• Journal of electromagnetic engineering and science
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• v.10 no.3
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• pp.158-165
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• 2010

This study reviewed terahertz technologies of time domain spectroscopy, T-ray imaging, and high rate wireless data transfer. The main topics of the terahertz research area were investigation of materials and package modules for terahertz wave generation and detection, and setup of the terahertz system for time domain spectroscopy(TDS), T-ray imaging and sub-THz wireless communication. In addition to Poly-GaAs film as a photoconductive switching antenna material, a table-top scale for the THz-TDS/imaging system and terahertz continuous wave(CW) generation systems for sub-THz data transfer and narrow band T-ray imaging were designed. Dielectric properties of ferroelectric BSTO($Ba_xSr_{1-x}TiO_3$) films and chalcogenide glass systems were characterized with the THz-TDS system at the THz frequency range. Package modules for terahertz wave transmitter/receiver(Tx/Rx) photoconductive antenna were developed.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.6
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• pp.431-438
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• 2016

Recently, concerns about the environment are becoming more important because of global warming and the exhaustion of earth's resources. In the aviation and automobile industries, the application of light materials is increasingly important for eco-friendly and effective. Carbon Fiber Reinforced Plastics is a composite material which great formability and the high strength of carbon fiber. CFRP, which is both light and strong, is hard to manufacture. In addition, CFRP machining has a high chance of defects. This research discusses the development of a manufacturing system package for CFRP machining. It involving CFRP Drilling/Water-jet Manufacturing Machines, Inspection/Post-processing Systems, CNC platform for an EtherCAT servo Communication, Flexible Manufacturing Systems and CFRP machining Processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.305-308
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• 2006

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

• Composites Research
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• v.25 no.6
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• pp.211-216
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• 2012

FBG sensor peaks could be split due to polarization by shear strain, when the fiber optic sensors embedded or attached to the structure. For the fiber optic sensor packages, sensor grating has to be protected from shear strains. Also, pretension has to be applied to the sensor because compressive strain must be measured. Without pretension of sensor, the sensor does not show any change of signal until it is stretched. In order to mesure compressive and tensile strains, two fixing point and prestressed sensor need. In the fixing point, just holding the optical fiber cause slip between core and cladding in the fiber. A Fixation method of prestressed FBG sensors fixed with partially stripped fibers was developed. The sensor package has the prestress controllable fixtures at the fixing points. Prestress to the sensor imposed by controlling the two fixed points with bolts and nuts make it easy to measure compressive strain as well as tensile strain. The fiber optic sensor packages applied to the actual structure and the structural monitoring system using the package can be applied to safety through surveillance.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1644-1652
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• 2003

The monitor product is packed by cushioning materials because the monitor can be broken during transportation. However, the addition of the cushioning material increased the volume of the product. Therefore, it is required that the usage of cushioning material be minimized. In practice, design engineers have followed the ad hoc design with experiences of predecessors. Automation of the design process is very important for the reduction of engineering cost, and can be achieved by an excellent design process and software development. According to Axiomatic design, a design flow is defined and a software system is developed for automated design. At first, a basic model is defined. A user can modify the model from menus and design is carried out according to the input from the user. Finite element models are automatically generated based on the design. A nonlinear finite element analysis program called LS/DYNA3D is linked for the impact analysis. The process of Design of Experiments using orthogonal array is installed to minimize the maximum acceleration in drop test. Therefore, a new design can be proposed by the system. The program is designed according to the Independence Axiom of Axiomatic design. FRs and DPs of the software system are defined and decomposed by zigzagging process. Independent modules can be generated by analysis of the full design matrix and each module is coded as class in Object Oriented Programming (OOP). Design results are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.65-69
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• 2008

This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.75-79
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• 2013

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.