• Journal of the Korean Institute of Telematics and Electronics
• /
• v.24 no.2
• /
• pp.260-264
• /
• 1987

We examine the effect of junction depth on the charge density solving numerically the general form of Poisson's equation for Gaussian $n^{+}$-p junctions. We also present an analytical model for the charge diopole due to the variation of the dielectric constant with doping.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.19 no.6
• /
• pp.52-54
• /
• 1982

p·Si-전해질 접합을 전해질로 6N H2SO4, 6N H2SO4(Ti3+), 6N H2SO4(Ti4+), 6N H2SO4(Ti4+/Ti3+)을 사용하여 만들었다. 이들 전해질중 6N H2SO4(Ti4-/Ti3+)을 사용할 때 p·Si 광음극이 안정하게 동학하며 높은 광전 감도를 가지고 있었다. p·Si-electrolyte junction are prepared by using p·Si photocatode in four different electrolytes such as 6N H2SO4, 6N H2SO4(Ti3+), 6N H2SO4(Ti4+), 6N H2SO4(Ti4+/Ti3+) respectively. Among those electrolytes 6N H2SO4(Ti4-/Ti3+) shows very good results, in which p·Si photocathode is stable.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.27 no.9
• /
• pp.1409-1418
• /
• 1990

Characteristics of NMOS transistors with phosphorus source/drain junctions formed by two-step rapid thermal diffusion (RTD) process using a solid diffusion source have been investigated. Phosphorus profiles after RTD were measured by SIMS analysis. In the case of 1100\ulcorner, 10sec RTD of, P, the specific contact resistance of n+ Si-Al was 2.4x10**-7 \ulcorner-cm\ulcorner which is 1/5 of the As junction The comparison fo P junction devices formed by RTD and conventional As junction devices shows that both short channel effect and hot carrier effect of P junction devices are smaller than those of As junction devices when the devices have same junction depths. P junction device had maximum of 0.4 times lower Isub/Id than As junction device. Characteristics of P junction formed by several different RTD conditions have been compared and 1000\ulcorner RTD sample had the smaller hot carrier generation. Also, it has been shown that the hot carrier generation can be futher reduced by forming the P junctions by 3-step RTD which has RTO-driven-in process additionally.

• Journal of Information Display
• /
• v.8 no.2
• /
• pp.20-24
• /
• 2007

Efficient white organic light-emitting diodes are fabricated with the blue and red electroluminescent (EL) units electrically connected in a stacked tandem structure by using a transparent doped organic p/n junction. The blue and red EL units consist of the light-emitting layer of 1,4-bis(2,2-diphenyl vinyl)benzene (DPVBi) and 4-dicyanomethylene-2-methyl-6-[2-(2,3,6,7-tetrahydro-1H,5H-benzo[i,j] quinolizin-8-yl)vinyl]-4H-pyran) (DCM2) doped tris(8-hydroxyquinoline) aluminum $(Alq_3)$, respectively. The organic p-n junction consists of ${\alpha}-NPD$ doped with $FeCl_3$ (15 % by weight ratio) and $Alq_3$ doped with Li (10 %). The EL spectra exhibit two peaks at 448 and 606 nm, resulting in white light-emission with the Commission Internationale d'Eclairage (CIE) chromaticity coordinates of (0.36, 0.24). The tandem device shows the quantum efficiency of about 2.2 % at a luminance of 100 $cd/m^2$, higher than individual blue and red EL devices.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2004.05b
• /
• pp.623-626
• /
• 2004

The purpose of this paper is to determinate and to confirm p-n junction depth with nondestructive method by using electron beam. By measuring the critical short circuit current on the p-n junction which induced by electron beam and calculating generation range, the diffusion depth can be obtained. It ran be seen that values destructively measured by constant angle lapping and nondestructively by this study almost concur. As this result, it is purposed that diffusion depth of p-n junction can be easily measured by non-destruction. And this nondestructive method ran be recommended highly to the industrial analysis.

• Journal of the Korean Vacuum Society
• /
• v.22 no.3
• /
• pp.162-167
• /
• 2013

An epitaxial layer structure for heterojunction p-InGaP/N-InAlGaP solar cell has proposed. Simulation for current density-voltage characteristics has been performed on p-InGaP/N-InAlGaP structure and the simulation results were compared with p-InGaP/p-GaAs/N-InAlGaP structure and homogeneous InGaP pn junction structure. The simulation result showed that the maximum output power and fill factor have greatly increased by replacing n-InGaP with N-InAlGaP. The thicknesses of p-InGaP and n-InAlGaP were optimized for the epitaxial layer structure of p-InGaP/N-InAlGaP.

• Proceedings of the KIEE Conference
• /
• 1987.11a
• /
• pp.248-250
• /
• 1987

Transparent CdS films with low electrical restivity on glass substrates were prepared by coating a CdS slurry which contained 10 wt.% $CdCl_2$, and sintering in a nitrogen atmosphere at $600^{\circ}C$ for 2hr. All-polycrystalline CdS/CdTe solar cells were fabricated by coating CdTe slurries, which contained 1.0 or 4.5 wt.% $CdCl_2$, on the sintered CdS films and sintering at $700^{\circ}C$ for various periods of sintering. The spectral responses of the sintered CdS/CdTe solar cells were measured and compared with theoretically calculated quantum efficiency. The spectral responses of the sintered CdS/CdTe solar cells in the short-wavelength region decreases with-increasing sintering time. The poor response in this region is attributed to the existence of the Cd-S-Te solid solution in the compositional junction. The decrease in the maximum response in the long-wavelength region as the sintering exceeds certain time appears to be caused by the increase in the depth of the buried homo junction and by the increase in the series resistance. The $CdCl_2$ in the CdTe layer during sintering enchances the interdiffusion of S, Te or donor impurities across the metallurgical Junction causing the formation of deeper n-p junction in the CdTe layer.

• Proceedings of the IEEK Conference
• /
• 2000.11b
• /
• pp.225-228
• /
• 2000

In this paper, we demonstrated an analytical description method of forward voltage drop and reverse voltage of $P^{+}N$ junction diode with <111> oriented antimony doped silicon wafer 60keV boron implantation computer simulation results. In order to make electrical activation of implanted carriers, thermal annealing are carried out by RTP method for 1min at $1000^{\circ}C$ inert gas condition.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.181-182
• /
• 2013

저온 공정을 통한 저가형의 태양전지를 만들기 위해 ALD 공정 법으로 Zinc oxide의 전도성을 조절하여 전기 증착법을 통해 성장시킨 Cuprous oxide와 p-n heterojunction을 구성하고 태양전지를 제작하였을 때 최적의 효율을 확인하였다. 전도성이 낮아질수록 전착법과의 p-n junction에서의 Jsc값이 증가하여 100도의 Zinc oxide의 경우 0.13%의 태양전지 효율을 보였다.

• Nuclear Engineering and Technology
• /
• v.5 no.1
• /
• pp.13-19
• /
• 1973

The photovoltaic and the electronvoltaic cells have been obtained by forming Sb-implanted n- on p-type and In-implanted p- on n-type silicon p-n junctions Such shallow implantations into silicon wafers due to each dopant were done by the VDH-Implanter. The two types of the silicon p-n junction for these cells have shown special features on their various characteristics to be fitted for the direct energy conversions. The results of the comparative study on both of these cells are described in this article.