[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.5515/JKIEES.2011.11.1.062

Electrical Parameter Extraction of High Performance Package Using PEEC Method

Pu, Bo (Department of Electrical and Electronics Engineering, Sungkyunkwan University)
Lee, Jung-Sang (Department of Electrical and Electronics Engineering, Sungkyunkwan University)
Nah, Wan-Soo (Department of Electrical and Electronics Engineering, Sungkyunkwan University)

Publication Information

Journal of electromagnetic engineering and science / v.11, no.1, 2011 , pp. 62-69 More about this Journal

Abstract

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

Keywords

Electrical Characterization; Equivalent Model; Interconnect; Package; Partial Element Equivalent Circuit;

Citations & Related Records

Reference

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