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http://dx.doi.org/10.6117/kmeps.2022.29.4.083

Measurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensor  

Baek, Jeong-hyeon (Department of Mechanical Convergence Engineering, Hanyang University)
Park, Dong-woon (Department of Mechanical Convergence Engineering, Hanyang University)
Kim, Hak-sung (Department of Mechanical Convergence Engineering, Hanyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.4, 2022 , pp. 83-87 More about this Journal
Abstract
Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.
Keywords
EMC (Epoxy molding compound); Cure shrinkage; Gelation point; Dielectrometry; FBG (Fiber Bragg grating) sensor;
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