• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Asian-Australasian Journal of Animal Sciences
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• v.16 no.11
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• pp.1695-1700
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• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.667-668
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• 2010

• Nuclear Engineering and Technology
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• v.30 no.5
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• pp.462-469
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• 1998

A package to transport high-level radioactive materials is required to withstand normal transport and hypothetical accident conditions pursuant to the IAEA and domestic regulations. The package should maintain the structural safety not to release radioactive material in any condition. The structural safety of the package has been evaluated by tests using proto-type or scaled-down models, however, the method by analysis is gradually utilized due to recent advancement of computers and computer codes. In this paper, to evaluate the structural safety of a radioisotope package of the KAERI, the three dimensional impact analyses under 9m free drop and 1m puncture were performed with an explicit finite-element code, the LS-DYNA3D code. The maximum stress intensity on each part was calculated and the structural safety of the package was evaluated in accordance with the regulations.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.29 no.1
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• pp.135-142
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• 2006

The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.19-26
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• 2004

High performance packages must provide excellent transmission characteristics. In face-up ceramic packages, however, parasitic characteristics of bondwires are not negligible at millimeter-wave frequencies. Consequently, the electrical performance of ceramic packages is degraded. In をis paper, we propose a new millimeter-wave ceramic package feed-through having Embedded Metal Sheets (EMS). The package that contains double-bondwire interconnections is analyzed by the FEM (Finite Element Method) and measured from 20 to 50GHz. As a result, the proposed package having Embedded Metal Sheets (EMS) achieved 0.85dB, 0.4dB insertion loss improvement on the conventional and the double bondwires buried in epoxy ( $\varepsilon_{{\gamma}}$/ = 4) ceramic package respectively to 47GHz. This improved ceramic package will be useful for MMICs modules and small ceramic packages developments.amic packages developments.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.139-149
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• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• Journal of electromagnetic engineering and science
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• v.11 no.1
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• pp.62-69
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• 2011

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

• Journal of the East Asian Society of Dietary Life
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• v.13 no.6
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• pp.615-623
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• 2003

This study has been conducted to develop brown stock with the high pressure cooking(HPC) method. The sterilization methods, package film and storage methods, and quality maintenance during storage were investigated in this study. The packaging quality of NY/PP was inferior to that of PE/AL/PP since NY/PP facilitated the ventilation and moisture absorption. The maximum duration of the safe storage was found to be 50 days at 25$^{\circ}C$, 30 days at 35$^{\circ}C$ for NY/PP package film, and 60 days at 25$^{\circ}C$, 40 days at 35$^{\circ}C$ for PE/AL/PP one. These results showed that the overall quality of brown stock by the HPC method was not different significantly from that of brown stock by the traditional approach. Furthermore, the HPC approach might improve the productivity by saving the labour cost, food cost, and cooking time. Therefore, the traditional method might well be substituted by this newly developed method.