• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.25-32
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• 2009

Recently, research for Network-on-chip(NoC) is progressing. However, due to the increase of system complexity and demand on high performance, conventional copper-based electrical interconnect would be faced with the design limitation of performance, power, and bandwidth. As an alternative to these problems, combined use of Electrical Interconnects(EIs) and Optical Interconnects(OIs) has been introduced. In this paper we propose efficient routing optimization strategy and hybrid switch architecture, which use OIs for critical path and EIs for non-critical path. The proposed method shows up to 25% performance improvement and 38% power reduction.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.191-195
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• 2012

Heavy flint optical glass(SF57HHT) is new material that has extremely high transmittance. Due to brittleness and high hardness, optical glass is one of the most difficult to materials for ultra-precision turning. According to the hypothesis of ductile machining, all materials, regardless of their hardness and brittleness, will undergo transition from brittle to ductile machining region below critical undefromed chip thickness. In this study, cutting test was carried out to evaluate cutting performance of heavy flint glass using ultra-precision machine with single crystal diamond bite. The machined workpiece surface topography, tool wear and surface roughness were examined using AFM and SEM. The experimental results indicate that the machining mode become the brittle mode to ductile mode, when the maximum undeformed chip thinkness is large than critical value. Tool wear mainly occurs on the flank face and its wear mechanism is dominated by abrasion. This study demonstrates the feasibility of SF57HHT by diamond turning.

• Current Optics and Photonics
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• v.4 no.3
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• pp.229-237
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• 2020

In this study, a beam-coupling system is designed to improve the coupling efficiency of achip-integrated spectrometer when the waveguide is arranged in a linear and discrete manner. In the proposed system the beam is shaped to be anti-Gaussian, to deposit adequate energy in the edge waveguides. The beam is discretely coupled to the corresponding waveguide by a microlens array, to improve the coupling efficiency, and is compressed by a toroidal lens to match the linear discrete waveguides. Based on the findings of this study, the coupling efficiency of the spectrometer is shown to increase by a factor of 2.57. Accordingly, this study provides a reference basis for the improvement of the coupling efficiency of other similar spectrometers.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.3
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• pp.586-597
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• 2004

MAC (Medium Access Control) protocol is necessary for a OLT (Optical Line Termination) to allocate bandwidth to ONUs (Optical Network Units) dynamically in ATM PON (Passive Optical Network) operated in a kind of optical subscriber network having tree topology. The OLT collect information about ONUs and provide all permission with each ONU effectively by means of MAC protocol. Major functions of MAC protocol are composed of the algorism for distributing permission demanded by a ONU dynamically and allocation all permission used in APON properly. Sometimes MAC get to be a element of limiting the whole operation speed and occupy a most frequent operation part of the TC (Transmission Convergence) function module so it have to be designed to guarantee the best quality for each traffic. This paper introduce the way of implementation of a algorism which satisfy all of the upper renditions. This MAC algorism allocate bandwidth according to a number of working ONU and the information of the queue length dynamically and distribute permission for same interval to minimize delay variation of each ONU cell. MAC scheduler for the dynamic bandwidth allocation which is introduced in this paper has look-up table structure that makes programming possible. This structure is very suitable for implementation and operated in high speed because it require very simple and small chip size.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.1
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• pp.684-692
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• 2016

In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.155-160
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• 2001

In the use of glass fiber reinforced plastics(GFRP) it is often necessary to cut the components, but the cutting of GFRP is often made difficult by the delamination of the compositions and short tool life. Experimental investigation was conducted to evaluate the chip formation of the glass fiber reinforced plastics during orthogonal cutting. The chip formation process, cutting force, and thrust force were studied. The chip formation processes were studied through the use of quick-stop device. Chip-tool contact areas were obtained with the use of the quick-stop device, and observed using optical microscopy after polishing. Cutting force and thrust force were measured through the use of the tool dynamometer.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.97-101
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• 2013

There is a growing need for optical communication systems that convert large volumes of data to optical signals and that accommodate and transmit the signals across long distances. Digital optical communication consists of a master unit (MU) and a slave unit (SU). The MU transmits data to SU using digital optical signals. However, digital optical units that are commercially available or are under development transmit data using two's complement representation. At low input levels, a large number of SSOs (simultaneous switching outputs) are required because of the high rate of bit switching in two's complement, which thereby increases the power noise. This problem reduces the overall system capability because a DSP (digital signal processor) chip (FPGA, CPLD, etc.) cannot be used efficiently and power noise increases. This paper proposes a change from two's complement to a more efficient method that produces less SSO noise and can be applied to existing digital optical units.

• Journal of Industrial Technology
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• v.22 no.B
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• pp.241-249
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• 2002

Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super precision technology in sub-micron units is required for optical axis adjustment. We developed the automatic optical fiber by image processing and automatic loading system. we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10{\mu}m$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up and fiber input array and waveguide chip formed in line by automatic.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.164-164
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• 2009

This paper had analyzed property of LED chip which has appropriate distribution and had designed modeling in order to experiment optical property of LED module through simulation. also throughout error value between street light and simulation data, precisive simulation could be inferred. as a consequent, transformation of optical property had henceforth verified the first value of module array.