• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 1999년도 하계종합학술대회 논문집
• /
• pp.389-392
• /
• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• 마이크로전자및패키징학회지
• /
• 제28권4호
• /
• pp.31-39
• /
• 2021

본 논문에서는 FEM(유한요소법)을 사용하여 PoP (Package on Package)용 PCB를 unit(유닛)과 substrate(서브스트레이트)로 분리한 warpage 해석과 warpage에 미치는 층별 두께의 영향도 분석과 층별 두께 조건을 다구찌법에 의한 SN비(Signal-to-Noise ratio)로 분석하였다. 해석 결과에 의하면 유닛 PCB는 회로층의 영향이 대단히 높았는데 특히 외층의 영향도가 높았다. 반면에 서브스트레이트 PCB는 회로층의 영향도가 높았으나 유닛 PCB에 비해 상대적으로 낮았으며 오히려 솔더 레지스트의 영향도가 증가하였다. 따라서 유닛 PCB와 서브스트레이트 PCB를 동시에 고려하여 PoP PCB의 층별 구조는 외부와 내부 회로층은 두껍게, 윗면 솔더 레지스트는 얇게 설계하고 바닥면 솔더 레지스트의 두께를 5 ㎛와 25 ㎛ 사이의 두께를 선정하는 바람직하다.

• Asian-Australasian Journal of Animal Sciences
• /
• 제16권11호
• /
• pp.1695-1700
• /
• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2010년도 춘계학술대회 논문집
• /
• pp.667-668
• /
• 2010

• Nuclear Engineering and Technology
• /
• 제30권5호
• /
• pp.462-469
• /
• 1998

A package to transport high-level radioactive materials is required to withstand normal transport and hypothetical accident conditions pursuant to the IAEA and domestic regulations. The package should maintain the structural safety not to release radioactive material in any condition. The structural safety of the package has been evaluated by tests using proto-type or scaled-down models, however, the method by analysis is gradually utilized due to recent advancement of computers and computer codes. In this paper, to evaluate the structural safety of a radioisotope package of the KAERI, the three dimensional impact analyses under 9m free drop and 1m puncture were performed with an explicit finite-element code, the LS-DYNA3D code. The maximum stress intensity on each part was calculated and the structural safety of the package was evaluated in accordance with the regulations.

• 산업경영시스템학회지
• /
• 제29권1호
• /
• pp.135-142
• /
• 2006

The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

• 대한전자공학회논문지TC
• /
• 제41권8호
• /
• pp.19-26
• /
• 2004

패키지는 전기적인 특성에 있어서 우수한 고주파 전송 특성을 지녀야한다. 그러나 집적회로면이 위로 향하는 세라믹 패키지(Face-up Package)는 본드와이어 연결 시 고주파의 기생 특성이 크게 증가하여 시스템 전체의 성능에 큰 제한을 가져온다. 본 논문에서는 향상된 정합특성을 갖는 새로운 밀리미터파 세라믹 패키지 급전구조를 제안하였고, 유한요소법(FEM: Finite Element Method)을 이용하여 20 ∼ 50 GHz에서 해석 및 설계를 하고 제작하였다. 측정 결과, 삽입된 금속판 (Embedded Metal Sheet)을 가지는 세라믹 패키지 급전구조는 47GHz까지 기존의 세라믹 패키지보다 0.85dB 그리고 본드와이어 부분에 일반적인 에폭시( ε/sub γ/ = 4)를 사용하여 몰딩한 세라믹 패키지보다 0.4dB가 개선된 삽입손실의 특성을 얻을 수 있었다. 따라서 본 해석결과는 소형의 세라믹 패키지 및 MMIC(Monolithic Microwave Integrated Circuit) 모듈 개발에 효과적으로 활용될 수 있으리라 기대된다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제12권2호
• /
• pp.139-149
• /
• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• Journal of electromagnetic engineering and science
• /
• 제11권1호
• /
• pp.62-69
• /
• 2011

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

• 동아시아식생활학회지
• /
• 제13권6호
• /
• pp.615-623
• /
• 2003

This study has been conducted to develop brown stock with the high pressure cooking(HPC) method. The sterilization methods, package film and storage methods, and quality maintenance during storage were investigated in this study. The packaging quality of NY/PP was inferior to that of PE/AL/PP since NY/PP facilitated the ventilation and moisture absorption. The maximum duration of the safe storage was found to be 50 days at 25$^{\circ}C$, 30 days at 35$^{\circ}C$ for NY/PP package film, and 60 days at 25$^{\circ}C$, 40 days at 35$^{\circ}C$ for PE/AL/PP one. These results showed that the overall quality of brown stock by the HPC method was not different significantly from that of brown stock by the traditional approach. Furthermore, the HPC approach might improve the productivity by saving the labour cost, food cost, and cooking time. Therefore, the traditional method might well be substituted by this newly developed method.