• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.5
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• pp.74-79
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• 2015

Wood powder is widely used in paperboard mills to increase bulk and reduce drying-energy consumption, but this material also deteriorates paper strength because it interferes with the bonds between fibers. Although there have been many studies done to improve the strength of paperboard containing wood powder, specific applications have not recently been observed in paperboard mills. In this study, we carried out a new approach for improving paperboard strength by developing a new organic filler with the ability to increase the bonds between fibers. The residue of tapioca starch was used as raw material to manufacture an organic filler. The functionalities, including bulk and strength, were evaluated by making handsheets containing either wood powder or tapioca organic filler, or a mixture of the two, and measuring their physical properties. The organic filler showed lower bulk improvement and higher paperboard strength than the wood powder. The mixture of tapioca organic filler and wood powder showed improved paperboard strength compared to wood powder alone. Therefore, tapioca residue can be used as a raw material to manufacture an organic filler for paperboard mills.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.46 no.1
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• pp.56-64
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• 2014

The applicability of oil palm EFB(Empty Fiber Bunch) to the papermaking process as a functional organic filler was investigated in this study. Since the EFB has similar chemical composition to the lignocellulose materials such as wood fiber, the fines of EFB was applied to the handsheet paper as an alternative to wood powder which were used as an organic filler to improve water removal efficiency and bulk. The experiments showed that the EFB fines resulted in the higher water removal efficiency at the wet pressing process and leaded to the higher bulk than those of wood powder. In case of 10 % addition of organic filler, the strength properties were not significantly changed. Those results suggested that the EFB could be used as a new organic filler for improving water removal efficiency and bulk property.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.5
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• pp.61-67
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• 2015

As the production of palm oil has been increased, the generation of oil palm biomass is also increased and the utilization of the oil palm biomass become more significant topic. One third of the oil palm biomass is empty fruit bunch (EFB) and the other two thirds are oil palm trunks and fronds. However, the effective use of oil palm biomass has not been developed and most of it is discarded near oil palm plants. In this study, we investigated the applicability of EFB to the paperboard mills, as an organic filler. The new organic filler was manufactured in a laboratory by grinding and fractionating dried EFB powder, and its properties were analyzed. The particles of EFB organic filler were larger and more spherical than those of the commercial wood powder. The use of EFB organic filler resulted in a higher bulk of the handsheets with similar trends of physical strength, compared to those made with wood powder. It was concluded that EFB could be used as a raw material to manufacture organic filler for paperboard production.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.46 no.4
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• pp.62-68
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• 2014

The application of conifer leave to the papermaking process as a functional organic filler was investigated in this study. The powder of the conifer leave after hot water extraction for the functional extract, such as phytoncide, was applied to OCC stock. The comparison between the commercial wood flour and the conifer leave powder as organic filler for OCC paper were conducted with various wet pressing conditions. The amount of the water removal by the wet pressing process and the bulk of handsheet were increased by the addition of the wood flour and the conifer leave powder, although the tensile strength was decreased. At the higher pressure condition of the wet pressing, the wet pressing efficiency was greatly increased by the wood flour and the conifer leave powder. There was a little difference in the performance of the wood flour and the conifer leave powder as an organic filler. Those results showed the conifer leave powder could be an alternative resource to the wood powder for papermaking organic filler.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.4
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• pp.96-101
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• 2015

In the previous study, we investigated the physical properties of new organic fillers made from major agricultural byproducts, including rice husks, peanut husks and garlic stems, and we estimated that rice husk was the best candidate for use as new organic fillers in paperboard. In this study, an organic filler prototype was produced with rice husk and the mill trials were carried out in a white liner chipboard (duplexboard) mill. The rice husk organic filler was added to the middle ply of SC $350g/m^2$ to determine the optimal conditions for the manufacture of rice husk organic fillers. The mill trials were performed three times and the bulk improvement and drying energy reduction were measured to identify the functionality of the rice husk organic filler compared to that of the commercial wood powder. In the first mill trial, the test failed because the surface roughness of the duplexboard had deteriorated after the rice husk organic filler was added to the OCC stock. As all of the particles remaining on the 60 mesh sieves were removed and the particle size was decreased by increasing the length of the grinding process, the surface roughness of the duplexboard did not be deteriorated in the second mill trial. However, the bulk improvement and drying energy reduction were not observed. In the final mill trial, as the particle size of the rice husk organic filler was controlled by increasing the portion of particles passing through the 60 mesh sieves and remaining 100 mesh sieves, higher bulk improvement and drying energy reduction were acquired compared to the commercial wood powder.

• Composites Research
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• v.33 no.1
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• pp.25-29
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• 2020

A liquid crystalline thermosetting-epoxy-based composite was fabricated using diglycidyl ether of 4,4'-biphenol, tin(IV) oxide as a filler, and sulfanilamide as a curing agent. To investigate the thermal behavior, Thermogravimetric Analysis and Laser Flash Apparatus were performed using 3.0-7.0 wt% Tin(IV) oxide. The result showed that the activation energy and thermal conductivity were proportional to the amount of added filler.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.45 no.4
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• pp.34-41
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• 2013

In this study, we investigated the physical properties of powders made from agricultural byproducts, including rice straw, peanut husks, and garlic stems, to manufacture a new organic filler used for making paperboard. These materials were collected individually, and then we measured their chemical compositions. The byproducts were ground with a laboratory grinder and fractionated with 60-, 100-, and 200-mesh sieves to make many grades of organic fillers. After the grinding and fractionation, the yield, mean particle size, and particle size distribution of each grade were measured. Particle shapes were also investigated using a scanning electron microscope. The organic filler made from rice straw had the highest yield of the largest particle size group and higher contents of cellulose and hemicellulose than those made from peanut husks and garlic stems. The rice straw also showed more regular particle shapes and a lower aspect ratio than the other agricultural byproducts.

• Composites Research
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• v.37 no.3
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• pp.197-203
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• 2024

Mechanical, electrical and thermal properties of polymer composites can be improved simultaneously by incorporating carbon fibers (CFs), which are beneficial for improving the mechanical properties, and multi-walled carbon nanotubes (MWCNTs), which are advantageous for improving the conductive properties. In this study, MWCNTs were incorporated into carbon long fiber thermoplastic (CLFT), which has excellent mass production processability and excellent mechanical properties, to control electrical and thermal properties. The mechanical and electrical properties of the prepared composites were most significantly influenced by the amount of filler incorporated. On the other hand, the thermal properties were improved due to the formation of a filler network interconnected by the incorporation of MWCNTs. By adjusting the filler amount, filler composition, and filler network structure of MWCNT-incorporated CLFT, the mechanical, electrical, and thermal properties could be controlled.