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http://dx.doi.org/10.5762/KAIS.2014.15.11.6419

Finite Element Analysis of an EMC Module for Selecting Epoxy  

Lee, Joon-Seong (Dept. of Mechanical System Engineering, Kyonggi University)
Hong, Hee-Rok (Dept. of Mechanical Engineering, Graduate School, Kyonggi University)
Jo, Gye-Hyeon (Dept. of Mechanical Engineering, Graduate School, Kyonggi University)
Park, Dong-Keun (Dept. of Mechanical System Engineering, Kyonggi University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.15, no.11, 2014 , pp. 6419-6424 More about this Journal
Abstract
The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.
Keywords
EMC Module; Flexural Strength; Filling Ratio; Finite Element Analysis;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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