• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1049-1056
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• 2014

Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.41-47
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• 2016

This paper provides an overview of kimchi packaging technology, focusing on packaging materials, package design, and active/intelligent packaging technology for kimchi. From a packaging-material standpoint, although various materials have been used to ensure customer satisfaction and convenience, plastic is the most widely used material, in the form of bags, trays, pouches, and rigid containers. Additionally, recent efforts in the kimchi packaging industry have allowed companies to differentiate their products by using different packaging materials and technologies, while simultaneously improving product safety and quality. On the other hand, the biggest problem in kimchi packaging is excess $CO_2$ production, leading to package expansion and leakage. To alleviate this problem, the use of $CO_2$ absorbers, high $CO_2$-permeable films, and degassing valves, in addition to the use of different packaging systems, has been investigated. Active and/or intelligent packaging systems have been developed, to include active functions beyond simply inert, passive containment and protection of the kimchi product. However, most such approaches are not yet adequately effective to be useful on a commercial scale. Therefore, further studies are needed to resolve the limitations of each technology.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.8
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• pp.654-659
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• 2008

This paper is to suggest a concept design of the permanent magnet type magnetic resonance imaging (MRI) device based on the parameter optimization method. Pulse currents in the gradient coils will introduce the effect of eddy currents in the ferromagnetic material, which will worsen the quality of imaging. In order to equalize the magnetic flux in the MRI device for good imaging, the eddy current effect in the ferromagnetic material must be taken into account. This study attempts to use the design of experiment (DOE) and the response surface method (RSM) for equalizing the magnetic flux of the permanent magnet type MRI device using that the magnetic flux can be calculated directly using a commercial finite element analysis package. As a result, optimal shapes of the pole and the yoke of the PM type MRI device can be obtained. The commercial package, ANSYS, is used for analyzing the magnetic field problem and obtaining the resultant magnetic flux.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.2
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• Composites Research
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• v.12 no.5
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• pp.87-97
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• 1999

A clad material is a different type of the typical composites which are composed of two or more matericals joined at their interface surface. The advantge of cald material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneously. This paper is concerned with the direct and indirect extrusion processes of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copperclad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and mean stress for sheath thicknesses, die exit diameters and die temperatures.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• Bulletin of the Society of Naval Architects of Korea
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• v.30 no.2
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• pp.44-52
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• 1993

선박에 있어서 철의장품은 종류와 수량이 다양하고 형상이 불규칙하여 대부분의 사업장에서 설계 전산화가 이루어지지 못하고 있는 실정이다. 의장설계실에서는 이를 전산화하기 위하여 먼저 철의장품의 표준을 제정 및 극대화하고 설계작업절차와 물량의 흐름을 전산과 연계하여 체계화 및 표준화하였다. 또한 선박의 전구역에 설치되는 철의장품들을 관련 양식과 함께 국제표준을 근거로 BASICA CADDS, SURFACE DESING, SDDP(structural Design ＆ Detailing Package) SOFTWARE를 이용하여 2차원(2-dimension) 및 3차원(3-dimension) 데이터베이스(database)화 하였으며 이를 POP-UP MENU를 이용, 쉽게 선택함으로써 모델링(modeling) 작업시수를 대폭 감소 시켰으며, 그래픽(graphic)에서 추출한 의장품의 데이터(data)를 의장품의 표준정보 FILE과 연계하여 라벨(LABEL) 및 치수(DIMENSION)를 기입하여 배치도를 추출하고 의장품의 제작, 설치, 계산 및 관리에 소요되는 설치도, 제작도 및 관련 보고서인 BOM(bill of material), PML(pallet material list), 의장제작품 LIST, COG(center of gravity), 관리점 등을 자동추출 및 관리전산망(PC-lan)과 연계할 수 있는 DECOM(철의장 전산설계 전용 package)을 89년에 개 발하여 의장설계에 적용하여 왔으며 ORACLE사의 RDBMS(relational database management system)를 도입하여 이를 보완하므로써 정보의 일관화 및 공유화가 가능하게 되었다. 그 결과 설계 M/H절감, 생산성 향상, 자재 및 관련 정보 전달에 혁신적인 변화 향상을 가져오게 되었다.