• Title/Summary/Keyword: nonvolatile memory

Search Result 252, Processing Time 0.027 seconds

High Density and Low Voltage Programmable Scaled SONOS Nonvolatile Memory for the Byte and Flash-Erased Type EEPROMs (플래시 및 바이트 소거형 EEPROM을 위한 고집적 저전압 Scaled SONOS 비휘발성 기억소자)

  • 김병철;서광열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.15 no.10
    • /
    • pp.831-837
    • /
    • 2002
  • Scaled SONOS transistors have been fabricated by 0.35$\mu\textrm{m}$ CMOS standard logic process. The thickness of stacked ONO(blocking oxide, memory nitride, tunnel oxide) gate insulators measured by TEM are 2.5 nm, 4.0 nm and 2.4 nm, respectively. The SONOS memories have shown low programming voltages of ${\pm}$8.5 V and long-term retention of 10-year Even after 2 ${\times}$ 10$\^$5/ program/erase cycles, the leakage current of unselected transistor in the erased state was low enough that there was no error in read operation and we could distinguish the programmed state from the erased states precisely The tight distribution of the threshold voltages in the programmed and the erased states could remove complex verifying process caused by over-erase in floating gate flash memory, which is one of the main advantages of the charge-trap type devices. A single power supply operation of 3 V and a high endurance of 1${\times}$10$\^$6/ cycles can be realized by the programming method for a flash-erased type EEPROM.

Effect of heat treatment in $HfO_2$ as charge trap with engineered tunnel barrier for nonvolatile memory (비휘발성 메모리 적용을 위한 $SiO_2/Si_3N_4/SiO_2$ 다층 유전막과 $HfO_2$ 전하저장층 구조에서의 열처리 효과)

  • Park, Goon-Ho;Kim, Kwan-Su;Jung, Myung-Ho;Jung, Jong-Wan;Chung, Hong-Bay;Cho, Won-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.11a
    • /
    • pp.24-25
    • /
    • 2008
  • The effect of heat treatment in $HfO_2$ as charge trap with $SiO_2/Si_3N_4/SiO_2$ as tunnel oxide layer in capacitors has been investigated. Rapid thermal annealing (RTA) were carried out at the temperature range of 600 - $900^{\circ}C$. It is found that all devices carried out heat treatment have large threshold voltage shift Especially, device performed heat treatment at $900^{\circ}C$ has been confirmed the largest memory window. Also, Threshold voltage shift of device used conventional $SiO_2$ as tunnel oxide layer was smaller than that with $SiO_2/Si_3N_4/SiO_2$.

  • PDF

Tunneling Properties in High-k Insulators with Engineered Tunnel Barrier for Nonvolatile Memory (차세대 비휘발성 메모리에 사용되는 High-k 절연막의 터널링 특성)

  • Oh, Se-Man;Jung, Myung-Ho;Park, Gun-Ho;Kim, Kwan-Su;Chung, Hong-Bay;Lee, Young-Hie;Cho, Won-Ju
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.22 no.6
    • /
    • pp.466-468
    • /
    • 2009
  • The metal-insulator-silicon (MIS) capacitors with $SiO_2$ and high-k dielectrics ($HfO_2$, $Al_2O_3$) were fabricated, and the current-voltage characteristics were investigated. Especially, an effective barrier height between metal gate and dielectric was extracted by using Fowler-Nordheim (FN) plot and Direct Tunneling (DT) plot of quantum mechanical(QM) modeling. The calculated barrier heights of thermal $SiO_2$, ALD $SiO_2$, $HfO_2$ and $Al_2O_3$ are 3.35 eV, 0.6 eV, 1.75 eV, and 2.65 eV, respectively. Therefore, the performance of non-volatile memory devices can be improved by using engineered tunnel barrier which is considered effective barrier height of high-k materials.

Electrical characteristics of poly-Si NVM by using the MIC as the active layer

  • Cho, Jae-Hyun;Nguyen, Thanh Nga;Jung, Sung-Wook;Yi, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.02a
    • /
    • pp.151-151
    • /
    • 2010
  • In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

  • PDF

Design and Implementation of a File System that Considers the Space Efficiency of NVRAM (비휘발성 메모리의 공간적 효율성을 고려한 파일 시스템의 설계 및 구현)

  • Hyun Choul-Seung;Baek Seung-Jae;Choi Jong-Moo;Lee Dong-Hee;Noh Sam-H.
    • Journal of KIISE:Computer Systems and Theory
    • /
    • v.33 no.9
    • /
    • pp.615-625
    • /
    • 2006
  • Nonvolatile memory technology is evolving continuously and commercial products such as FeRAM and PRAM are now challenging their markets. As NVRAM has properties of both memory and storage, it can store persistent data objects while allowing fast and random access. To utilize NVRAM for general purpose storing of frequently updated data across power disruptions, some essential features of the file system including naming, recovery, and space management are required while exploiting memory-like properties of NVRAM. Conventional file systems, including even recently developed NVRAM file systems, show very low space efficiency wasting more than 50% of the total space in some cases. To efficiently utilize the relatively expensive NVRAM, we design and implement a new extent-based space-thrifty file system, which we call NEBFS (NVRAM Extent-Based File System). We analyze and compare the space utilization of conventional file systems with NEBFS and validate the results with experimental results observed from running the file system implementations on a system with actual NVRAM installed as well as on systems emulating NVRAM. We show that NEBFS has high space efficiency compared to conventional file systems.

One step facile synthesis of Au nanoparticle-cyclized polyacrylonitrile composite films and their use in organic nano-floating gate memory applications

  • Jang, Seok-Jae;Jo, Se-Bin;Jo, Hae-Na;Lee, Sang-A;Bae, Su-Gang;Lee, Sang-Hyeon;Hwang, Jun-Yeon;Jo, Han-Ik;Wang, Geon-Uk;Kim, Tae-Uk
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2016.02a
    • /
    • pp.307.2-307.2
    • /
    • 2016
  • In this study, we synthesized Au nanoparticles (AuNPs) in polyacrylonitrile (PAN) thin films using a simple annealing process in the solid phase. The synthetic conditions were systematically controlled and optimized by varying the concentration of the Au salt solution and the annealing temperature. X-ray photoelectron spectroscopy (XPS) confirmed their chemical state, and transmission electron microscopy (TEM) verified the successful synthesis, size, and density of AuNPs. Au nanoparticles were generated from the thermal decomposition of the Au salt and stabilized during the cyclization of the PAN matrix. For actual device applications, previous synthetic techniques have required the synthesis of AuNPs in a liquid phase and an additional process to form the thin film layer, such as spin-coating, dip-coating, Langmuir-Blodgett, or high vacuum deposition. In contrast, our one-step synthesis could produce gold nanoparticles from the Au salt contained in a solid matrix with an easy heat treatment. The PAN:AuNPs composite was used as the charge trap layer of an organic nano-floating gate memory (ONFGM). The memory devices exhibited a high on/off ratio (over $10^6$), large hysteresis windows (76.7 V), and a stable endurance performance (>3000 cycles), indicating that our stabilized PAN:AuNPs composite film is a potential charge trap medium for next generation organic nano-floating gate memory transistors.

  • PDF

Nano-Floating Gate Memory Devices with Metal-Oxide Nanoparticles in Polyimide Dielectrics

  • Kim, Eun-Kyu;Lee, Dong-Uk;Kim, Seon-Pil;Lee, Tae-Hee;Koo, Hyun-Mo;Shin, Jin-Wook;Cho, Won-Ju;Kim, Young-Ho
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.8 no.1
    • /
    • pp.21-26
    • /
    • 2008
  • We fabricated nano-particles of ZnO, $In_2O_3$ and $SnO_2$ by using the chemical reaction between metal thin films and polyamic acid. The average size and density of these ZnO, $In_2O_3$ and $SnO_2$ nano-particles was approximately 10, 7, and 15 nm, and $2{\times}10^{11},\;6{\times}10^{11},\;2.4{\times}10^{11}cm^{-2}$, respectively. Then, we fabricated nano-floating gate memory (NFGM) devices with ZnO and $In_2O_3$ nano-particles embedded in the devices' polyimide dielectrics and silicon dioxide layers as control and tunnel oxides, respectively. We measured the current-voltage characteristics, endurance properties and retention times of the memory devices using a semiconductor parameter analyzer. In the $In_2O_3$ NFGM, the threshold voltage shift (${\Delta}V_T$) was approximately 5 V at the initial state of programming and erasing operations. However, the memory window rapidly decreased after 1000 s from 5 to 1.5 V. The ${\Delta}V_T$ of the NFGM containing ZnO was approximately 2 V at the initial state, but the memory window decreased after 1000 s from 2 to 0.4 V. These results mean that metal-oxide nano-particles have feasibility to apply NFGM devices.

A Materials Approach to Resistive Switching Memory Oxides

  • Hasan, M.;Dong, R.;Lee, D.S.;Seong, D.J.;Choi, H.J.;Pyun, M.B.;Hwang, H.
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.8 no.1
    • /
    • pp.66-79
    • /
    • 2008
  • Several oxides have recently been reported to have resistance-switching characteristics for nonvolatile memory (NVM) applications. Both binary and ternary oxides demonstrated great potential as resistive-switching memory elements. However, the switching mechanisms have not yet been clearly understood, and the uniformity and reproducibility of devices have not been sufficient for gigabit-NVM applications. The primary requirements for oxides in memory applications are scalability, fast switching speed, good memory retention, a reasonable resistive window, and constant working voltage. In this paper, we discuss several materials that are resistive-switching elements and also focus on their switching mechanisms. We evaluated non-stoichiometric polycrystalline oxides ($Nb_2O_5$, and $ZrO_x$) and subsequently the resistive switching of $Cu_xO$ and heavily Cu-doped $MoO_x$ film for their compatibility with modem transistor-process cycles. Single-crystalline Nb-doped $SrTiO_3$ (NbSTO) was also investigated, and we found a Pt/single-crystal NbSTO Schottky junction had excellent memory characteristics. Epitaxial NbSTO film was grown on an Si substrate using conducting TiN as a buffer layer to introduce single-crystal NbSTO into the CMOS process and preserve its excellent electrical characteristics.

Simulation of Threshold Voltages for Charge Trap Type SONOS Memory Devices as a Function of the Memory States (기억상태에 따른 전하트랩형 SONOS 메모리 소자의 문턱전압 시뮬레이션)

  • Kim, Byung-Cheul;Kim, Hyun-Duk;Kim, Joo-Yeon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • v.9 no.1
    • /
    • pp.981-984
    • /
    • 2005
  • This study is to realize its threshold voltage shift after programming operation in charge trap type SONOS memory by simulation. SONOS devices are charge trap type nonvolatile memory devices in which charge storage takes place in traps in the nitride-blocking oxide interface and the nitride layer. For simulation of their threshold voltage as a function of the memory states, traps in the nitride layer have to be defined. However, trap models in the nitride layer are not developed in commercial simulator. So, we propose a new method that can simulate their threshold voltage shift by an amount of charges induced to the electrodes as a function of a programming voltages and times as define two electrodes in the tunnel oxide-nitride interface and the nitride-blocking oxide interface of SONOS structures.

  • PDF

An Embedded Text Index System for Mass Flash Memory (대용량 플래시 메모리를 위한 임베디드 텍스트 인덱스 시스템)

  • Yun, Sang-Hun;Cho, Haeng-Rae
    • Journal of the Korea Society of Computer and Information
    • /
    • v.14 no.6
    • /
    • pp.1-10
    • /
    • 2009
  • Flash memory has the advantages of nonvolatile, low power consumption, light weight, and high endurance. This enables the flash memory to be utilized as a storage of mobile computing device such as PMP(Portable Multimedia Player). Potable device with a mass flash memory can store various multimedia data such as video, audio, or image. Typical index systems for mobile computer are inefficient to search a form of text like lyric or title. In this paper, we propose a new text index system, named EMTEX(Embedded Text Index). EMTEX has the following salient features. First, it uses a compression algorithm for embedded system. Second, if a new insert or delete operation is executed on the base table. EMTEX updates the text index immediately. Third, EMTEX considers the characteristics of flash memory to design insert, delete, and rebuild operations on the text index. Finally, EMTEX is executed as an upper layer of DBMS. Therefore, it is independent of the underlying DBMS. We evaluate the performance of EMTEX. The Experiment results show that EMTEX can outperform th conventional index systems such as Oracle Text and FT3.