• 대한전자공학회논문지SD
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• 제46권9호
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• pp.25-32
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• 2009

최근 네트워크-온-칩(Network-on-chip)에 대한 연구가 활발히 진행되고 있는 가운데 반도체 칩 복잡도 증가와 고성능에 대한 요구로 인해 기존 구리 기반의 상호연결(Copper-based interconnects)을 사용할 경우 성능, 전력, 대역폭 등에 대한 설계 한계에 곧 직면할 것으로 보인다. 이 문제에 대한 대안으로 전기적인 상호연결(Electrical Interconnects, EIs)과 광학적 상호연결(Optical Interconnects, OIs)을 상호 보완적으로 사용하는 방법이 제안되고 있다. 이러한 연구 방향의 일환으로, 본 논문에서 광학적 상호연결은 지연 시간을 감안하여 임계 경로에, 전기적인 상호연결은 비 임계 경로에 적용하며, 두 상호연결을 혼용하여 사용하기 위한 효율적인 하이브리드 스위치 구조와 라우팅 최적화 방법을 제안한다. 모의실험 결과 제안한 알고리즘과 구조를 적용할 경우 전기적인 상호연결만을 사용 할 경우보다 최대 25%의 속도 향상과 38%의 소비 전력 감소를 나타냈다.

• 한국생산제조학회지
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• 제21권2호
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• pp.191-195
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• 2012

Heavy flint optical glass(SF57HHT) is new material that has extremely high transmittance. Due to brittleness and high hardness, optical glass is one of the most difficult to materials for ultra-precision turning. According to the hypothesis of ductile machining, all materials, regardless of their hardness and brittleness, will undergo transition from brittle to ductile machining region below critical undefromed chip thickness. In this study, cutting test was carried out to evaluate cutting performance of heavy flint glass using ultra-precision machine with single crystal diamond bite. The machined workpiece surface topography, tool wear and surface roughness were examined using AFM and SEM. The experimental results indicate that the machining mode become the brittle mode to ductile mode, when the maximum undeformed chip thinkness is large than critical value. Tool wear mainly occurs on the flank face and its wear mechanism is dominated by abrasion. This study demonstrates the feasibility of SF57HHT by diamond turning.

• Current Optics and Photonics
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• 제4권3호
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• pp.229-237
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• 2020

In this study, a beam-coupling system is designed to improve the coupling efficiency of achip-integrated spectrometer when the waveguide is arranged in a linear and discrete manner. In the proposed system the beam is shaped to be anti-Gaussian, to deposit adequate energy in the edge waveguides. The beam is discretely coupled to the corresponding waveguide by a microlens array, to improve the coupling efficiency, and is compressed by a toroidal lens to match the linear discrete waveguides. Based on the findings of this study, the coupling efficiency of the spectrometer is shown to increase by a factor of 2.57. Accordingly, this study provides a reference basis for the improvement of the coupling efficiency of other similar spectrometers.

• 한국정보통신학회논문지
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• 제8권3호
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• pp.586-597
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• 2004

MAC (Medium Access Control) protocol is necessary for a OLT (Optical Line Termination) to allocate bandwidth to ONUs (Optical Network Units) dynamically in ATM PON (Passive Optical Network) operated in a kind of optical subscriber network having tree topology. The OLT collect information about ONUs and provide all permission with each ONU effectively by means of MAC protocol. Major functions of MAC protocol are composed of the algorism for distributing permission demanded by a ONU dynamically and allocation all permission used in APON properly. Sometimes MAC get to be a element of limiting the whole operation speed and occupy a most frequent operation part of the TC (Transmission Convergence) function module so it have to be designed to guarantee the best quality for each traffic. This paper introduce the way of implementation of a algorism which satisfy all of the upper renditions. This MAC algorism allocate bandwidth according to a number of working ONU and the information of the queue length dynamically and distribute permission for same interval to minimize delay variation of each ONU cell. MAC scheduler for the dynamic bandwidth allocation which is introduced in this paper has look-up table structure that makes programming possible. This structure is very suitable for implementation and operated in high speed because it require very simple and small chip size.

• 한국산학기술학회논문지
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• 제17권1호
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• pp.684-692
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• 2016

LQFP/TQFP(Low-profile Quad Flat Package/Thin Quad Flat Package) 패키지 공정에서는 높은 수준의 품질 관리를 위해 3차원 형상 측정 방법을 도입하고 있어 본 연구에서는 최종 외관 불량 검사를 위하여 projection moire 방식의 3D 영상 검사를 위한 광학 시스템과 영상처리 알고리즘을 개발하였다. LQFP/TQFP칩에서 발생하는 불량들은 2D 불량항목과 3D 불량 항목으로 구분하여 불량 항목을 상세히 정의하였다. 광학계를 설계함에 있어서 2D 측정 광학계는 돔 조명을 사용하여 일정한 광분포도를 갖도록 설계하고, 3D 측정 광학계는 PZT를 이용하여 모아레 패턴이 90도씩 정확한 위상을 갖도록 이송을 위한 기구적 메커니즘을 설계한다. 물체의 모아레 측정시 위상 변화에서 나타나는 $2{\pi}$ 모호성을 해결하기 위해 측정된 모아레 무늬를 비교하여 $2{\pi}$ 위상의 모호성이 발생하는 부분에서 수정된 다른 위상을 참고하는 알고리즘을 적용하였다. 개발된 검사 시스템은 LQFP/TQFP 외관 검사 공정에 적용하였으며, 실험에서 최대 높이의 측정 오차는 $1.34{\mu}m$ 이내로, 3차원 외관형상 불량 검사 조건을 만족할 만한 성능을 보였다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.155-160
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• 2001

In the use of glass fiber reinforced plastics(GFRP) it is often necessary to cut the components, but the cutting of GFRP is often made difficult by the delamination of the compositions and short tool life. Experimental investigation was conducted to evaluate the chip formation of the glass fiber reinforced plastics during orthogonal cutting. The chip formation process, cutting force, and thrust force were studied. The chip formation processes were studied through the use of quick-stop device. Chip-tool contact areas were obtained with the use of the quick-stop device, and observed using optical microscopy after polishing. Cutting force and thrust force were measured through the use of the tool dynamometer.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 전자공학회논문지
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• 제50권1호
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• pp.97-101
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• 2013

There is a growing need for optical communication systems that convert large volumes of data to optical signals and that accommodate and transmit the signals across long distances. Digital optical communication consists of a master unit (MU) and a slave unit (SU). The MU transmits data to SU using digital optical signals. However, digital optical units that are commercially available or are under development transmit data using two's complement representation. At low input levels, a large number of SSOs (simultaneous switching outputs) are required because of the high rate of bit switching in two's complement, which thereby increases the power noise. This problem reduces the overall system capability because a DSP (digital signal processor) chip (FPGA, CPLD, etc.) cannot be used efficiently and power noise increases. This paper proposes a change from two's complement to a more efficient method that produces less SSO noise and can be applied to existing digital optical units.

• 산업기술연구
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• 제22권B호
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• pp.241-249
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• 2002

Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super precision technology in sub-micron units is required for optical axis adjustment. We developed the automatic optical fiber by image processing and automatic loading system. we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10{\mu}m$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up and fiber input array and waveguide chip formed in line by automatic.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.164-164
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• 2009

This paper had analyzed property of LED chip which has appropriate distribution and had designed modeling in order to experiment optical property of LED module through simulation. also throughout error value between street light and simulation data, precisive simulation could be inferred. as a consequent, transformation of optical property had henceforth verified the first value of module array.