• The KIPS Transactions:PartD
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• v.10D no.5
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• pp.821-828
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• 2003

Package software should have the feature that enables purchasers to discriminate a product suitable for them among a number of software belonging to the similar kind of product. Purchaser's ability to choose a package software depends on whether they can judge that a package software conforms to the relevant standard through an objective quality test process and method or not. There are the standards that can be applicable to the quality evaluation of package software, such as and . This study developed a system with which purchasers can effectively select a package software suitable for their needs, building quality test process for package software and developing test metric and application method.

• Journal of Software Assessment and Valuation
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• v.17 no.1
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• pp.11-16
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• 2021

The importance of software is increasing due to the development of information and communication, and software copyright disputes are also increasing. In this paper, the source of the submitted programs and the files necessary for the execution of the program were taken as the scope of analysis. The large-capacity file transfer solution program to be analyzed provides additional functions such as confidentiality, integrity, user authentication, and non-repudiation functions through digital signature and encryption of data.In this paper, we analyze the program A, program B, and the program C. In order to calculate the program similarity rate, the following contents are analyzed. Analyze the similarity of the package structure, package name, source file name in each package, variable name in source file, function name, function implementation source code, and product environment variable information. It also calculates the overall similarity rate of the program. In order to check the degree of agreement between the package structure and the package name, the similarity was determined by comparing the folder structure. It also analyzes the extent to which the package structure and package name match and the extent to which the source file (class) name within each package matches.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1A
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• pp.107-112
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• 2004

We propose the optimum TO-can package design in SFF/SFP optical transceiver modules to improve 3dB-bandwidth. The frequency response of TO-38 package is measured and compared to simulation where the 3dB-bandwidth was 3.5GHz. For a higher operating bandwidth (>15GHz), the new optimized physical geometries of TO-can package such as bonding-wire, lead and material was suggested. The optimal result of simulation shows that TO-can package can be used at a higher bit rate optical module of 10Gbps.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.4
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• Proceedings of the Korea Contents Association Conference
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• 2017.05a
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• pp.453-454
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• 2017

The travellers using social media leave their location history in the form of trajectories. These trajectories can be bridged for acquiring information, required for future recommendation for the future travelers, who are new to that location, providing all sort of information. In this paper, we propose a personalized travel path recommendation scheme based on social life log. By taking advantage of two kinds of social media such as travelogue and community contributed photos, the proposed scheme can not only be personalized to user's travel interest but also be able to recommend a travel path rather than individual Points of Interest (POIs). It also maps both user's and routes' textual descriptions to the topical package space to get user topical package model and route topical package model (i.e., topical interest, cost, time and season).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.973-977
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• 2010

The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

• Journal of the East Asian Society of Dietary Life
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• v.6 no.3
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• pp.335-344
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• 1996

This study was to investigate consumer recognition on food label of food package. The results of this study were as follows: 1. when shopping for food, the items considered the most were taste of family, food safety, nutrition and price, respectively. 2. 95.5% of respondents confirmed of the food label of food package when shopping for food. The items confirmed the most on food label were expiration date, manufacture date, manufacturer, food additives and nutrition, respectively. 3. 85.3% of respondents did not satisfy on the food label of food label of food package. 43.6% of respondents demanded food additives more detailed. 28.2% of respondents demanded nutrition information more detailed. 28.2% of respondents demanded food function more detailed. 4. The food which respondents satisfied on food label most were snack '||'&'||' cookies, nuddle, spices, can '||'&'||' bottled food, instant food, processed meat foo, frozen food and imported food, respectively. 5. The group with the most hphrases falling in the top rank was nutrition/calories. The phrases in the nutrition/calories group scored in the top rank were 3 "positive" nutritional characteristics(addition of vitamins, addition of DHA, high dietary fiber) and 5 "nagative" nutritional characteristics(no sugar, low sugar, low calories, low salt and low cholesterol). The group with the most phrases falling in the third rank was ingredient. The phrases in the ingredient scored in the third rank were add of food additives. 6. 55.5% of respondents did not know Recommended Daily Allowance(RDA) information and 61.9% of respondents did not understand the nutrition declaration(content) of food package but 65.7% of resspondents understood the nutrition claim of food package. From these result, respondents were more affected by nutrition claim than by nutrition declaration on food package when shopping for food.ood.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.