}$) of 132.0mV and crosstalk of 300mV, which is 25% of the operating clock level.

Keywords