Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)

The Korean Society of Mechanical Engineers (대한기계학회)
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Numerical Simulation of Heat Transfer in Chip-in-Board Package

Chip-in-Board 패키지의 열전달 해석

  • Park, Joon Hyoung (Graduate School of NID Fusion Technology, SeoulTech.) ;
  • Shim, Hee Soo (Dept. of Machinery System Design Engineering, Seoul Nat'l Univ. of Sci. and Tech.) ;
  • Kim, Sun Kyoung (Dept. of Machinery System Design Engineering, Seoul Nat'l Univ. of Sci. and Tech.)
  • 박준형 (서울과학기술대학교 나노 IT 융합프로그램) ;
  • 심희수 (서울과학기술대학교대학교 기계시스템디자인공학과) ;
  • 김선경 (서울과학기술대학교대학교 기계시스템디자인공학과)
  • Received : 2012.05.16
  • Accepted : 2012.10.12
  • Published : 2013.01.01
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Abstract

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

반도체 수요의 폭발적인 증가와 기술의 진보로 단위면적당 소자수가 늘어나고 있다. 그에 따라 단위면적당 발열량이 더욱 높아져서 반도체의 수명과 신뢰성 보장을 위한 냉각문제의 해결이 점점 중요해지고 있다. 특히, 집적도를 높이기 위해 소자를 기판에 매립하는 chip-in-board (CIB) 패키지에서는 방열이 더욱 심각한 문제가 된다. 본 논문에서는 각기 다른 재질의 층으로 구성된 열 전달모형을 설정하고, 3 차원 열 전달 해석으로 적절한 경계 조건에 맞추어 계산하였다. 이를 토대로 발열량을 정량적으로 예측하여 실제모델에 적용 될 수 있는 설계자료로 이용하고자 한다.

Keywords

References

  1. Chang, B.H., 2011, "Natural Convection Heat Transfer in Inclined Rectangular Enclosures," Journal of Energy Engineering, Vol. 20, No. 1, pp. 44-53. https://doi.org/10.5855/ENERGY.2011.20.1.044
  2. Kim, Y.S., Lee, J.G., Chung, D.H. and Ko, H.S., 2003, "Analysis of Thermal Distribution for LCD-TV Using Numerical Simulation and Experiment," Proceedings of the KSME 2003 Fall Annual Meeting, pp. 302-307.
  3. Kwak, H.S., Lee, S.E., Park, K.S. and Kim, K., 2009, "A Computational Study on Free Convection for Thermal Performance Evaluation of a SWNT Thin- Film Heater," Korean Society of Computational Fluids Engineering, pp. 315-320.
  4. Lee, G.H., Yoo, D.W. and An, S.B., 2009, "Simulation by Utilize," GI JEON, Seoul, pp. 185-380.
  5. Kim, S.K., Lee, J.K. and Cha, D.H,. 2011, "Heat Transfer Deformation Analysis of Flip Chip Bonder," 2011 Trans. Korean Soc. Mech. Eng. A, pp. 461-462.
  6. Kim, H.K. and Oh, S.I., 1996, "Evaluation of Heat Transfer Coefficient Distribution by Inverse Analysis," Trans. Korean Soc. Mech. Eng., Vol.20, No.12, pp. 3856-3870.