• Plant Journal
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• v.13 no.3
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• pp.30-35
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• 2017

Module can be categorized as PAS(Pre-Assembled Steel structure), PAR(Pre-Assembled pipe Rack), PAU(Pre-Assembled Unit), VAU(Vendor Assembled Unit) and VPU(Vendor Package Unit). At the stage of design and fabrication of module, the condition of land and ocean transportation is considered and these conditions are reflected on the module division design. The control of the module's center of gravity is important to transport and install modules safely and the steel structure should have the strength enough to resist the sea acceleration force during the ocean transportation. The transportation condition and the installation method influence the size and weight of module. The size and weight of module are considered for the design of module division.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.49-55
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• 2022

The design of a battery package and a BMS module for applications using seawater rechargeable batteries, which are known as next-generation energy storage devices, is proposed herein. Seawater rechargeable batteries, which are currently in the initial stage of research, comprise primarily components such as anode and cathode materials. Their application is challenging owing to their low charge capacity and limited charge/discharge voltage and current. Therefore, we design a method for packaging multiple cells and a BMS module for the safe charging and discharging of seawater rechargeable batteries. In addition, a prototype seawater rechargeable battery package and BMS module are manufactured, and their performances are verified by evaluating the prevention of overcharge, overdischarge, overcurrent, and short circuit during charging and discharging.

• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1134-1141
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• 2006

Java is platform-independent and supports uniform solutions from mobile area (J2ME) to enterprise area (J2EE), so Java is a good development tool for the environment of heterogeneous machines and distributed applications. Java applications need access control module as a Java package. In this paper, we design and implement it. Therefore Java developers can reduce development time, and system managers easily do access control work. Proposed module is based on Role-Based Access Control (RBAC) model and includes a Java package and administration tool.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.63-67
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• 2021

In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO₂) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.

• KSCI Review
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• v.2 no.1
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• pp.1-12
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• 1995

Recently, graphics by graphic terminal widely used in various fields. But, many graphic software package in our country, though has been designed in other countries and necessarily required the use of Korean alphabet in various fields, not followed the requirements. So, this research analyzed the structures of the Korean alphabet, designed the fonts on the use of Korean, developed software module on the use of Korean using the modules of Tektronix Graphic Software module(PLOT-10)and extended the already used graphic software package.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6419-6424
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• 2014

The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.05a
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• pp.36-42
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• 2001

This paper presents the operational planning systems of automated container terminals. The proposed system is composed of berth allocation module, yard planning module, resource allocation module, sequencing module, and simulation module. All the sub-modules except resource allocation module are built into integrated simulation model using simulation package AutoMod. Simulation experiments are performed according to the number of AGVs and AGV allocation policies.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.11
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• pp.5117-5122
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• 2011

In this paper, thermal analysis simulation program by taking advantage of COMSOL Multiphysics, LED Module for the production of the most preferred package type, omitting the COH Type COB Type and board simulation of the thermal analysis is in progress. LED Module that passes through the Heat-sink of the simulation results, depending on the location of the COB Type Max. Approximately $78^{\circ}C$ ~ Min. Approximately $62^{\circ}C$, COH Type the Max. Approximately $88^{\circ}C$ ~ Min. Approximately $67^{\circ}C$ has been confirmed that the temperature stability. Compared with COB Type Max. AIthough temperature difference is about $10^{\circ}C$, Min. At a temperature of about $5^{\circ}C$ confirmed to be enough to reduce the gap, LED Point confirming the results of the temperature curves for COB Type Max. Approximately $100^{\circ}C$ ~ Min. Approximately $77^{\circ}C$, COH Type the Max. Approximately $100^{\circ}C$ ~ Min. Approximately $86^{\circ}C$ temperature stability was confirmed that, COB Type COH Type, compared to approximately $10^{\circ}C$ temperature was higher.

• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.345-353
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• 2005

We proposed a new and cost-effective method fer assembling holographic pickup modules without any high resolution vision system. Assembling was accomplished by adjusting photodiode package only, leading to a low cost, holographic pickup module. Focus and tracking error signals were simply determined by comparing spot sizes and by using the 3 beam method, respectively, based on four-sectional holographic optical elements. In experiment, we assembled a hologram module and estimated performance of the proposed method fur a holographic pickup module used in compact disc system.