• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.71-77
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• 2007

In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.5
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• pp.976-985
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• 2002

The purpose of this paper is that the roughness(Rrms = 31$\AA$, Rp-v = 270$\AA$) of ITO thin film deposited by sputtering method for OELD is improved to Rrms $\leq$ 10$\AA$, Rp-v $\leq$ 80$\AA$ by chemical mechanical polishing(CMP). First, ITO thin films are polished with a variety of consumables (Pads, Slurries) to choose proper some for the roughness improvement and the CMP mechanism of ITO thin films is demonstrated on the ground of the experiment results. Henceforth, the CMP characteristics (Removal rate, Non-uniformity) of chosen consumables are evaluated according to processing conditions (Polishing pressures, Table velocities) and suitable conditions for ITO film CMP are selected. Finally, the electrical and optical properties (Sheet resistance, Transmittance) of ITO thin films are investigated to verify whether or not ITO thin film are still suitable for OELD after polished.

• Tribology and Lubricants
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• v.27 no.2
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• pp.95-100
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• 2011

The brake disc materials for railway vehicle have been mainly used cast-iron. The brake disc and pad should be light, resist to a thermal crack and absorb enough friction energy. In order to satisfy this requirement, aluminum alloy brake disc for railway vehicle has been newly developed. The aluminum itself has not been considered the friction material for railway vehicle. However, in the case of aluminum composite with dispersed ceramic particles, friction characteristics, resistance to wear and heat are much improved. In the present study, aluminum composite brake disc of 20% ceramic particle and three kinds of organic pads have been tested in dynamometer. The results show that Al MMC brake disc and pad have good friction coefficient and wear rate, and thermal cracks in brake disc have not been initiated. Also, the Al MMC brake disc can be applied to railway vehicle of 150 km/h.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Particle and aerosol research
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• v.19 no.2
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• pp.31-42
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• 2023

The charge and magnetic characteristics of LM (Low-metallic) and NAO (Non-asbestos-organic) brake wear particles were analyzed. The ratio of charged particles from total particles is about 86% of the LM pad and about 92% of the NAO pad. Number of charge per particle from the NAO pad is also higher than that of the LM pad. The ratio of magnetic particles from total particles increases with the particle size. The ratio of magnetic particles from the LM pad is about 15% for the particles with the size of 1 ㎛, and about 74% for ones with 5 ㎛. The ratio from the NAO pad is about 5% for the particles with the size from 0.5 ㎛ to 2 ㎛, and about 80% for the particles with 5 ㎛. Through the analysis of the components of the two pads with SEM-EDS (Scanning Electron Microscopy - Energy Dispersive X-ray Spectroscopy), it was found that the LM pad was occupied with more iron fraction than the NAO pad and that PM_2.5-10 was occupied with more iron fraction than PM_2.5. The particles smaller than 10 ㎛ (i.e. PM₁₀) from the LM pad contained about 83% of charged particles, about 43% of magnetic particles, and about 93% of charged or magnetic particles. PM₁₀ from the NAO pad contained about 88% of charged particles, about 15% of magnetic particles, and about 89% of charged or magnetic particles.

• Korean Journal of Organic Agriculture
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• v.26 no.3
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• pp.381-391
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• 2018

This study was carried out to determine whether cage traps can be used to capture wild boars successfully, and to assess their response to different bait materials and the number of wild boars caught. Steel cage-traps ($4.0m{\times}1.5m{\times}1.2m$, $L{\times}W{\times}H$) were installed at two sites in Damyang County and at one site in Sunchang County, South Korea. To identify preferred bait-diet, baits were prepared with dry corn and fermented sour corn and placed in equal amounts at the sites close to wild boar pads at 200 m intervals. Before selecting trap locations where sufficient activity was observed, pre-baiting was undertaken and steel-framed traps were installed with gates open. Preference for bait materials was not clearly defined. After providing the bait for the first time, the number of days until wild boars ate all the food were counted. In the Damyang and Youngam areas, where hunting was allowed, total bait consumption took 6 to 12 days; in contrast, in the Sunchang area, where no hunting took place, total food consumption took only 5 days. In addition, after pre-baiting with the mixture of dry and sour corn for diet for about 8.7 days and then opening the trap gates for 3 more days, 13.7 days were necessary to catch 4.3 wild boars per trap. These results suggest that hunting intensity around trapping places was an important factor in determining the success of the traps.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.79-85
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.