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http://dx.doi.org/10.6117/kmeps.2011.18.1.035

Shearing Characteristics of Sn3.0AgO.5Cu Solder Ball for Standardization of High Speed Shear Test  

Jung, Do-Hyun (Dept of Mater. Sci. and Eng., University of Seoul)
Lee, Young-Gon (University of Seoul)
Jung, Jae-Pil (Dept of Mater. Sci. and Eng., University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.1, 2011 , pp. 35-39 More about this Journal
Abstract
Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.
Keywords
high speed shear test; Sn-3.0wt%Ag-0.5wt%Cu; solder ball; shearing tip height; shear energy;
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Times Cited By KSCI : 4  (Citation Analysis)
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