• 한국초전도ㆍ저온공학회논문지
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• 제20권4호
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• pp.41-45
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• 2018

We have investigated the effect of $Y_2O_3$ nanoparticles on the pinning properties of $Y_2O_3$-doped $GdBa_2Cu_3O_{7-{\delta}}$ (GdBCO) films. Both undoped and $Y_2O_3$-doped GdBCO films were grown on $CeO_2$-buffered MgO (100) single crystal substrates by pulsed laser deposition (PLD) using KrF (${\lambda}=248nm$) laser. The $Y_2O_3$ doping contents were controlled up to ~ 2.5 area% by varying the internal angles of $Y_2O_3$ sectors put on the top surface of GdBCO target. Compared with the $Gd_2O_3$-doped GdBCO films previously reported by our group [1], the $Y_2O_3$-doped GdBCO films exhibited less severe critical temperature ($T_c$) drop and thus slightly enhanced critical current densities ($J_c$) and pinning force densities ($F_p$) at 65 K for the applied field parallel to the c-axis of the GdBCO matrix (B//c) with increasing the doping content. Below 40 K, the in-field $J_c$ and $F_p$ values of all $Y_2O_3$-doped GdBCO films exhibited higher than those of undoped GdBCO film, suggesting that $Y_2O_3$ inclusions might act as effective pinning centers.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.338.2-338.2
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• 2016

Al doped ZnO (AZO) thin films were deposited on Si substrates with rod-shaped-surface by pulsed laser deposition method (PLD). Si-rods were prepared through chemical etching. To analyze the influence on the formation of the rod structure, samples with various chemical etching conditions such as AgNO3/HF ratio, etching time, and solution temperature were prepared. The morphology of Si-rod structures were examined by FE-SEM. Fig. 1 shows a typical structure of n-AZO/p-Si-rod juncions. The fabricated n-AZO/p-Si-rod devices exhibited p-n diode current-voltage characteristics. We compared the I-V characteristics of n-AZO/p-Si-rod devices with the samples without Si-rod structure.

• 한국재료학회지
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• 제18권10호
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• pp.552-556
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• 2008

Modified thermal annealing was applied to the activation of the polycrystalline silicon films doped as p-type through implantation of $B_2H_6$. The statistical design of experiments was successfully employed to investigate the effect of rapid thermal annealing on activation of polycrystalline Si doped as p-type. In this design, the input variables are furnace temperature, power of halogen lamps, and alternating magnetic field. The degree of ion activation was evaluated as a function of processing variables, using Hall effect measurements and Raman spectroscopy. The main effects were estimated to be furnace temperature and RTA power in increasing conductivity, explained by recrystallization of doped ions and change of an amorphous Si into a crystalline Si lattice. The ion activation using rapid thermal annealing is proven to be a highly efficient process in low temperature polycrystalline Si technology.

• 한국광학회지
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• 제3권1호
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• pp.50-54
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• 1992

마스크를 사용하지 않고 레이저 $(CW Ar^+$ laser, $\lambda=514.5nm)$ 광속을 이용하여 불산 용액이 첨가된 황산구리 전해질 용액내의 실리콘(Si, 100) 단결정 표면에 구리를 침착시켰으며, 이들 사이에서 일어나는 화학 반응식을 도금에서와 같이 양극 반응과 음극 반응으로 구분 하여 제안하였다. 또한 침착 되는 구리점의 직경을 전해질 용액에 첨가되는 불산용액의 양, 레이저 광속의 조사 시간과 관속의 세기에 따라 측정 분석하였다. p형 실리콘 단결정의 경우, 연속형 $Ar^+$ 레이저를 조사하였을때 구리 침착이 일어나고 펄스형 레이저 광속(Nd:YAG 레이저에 KDP결정을 사용하여 얻은 2차 고조파, $\lambda=530nm, $\tau=25nsce$)을 조사하였을 경우에는 침착이 일어나지 않았다. 그와는 반대로 n형 실리콘 단결정의 경우, 연속형 $Ar^+$ 레이저를 조사하였을 때는 구리 침착이 일어나지 않았으나, 펄스형 레이저 광속을 조사시켰을 경우에는 구리 침착이 일어남을 관찰하였다.

• Korean Chemical Engineering Research
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• 제49권3호
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• pp.357-360
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• 2011

플라즈마 원자층증착 방법을 이용하여 질소를 도핑한 산화아연 나노박막을 Si(111) 기판에 제조하였다. $Zn(C_{2}H_{5})_{2}$, $O_{2}$ 및 $N_{2}$을 사용하여 rf 파워 세기를 50-300 W로 변화시키면서 N-doped ZnO 박막을 제조하였다. 박막의 구조적 광학적 전기적 특성을 각각 XRD, PL, Hall 효과를 측정하여 분석하였다. 플라즈마 rf 파워가 증가함에 따라 ZnO 나노 박막 내의 질소(N) 함유 농도가 높아지고, p형 ZnO의 특성을 보였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.43-46
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• 2002

Ferroelectric Mg-doped SBT and Ti-doped SBT were successfully deposited on Pt/Ti/$SiO_2/Si$ substrate by using a sol-gel solution coating method. The solutions were prepared through out adding the metal alkoxide solutions to SBT solution. The typical hysteresis loop of the films was obtained at 5V. The measured $2P_r$ value were $16.50{\mu}C/cm^2$ for SBT, $18.98{\mu}C/cm^2$ and for Mg-doped SBT, and $17.10{\mu}C/cm^2$ for Ti-doped SBT at an applied voltage of 5V, respectively. And it is found that the leakage current densities are less than $10^{-7}A/cm^2$ when applied voltage is less than 10.8MV/cm, which indicates the excellent insulating characteristics.

• Journal of the Optical Society of Korea
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• 제17권2호
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• pp.182-187
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• 2013

We present a comparative experimental analysis of the thermal spectroscopic characteristics of a phosphosilicate (P)-based ytterbium-doped fiber (YDF) against an aluminosilicate (Al)-based YDF in the temperature range of 25 to $150^{\circ}C$. We also characterize the fibers as gain media in a cladding-pumped amplifier configuration. While both fibers exhibit comparable trends in their thermal characteristics, there are noticeable distinctions in the fluorescence lifetime reduction rate and the spectral dependence of the transition cross-sections. The P- and Al-based YDFs present thermal lifetime reduction rates of $0.012%/^{\circ}C$ and $0.026%/^{\circ}C$, respectively. In particular, in the spectral region at ~940 nm, the absorption cross-section of the P-based YDF undergoes significantly less thermal change compared to that of the Al-YDF. In the cladding-pumped amplifier configuration operating at a total gain of 10 dB, the Al-based YDF generally performs betters than the P-based YDF in the temperature range of 25 to $75^{\circ}C$. However, it is highlighted that in the high temperature range of over $75^{\circ}C$, the latter shows a less gain reduction rate than the former, thereby yielding higher relative output power by 3.3% for a 1060-nm signal, for example.

• 전자공학회논문지D
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• 제36D권4호
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• pp.86-92
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• 1999

SiGe을 이용한 p형 전계 효과 트랜지스터의 전류 구동 능력 향상을 위하여 이중 δ도핑층을 이용한 MESFET을 설계하고 시뮬레이션을 통하여 전기적 특성의 개선을 확인하였다. 두 δ도핑층 사이의 도핑 농도가 낮은 분리층에 SiGe층을 위치시키면 양자 우물이 형성되어 δ도핑층에서 넘쳐 나온 정공이 Si 채널의 경우보다 더 많아져 전류 구동 능력이 크게 향상된다. δ도핑층 사이의 SiGe층의 두께는 0∼300Å, Ge 구성비는 0∼30%의 범위에서 변화시켜 SiGe 두께 200Å, Ge 구성비 30%일 때 이중 δ도핑 Si 채널 MESFET에 비해 최대 45% 이상 개선될 수 있음을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1622-1624
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• 2007

In order to realize effective p-type doping in ZnO thin films, ZnO films were deposited on P-doped Silayers by RF-magnetron sputter deposition technique and annealed at various temperatures. The result indicated that ZnO film annealed at $700^{\circ}C$ showed p-type conduction with a high carrier concentration in the order of $10^{19}\;cm^{-3}$.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권1호
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• pp.16-21
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• 2006

A simple doping method to fabricate a very thin channel body of the p-type FinFETs with a 20 nm gate length by solid-phase-diffusion (SPD) process was developed. Using the poly-boron-films (PBF) as a novel diffusion source of boron and the rapid thermal annealing (RTA), the p-type sourcedrain extensions of the FinFET devices with a threedimensional structure were doped. The junction properties of boron doped regions were investigated by using the $p^+-n$ junction diodes which showed excellent electrical characteristics. Single channel and multi-channel p-type FinFET devices with a gate length of 20-100 nm was fabricated by boron diffusion process using PBF and revealed superior device scalability.