• 한국군사과학기술학회지
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• 제20권4호
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• pp.566-578
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• 2017

For optimizing the operation plan when strike packages attack multiple targets, this article suggests a new mathematical model and a parallel hybrid genetic algorithm (PHGA) as a solution methodology. In the model, a package can assault multiple targets on a sortie and permitted the use of mixed munitions for a target. Furthermore, because the survival probability of a package depends on a flight route, it is formulated as a mixed integer programming which is synthesized the models for vehicle routing and weapon-target assignment. The hybrid strategy of the solution method (PHGA) is also implemented by the separation of functions of a GA and an exact solution method using ILOG CPLEX. The GA searches the flight routes of packages, and CPLEX assigns the munitions of a package to the targets on its way. The parallelism enhances the likelihood seeking the optimal solution via the collaboration among the HGAs.

• 한국축산식품학회지
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• 제33권1호
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• pp.31-38
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• 2013

If the time-temperature indicator (TTI) experienced a different temperature than the accompanied packaged food, influenced by heat transfer between the TTI, package, and ambient air, TTI would incorrectly predict the food quality changes with temperature. Temperature distributions of a finite slab with different sizes, representing beef packaged with TTI, were estimated by the finite element method (FEM). The thermal properties of the beef and TTI, such as heat capacity, density, and heat conductivity, were estimated from the relevant equations using their chemical compositions. The FEM simulations were performed for three cases: different locations of TTIs on the beef, different thicknesses of beef, and non-isothermal conditions of ambient air. The TTIs were mounted in four different locations on the beef. There was little difference in temperature between four locations of the TTI on the package surface. As the thickness of the slab increased, the temperature of the TTI changed faster, followed by the corner surface, as well as middle and bottom parts, indicating the possible error for temperature agreement between the TTI and the slab. Consequently, it was found that any place on the package could be selected for TTI attachment, but the package size should carefully be determined within a tolerable error of temperature.

• Safety and Health at Work
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• 제13권2호
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• pp.235-239
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• 2022

Background: The purpose of present study was to determine the effectiveness of training program based on job stress management in NEDSA and line staff. Methods: The study method of this study was quantitative and quasi-experimental research Methods: From the statistical population (all employees of the NEDSA and line staff in 2020-2021), 30 of these people were selected by judgmental sampling method and considering the inclusion and exclusion criteria. The participants were first matched based on age and education and were randomly divided into experimental and control groups. First, pre-test was taken from both groups (Job Stress Questionnaire). The experimental group was presented with a job stress management training package and no protocol was presented in the control group. After the sessions, post-test was received from both groups (experimental and control). After two months, a follow-up test was performed. Results: The results were entered into SPSS-24 software and analyzed. The results of repeated measure showed high effectiveness of the job stress management package (researcher-made). The results showed that the job stress management training package showed 67.5% effectiveness and also the training effect of job stress management training was stable for two months (follow-up). Conclusion: Based on these results, Training program based on stress management can be effective in military staff.

• 대한산업공학회지
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• 제41권3호
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• pp.267-274
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• 2015

In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

• 토지주택연구
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• 제11권1호
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• pp.95-101
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• 2020

In the past few decades, the global population growth and rapid economic development have resulted in significant increases in building energy consumption. To reduce greenhouse-gas emissions and building energy consumption, building materials and energy technologies must be optimized. Building retrofitting is a more efficient method than reconstruction to improve the building energy performance. In order to improve the energy performance of existing buildings, this study proposed energy-efficiency retrofit plans and derived cost-effective retrofit plan. The energy efficient retrofit method is achieved through the packaging of energy technology and the energy and cost reduction effect of the energy efficiency retrofit package are analyzed. As a result of the study, the energy-efficiency retrofit package showed an energy reduction effect of up to 60% or more and a construction cost reduction of about 30%. This study argues that optimal energy and construction cost reduction of existing buildings are possible through the packaging of energy efficiency technology.

• 마이크로전자및패키징학회지
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• 제25권1호
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• pp.17-22
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• 2018

본 논문에서는 임베딩 패키지의 솔더 조인트 신뢰성에 미치는 솔더 조인트의 에이징 효과를 유한요소법에 의한 수치해석을 통해 연구하였다. SAC305 솔더 조인트의 에이징 시간은 0, 60, 180 일이 적용되었고 신뢰성 분석을 위해 패키지 휨, ECS(Equivalent Creep Strain) 및 TSED(Total Strain Energy Density)이 분석되었다. 연구결과에 따르면 임베딩 패키지의 휨이 비임베딩 패키지에 비해 감소하여 임베딩 패키지내 솔더 접합부의 신뢰성이 높을 것으로 예측되었다. 또한, 에이징 시간이 길수록 임베디드 패키지의 휨이 감소하지만 솔더 조인트의 신뢰성 수명도 감소할 것으로 분석되었다.

• 동아시아식생활학회지
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• 제26권4호
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• pp.346-358
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• 2016

Local food reflects the identity and image of a specific region. It is also a core element for determining tourists' experience of a region. The purpose of the present study was to develop a Jeju food tour package using local foods and estimate the economic value of the suggested tour package using Contingent Valuation Method (CVM). Five food tour packages were developed by researchers. In order to modify and measure the value of each package, an expert panel survey was conducted, and 'package 5' was selected as a food tour scenario for the tourist survey. A survey was conducted on 295 domestic tourists who visited Jeju within the past 10 years in order to evaluate the economic value and feasibility of the Jeju food tour package. A total fo 72.9% of respondents answered that they were willing to pay for the Jeju local food tour, and the willingness to pay (WTP) range was between ￦45,000 and ￦105,000. The primary factors correlated with WTP was food expenses, followed by leisure experience expenses, interest in local foods, education level, visit frequency and age. The WTP of the Jeju local food tour was calculated with the significantly affected factors using stepwise regression model. The result of the present study reveal that tourists' WTP increased with higher food expenses, education level, and age group. The average value of food expenses, education level, and age were substituted into the formula derived from the regression analysis, yielding 58,385.752 KRW as the WTP. The expected economic value created by exploiting the Jeju local food tour was shown to be 700 billion KRW per year, calculated by multiplying WTP of the food tour packages by the number of tourists. This study examined the feasibility and plan of the food tour package to increase the economic value of Jeju local food. In the case of the culinary tour program based on Jeju local food launching, the estimated economic effect was great. Therefore, in-depth research to merchandise the Jeju local food tour program is needed.

• 한국인쇄학회지
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• 제23권1호
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• pp.65-75
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• 2005

An accurate characterization of the display device is essential for better color matching. The calibration and characterization process in display device is needed to transform the device dependent color to the device independent color. The process of characterization performs a linearization and transforms the linearized values into the CIE XYZ tristimulus values. The purposes of this paper is to propose optimal color transformation method for accurate reproduction of original copy in display device and to explain the propriety of transformation method using specific variable for the power of gradation expression.

• 한국생산제조학회지
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• 제23권3호
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• 전자공학회논문지A
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• 제32A권12호
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• pp.184-197
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• 1995

In this paper, high speed IC package-to-package interconnections are modeled as lossless multiconductor transmission lines operating in the TEM mode. And, three mathematical algorithms for computing electrical parameters of the lossless multiconductor transmission lines are described. A semi-analytic Green's function method is used in computing per unit length capacitance and inductance matrices, a matrix square root algorithm based on the QR algorithm is used in computing a characteristic impedance matrix, and a matrix algorithm based on the theory of M-matrix is used in computing a diagonally matched load impedance matrix. These algorithms are implemented in a computer program DIME (DIagonally Matched Load Impedance Extractor) which computes electrical parameters of the lossless multiconductor transmission lines. Also, to illustrate the concept of design database for high speed IC package-to-package interconnection, a database for the multi conductor strip transmission lines system is constructed. This database is constructed with a sufficiently small number of nodes using the multi-dimensional cubic spline interpolation algorithm. The maximum interpolation error for diagonally matched load impedance matrix extraction from the database is 1.3 %.