• 펄프종이기술
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• 제47권5호
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• pp.74-79
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• 2015

Wood powder is widely used in paperboard mills to increase bulk and reduce drying-energy consumption, but this material also deteriorates paper strength because it interferes with the bonds between fibers. Although there have been many studies done to improve the strength of paperboard containing wood powder, specific applications have not recently been observed in paperboard mills. In this study, we carried out a new approach for improving paperboard strength by developing a new organic filler with the ability to increase the bonds between fibers. The residue of tapioca starch was used as raw material to manufacture an organic filler. The functionalities, including bulk and strength, were evaluated by making handsheets containing either wood powder or tapioca organic filler, or a mixture of the two, and measuring their physical properties. The organic filler showed lower bulk improvement and higher paperboard strength than the wood powder. The mixture of tapioca organic filler and wood powder showed improved paperboard strength compared to wood powder alone. Therefore, tapioca residue can be used as a raw material to manufacture an organic filler for paperboard mills.

• 펄프종이기술
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• 제46권1호
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• pp.56-64
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• 2014

The applicability of oil palm EFB(Empty Fiber Bunch) to the papermaking process as a functional organic filler was investigated in this study. Since the EFB has similar chemical composition to the lignocellulose materials such as wood fiber, the fines of EFB was applied to the handsheet paper as an alternative to wood powder which were used as an organic filler to improve water removal efficiency and bulk. The experiments showed that the EFB fines resulted in the higher water removal efficiency at the wet pressing process and leaded to the higher bulk than those of wood powder. In case of 10 % addition of organic filler, the strength properties were not significantly changed. Those results suggested that the EFB could be used as a new organic filler for improving water removal efficiency and bulk property.

• 펄프종이기술
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• 제47권5호
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• pp.61-67
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• 2015

As the production of palm oil has been increased, the generation of oil palm biomass is also increased and the utilization of the oil palm biomass become more significant topic. One third of the oil palm biomass is empty fruit bunch (EFB) and the other two thirds are oil palm trunks and fronds. However, the effective use of oil palm biomass has not been developed and most of it is discarded near oil palm plants. In this study, we investigated the applicability of EFB to the paperboard mills, as an organic filler. The new organic filler was manufactured in a laboratory by grinding and fractionating dried EFB powder, and its properties were analyzed. The particles of EFB organic filler were larger and more spherical than those of the commercial wood powder. The use of EFB organic filler resulted in a higher bulk of the handsheets with similar trends of physical strength, compared to those made with wood powder. It was concluded that EFB could be used as a raw material to manufacture organic filler for paperboard production.

• 펄프종이기술
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• 제46권4호
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• pp.62-68
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• 2014

The application of conifer leave to the papermaking process as a functional organic filler was investigated in this study. The powder of the conifer leave after hot water extraction for the functional extract, such as phytoncide, was applied to OCC stock. The comparison between the commercial wood flour and the conifer leave powder as organic filler for OCC paper were conducted with various wet pressing conditions. The amount of the water removal by the wet pressing process and the bulk of handsheet were increased by the addition of the wood flour and the conifer leave powder, although the tensile strength was decreased. At the higher pressure condition of the wet pressing, the wet pressing efficiency was greatly increased by the wood flour and the conifer leave powder. There was a little difference in the performance of the wood flour and the conifer leave powder as an organic filler. Those results showed the conifer leave powder could be an alternative resource to the wood powder for papermaking organic filler.

• 펄프종이기술
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• 제47권4호
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• pp.96-101
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• 2015

In the previous study, we investigated the physical properties of new organic fillers made from major agricultural byproducts, including rice husks, peanut husks and garlic stems, and we estimated that rice husk was the best candidate for use as new organic fillers in paperboard. In this study, an organic filler prototype was produced with rice husk and the mill trials were carried out in a white liner chipboard (duplexboard) mill. The rice husk organic filler was added to the middle ply of SC $350g/m^2$ to determine the optimal conditions for the manufacture of rice husk organic fillers. The mill trials were performed three times and the bulk improvement and drying energy reduction were measured to identify the functionality of the rice husk organic filler compared to that of the commercial wood powder. In the first mill trial, the test failed because the surface roughness of the duplexboard had deteriorated after the rice husk organic filler was added to the OCC stock. As all of the particles remaining on the 60 mesh sieves were removed and the particle size was decreased by increasing the length of the grinding process, the surface roughness of the duplexboard did not be deteriorated in the second mill trial. However, the bulk improvement and drying energy reduction were not observed. In the final mill trial, as the particle size of the rice husk organic filler was controlled by increasing the portion of particles passing through the 60 mesh sieves and remaining 100 mesh sieves, higher bulk improvement and drying energy reduction were acquired compared to the commercial wood powder.

• Composites Research
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• 제33권1호
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• pp.25-29
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• 2020

Diglycidyl ether of 4,4'-biphenol을 기지로 사용하고, tin(IV) oxide를 filler로, sulfanilamide를 경화제로 사용하여 액정성 열경화성 에폭시 기반 복합재료를 제작하였다. TGA와 LFA를 이용하여 3.0-7.0 wt%의 tin(IV) oxide를 분산시켜 제작한 복합재료의 열적 거동을 조사한 결과, 열분해 활성화 에너지와 열전도성이 filler의 첨가량에 비례하는 것으로 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 펄프종이기술
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• 제45권4호
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• pp.34-41
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• 2013

In this study, we investigated the physical properties of powders made from agricultural byproducts, including rice straw, peanut husks, and garlic stems, to manufacture a new organic filler used for making paperboard. These materials were collected individually, and then we measured their chemical compositions. The byproducts were ground with a laboratory grinder and fractionated with 60-, 100-, and 200-mesh sieves to make many grades of organic fillers. After the grinding and fractionation, the yield, mean particle size, and particle size distribution of each grade were measured. Particle shapes were also investigated using a scanning electron microscope. The organic filler made from rice straw had the highest yield of the largest particle size group and higher contents of cellulose and hemicellulose than those made from peanut husks and garlic stems. The rice straw also showed more regular particle shapes and a lower aspect ratio than the other agricultural byproducts.

• Composites Research
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• 제37권3호
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• pp.197-203
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• 2024

고분자 복합재료의 기계적 특성 향상에 유리한 탄소섬유(Carbon fiber, CF)와 전도 특성 향상에 유리한 다중벽 탄소나노튜브(Multi-walled carbon nanotube, MWCNT)의 동시 혼입을 통해 기계적, 전기적 및 열적 특성을 동시에 향상시킬 수 있다. 본 연구에서는 우수한 양산 가공성과 준수한 기계적 특성을 나타내는 탄소장섬유 열가소성플라스틱(Carbon long fiber thermoplastic, CLFT)에 MWCNT를 혼입하여 전기적 및 열적 특성 제어하였다. 제조된 복합재료의 기계적 및 전기적 특성은 필러의 혼입 양에 가장 크게 영향을 받았다. 반면, 열적 특성은 MWCNT의 혼입으로 연결된 필러 네트워크가 형성됨으로써 더 우수한 결과를 나타내었다. MWCNT 혼입 CLFT의 필러 혼입량, 필러 조성 및 필러 네트워크 구조를 조절함으로써 목적에 적합한 기계적, 전기적 및 열적 특성 제어할 수 있었다.