Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A Stacked Pad Area Array Package for 224MHz RF Transceiver Modules

224MHz RF 송수신 회로의 적층형 PAA 패키지

  • Nam, Sang-Woo (Department of Electronics Engineering, Sogang University) ;
  • Hong, Seok-Yong (Department of Electronics Engineering, Sogang University) ;
  • Jee, Yong (Department of Electronics Engineering, Sogang University)
  • 남상우 (서강대학교 전자공학과) ;
  • 홍석용 (서강대학교 전자공학과) ;
  • 지용 (서강대학교 전자공학과)
  • Published : 2000.06.01
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Abstract

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

Keywords