• Journal of Mechanical Science and Technology
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• 제18권3호
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• 디자인융복합연구
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• 제16권4호
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• pp.81-98
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• 2017

이 연구는 프리저브드 플라워 패키지 디자인의 효율적 전개 여부를 평가하기 위해 조형 요소 뿐 아니라 제품 속성을 파악하여 접근하는 방향이 전제되어야 한다는 판단에서 시작되었다. 선행 연구를 기반으로 패키지 디자인의 구성 요건을 재정립하고, 제품 유형 분류 모형을 제안하였다. 패키지 디자인의 구성 원리는 6가지로 사용성, 심미성, 주목성, 독창성, 정체성, 상징성이며, 구성 요소는 크게 4가지 형태, 재질, 색상, 그래픽, 브랜드로 분류하였다. 제품 유형은 제품 정보 측면에서의 위험 지각과 제품 효익 측면에서의 사고 유형을 축으로 하여 4개 영역으로 구분하였다. 제품 유형 모형 영역별 대표 제품을 사례로 들어 패키지 디자인 구성 요소에서 발견되는 특징을 분석하여, 제품 유형에 따라 어떻게 디자인이 적용되어야 효과적이고 효율적인가에 대해 검토하였다. 이 모형에 대입해 프리저브드 플라워 패키지 디자인 전략적 방향성을 도출하였다. 최종적으로 연구용역으로 진행되어 제안된 평택시 프리저브드 플라워 브랜드 '프리저빌'의 패키지를 분석하여 한계점을 찾아보고 프리저브드 플라워라는 제품이 지향해야하는 패키지 디자인 관점을 제언하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• 한국포장학회지
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• 제27권3호
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• pp.203-210
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• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.

• 한국병원경영학회지
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• 제10권4호
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• pp.75-97
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• 2005

The research objective is to empirically investigate the compensation packages maximizing the utilities of internal customers by applying the market segmentation theory. Data was collected from four Korean hospitals in Seoul, Busan and Gyunggi-do. The research is designed to seek the compensation package maximizing the utility of doctors by mixture regression model, which has been applied as latent structure and other type of finite mixture models from various academic fields since early 1980s. The mixture regression model shows the optimal segments number and fuzzy classification for each observation by EM(expectation-maximization algorism). The finite mixture regression model is to unmix the sample, to identify the groups, and to estimate the parameters of the density function underlying the observed data within each group. The doctors were segmented into 5 groups by their preference for the compensation package. The results of this study imply that the utility of doctors increases with differentiated compensation package segmented by their preference.

• 산업공학
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• 제11권2호
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• pp.125-137
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• 1998

A new vehicle design approach coupled with an ergonomic human model was proposed in the study. The seating package layout of a vehicle is very important to the driving comfort, and it has been one of the primary ergonomic research areas since the past 30 years. The diverse and interrelated design factors of seating package layout in the limited workspace make designers often neglect many parameters related with drivers which differ in their anthropometric characteristics. It is due to the lack of the proper tools by which the designer can easily apply several ergonomic design guidelines to the vehicle design. In this study. an iterative package layout procedure was developed, and the effectiveness of an ergonomic human model was examined in this procedure. A discomfort function was developed for the quantitative evaluation of the driving posture. This study clearly demonstrates that the package layout using an ergonomic human model is very helpful to improve the usability and driving comfort of the drivers or passengers.

• The Journal of Asian Finance, Economics and Business
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• 제6권4호
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• pp.147-158
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• 2019

The purpose of this study is to identify differences based on demographic characteristics and travel-related characteristics: first, whether travelers used a domestic travel agency and second whether travelers purchased a full-package travel program. A sample selection probit model was used to provide simultaneous evaluation of the different characteristics of outbound travelers. The present study investigates how tourists make decisions based on two travel-pattern choices. It then goes on to explore the characteristics of outbound travelers from South Korea. The data is drawn from a nationwide survey in South Korea, and a total of 859 surveys were used for analysis. Due to the interdependent nature of the choices, a sample selection probit model was used to estimate outbound tourists' use of domestic travel agency and purchase of full travel package. Significant determinants of domestic travel agency use are identified as age, gender, marital status, party size, children, length of travel, and travel distance, while those of full travel package purchase are age, marital status, and travel purpose. Estimated results provide manifestations of differing travel needs of outbound travelers. the results of this study demonstrate differences between travel-agency users and full-package travel-program consumers and provide determinants that affect the purchase of full-package travel.

• 한국정밀공학회지
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• 제15권1호
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of electromagnetic engineering and science
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• 제11권1호
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• pp.62-69
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• 2011

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).