• Title/Summary/Keyword: nitrogen-doped

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Characterization of Nitrogen-Doped $TiO_2$ Thin Films Prepared by Metalorganic Chemical Vapor Deposition (유기금속 화학 기상증착법으로 실리콘 기판위에 증착된 질소치환 $TiO_2$ 박막의 특성분석)

  • 이동헌;조용수;이월인;이전국;정형진
    • Journal of the Korean Ceramic Society
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    • v.31 no.12
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    • pp.1577-1587
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    • 1994
  • TiO2 thin films with the substitution of oxygen with nitrogen were deposited on silicon substrate by metalorganic chemical vapor deposition (MOCVD) using Ti(OCH(CH3)2)4 (titanium tetraisopropoxide, TTIP) and N2O as source materials. X-ray diffraction (XRD) results indicated that the crystal structure of the deposited thin films was anatase TiO2 with only (101) plane observed at the deposition temperatures of 36$0^{\circ}C$ and 38$0^{\circ}C$, and with (101) and (200) plane at above 40$0^{\circ}C$. Raman spectroscopic results indicated that the crystal structure was anatase TiO2 in accordance with the XRD results without any rutile, fcc TiN, or hcp TiN structure. No fundamental difference was observed with temperature increase, but the peak intensity at 194.5 cm-1 increased with strong intensity at 143.0 cm-1 for all samples. The crystalline size of the films varied from 49.2 nm to 63.9 nm with increasing temperature as determined by slow-scan XRD experiments. The refractive index of the films increased from 2.40 to 2.55 as temperature increased. X-ray photoelectron spectroscopy (XPS) study showed only Ti 2s, Ti 2p, C 1s, O 1s and O 2s peaks at the surface of the film. The composition of the surface was estimated to be TiO1.98 from the quatitative analysis. In the bulk of the film Ti 2s, Ti 2p, O 1s, O 2s, N 1s and N 2s were detected, and Ti-N bonding was observed due to the substitution of oxygen with nitrogen. A satellite structure was observed in the Ti 2p due to the Ti-N bonding, and the composition of titanium nitride was determined to be about TiN1.0 from the position of the binding energy of Ti-N 2p3/2 and the quatitative analysis. The spectrum of Ti 2p energy level could be the sum of a 4, 5, or 6 Gaussian curve reconstruction, and the case of the sum of the 6 Gaussian curve reconstruction was physically most meaningful. From the results of Auger electron spectroscopy (AES), it was known that the composition was not varied significantly throughout the whole thickness of the film, and silicon oxide was not observed at the interface between the film and the substrate. The composition of the film was possible (TiO2)1-x.(TiN)x or TiO2-2xNx and in this experimental condition x was found to be about 0.21-0.16.

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HVPE growth of GaN/InGaN heterostructure on r-plane sapphire substrate (R-plane 사파이어 기판위의 GaN/InGaN 이종접합구조의 HVPE 성장)

  • Jeon, H.S.;Hwang, S.L.;Kim, K.H.;Jang, K.S.;Lee, C.H.;Yang, M.;Ahn, H.S.;Kim, S.W.;Jang, S.H.;Lee, S.M.;Park, G.H.;Koike, M.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.17 no.1
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    • pp.6-10
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    • 2007
  • The a-plane GaN layer on r-plane $Al_2O_3$ substrate is grown by mixed-source hydride vapor phase epitaxy (HVPE). The GaN/InGaN heterostructure is performed by selective area growth (SAG) method. The heterostructure consists of a flown over mixed-sourec are used as gallium (or indium) and nitrogen sources. The gas flow rates of HCl and $NH_3$ are maintained at 10 sccm and 500 sccm, respectively. The temperatures of GaN source zone is $650^{\circ}C$. In case of InGaN, the temperature of source zone is $900^{\circ}C$. The grown temperatures of GaN and InGaN layer are $820^{\circ}C\;and\;850^{\circ}C$, respectively. The EL (electroluminescence) peak of GaN/InGaN heterostructure is at nearly 460 nm and the FWHM (full width at half maximum) is 0.67 eV. These results are demonstrated that the heterostructure of III-nitrides on r-plane sapphire can be successfully grown by mixed-source HVPE with multi-sliding boat system.

Fabrication and characterization of $WSi_2$ nanocrystals memory device with $SiO_2$ / $HfO_2$ / $Al_2O_3$ tunnel layer

  • Lee, Hyo-Jun;Lee, Dong-Uk;Kim, Eun-Kyu;Son, Jung-Woo;Cho, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.134-134
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    • 2011
  • High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.

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Synthesis and Electrochemical Properties of Nitrogen Doped Mesoporous TiO2 Nanoparticles as Anode Materials for Lithium-ion Batteries (질소도핑 메조다공성 산화티타늄 나노입자의 합성 및 리튬이온전지 음극재로의 적용)

  • Yun, Tae-Kwan;Bae, Jae-Young;Park, Sung-Soo;Won, Yong-Sun
    • Clean Technology
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    • v.18 no.2
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    • pp.177-182
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    • 2012
  • Mesoporous anatase $TiO_2$ nanoparticles have been synthesized by a hydrothermal method using a tri-block copolymer as a soft template. The resulting $TiO_2$ materials have a high specific surface area of $230\;m^2/g$, a predominant pore size of 6.8 nm and a pore volume of 0.404 mL/g. The electrochemical properties of mesoporous anatase $TiO_2$ for lithium ion battery (LIB) anode materials have been investigated by typical coin cell tests. The initial discharge capacity of these materials is 240 mAh/g, significantly higher than the theoretical capacity (175 mAh/g) of LTO ($Li_4Ti_5O_{12}$). Although the discharge capacity decreases with the C-rate increase, the mesoporous $TiO_2$ is very promising for LIB anode because the surface for the Li insertion is presented significantly with mesopores. Nitrogen doping has a certain effect to control the capacity decrease by improving the electron transport in $TiO_2$ framework.

Towards Thermally Stable Tandem Organic Solar Cells

  • Yang, Feng;Wang, Sihan;Kim, Ji-Hwan;Kim, Yong-Sang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.410.2-410.2
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    • 2016
  • Tandem structure is promising in organic solar cells because of its double open-circuit voltage (VOC) and efficient photon energy conversion. In a typical tandem device, the two single sub-cells are stacked and connected by an interconnecting layer. The fabrication of two sub-cells are usually carried out in a glovebox filled with nitrogen or argon gas, which makes it expensive and laborious. We report a glovebox-free fabricated inverted tandem organic solar cells wherein the tandem structure comprises sandwiched interconnecting layer based on p-doped hole-transporting, metal, and electron-transporting materials. Complete fabrication process of the tandem device was performed outside the glove box. The tandem solar cells based on poly(3-hexylthiophene) (P3HT) and (6,6)-phenyl C61-butyric acid methyl ester (PCBM) can realize a high VOC, which sums up of the two sub-cells. The tandem device structure was ITO/ZnO/P3HT:PCBM/PEDOT:PSS/MoO3/Au/Al/ZnO-d/P3HT:PCBM/PEDOT:PSS/Ag. The separate sub-cells were morphologically and thermally stable up to 160 oC. The high stability of the active layer benefits in the fabrication processes of tandem device. The performance of tandem organic solar cells comes from the sub-cells with an 50 nm thick active layer of P3HT:PCBM, achieving an average power conversion efficiency (PCE) of 2.9% (n=12) with short-circuit current density (JSC) = 4.26 mA/cm2, VOC = 1.10 V, and fill factor (FF) = 0.62. Based on these findings, we propose a new method to improve the performance and stability of tandem organic solar cells.

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A Study on Feasibility of the Phosphoric Acid Doping for Solar Cell Using Newly Atmospheric Pressure Plasma Source (새로운 대기압 플라즈마 소스를 이용한 결정질 실리콘 태양전지 인산 도핑 가능성에 관한 연구)

  • Cho, I-Hyun;Yun, Myoung-Soo;Jo, Tae-Hoon;Kwon, Gi-Chung
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.6
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    • pp.95-99
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    • 2013
  • Furnace is currently the most important doping process using POCl3 in solar cell. However furnace need an expensive equipment cost and it has to purge a poisonous gas. Moreover, furnace typically difficult appling for selective emitters. In this study, we developed a new atmospheric pressure plasma source, in this procedure, we research the atmospheric pressure plasma doping that dopant is phosphoric acid($H_3PO_4$). Metal tube injected Ar gas was inputted 5 kV of a low frequency(scores of kHz) induced inverter, so plasma discharged at metal tube. We used the P type silicon wafer of solar cell. We regulated phosphoric acid($H_3PO_4$) concentration on 10% and plasma treatment time is 90 s, 150 s, we experiment that plasma current is 70 mA. We check the doping depth that 287 nm at 90 s and 621 nm at 150 s. We analysis and measurement the doping profile by using SIMS(Secondary Ion Mass Spectroscopy). We calculate and grasp the sheet resistance using conventional sheet resistance formula, so there are 240 Ohm/sq at 90 s and 212 Ohm/sq at 150 s. We analysis oxygen and nitrogen profile of concentration compared with furnace to check the doped defect of atmosphere.

Enhanced Hole Concentration of p-GaN by Sb Surfactant (Sb 계면활성제에 의한 p-GaN 박막의 홀농도 향상)

  • Kim, J.Y.;Park, S.J.;Moon, Y.B.;Kwon, M.K.
    • Journal of the Korean Vacuum Society
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    • v.20 no.4
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    • pp.271-275
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    • 2011
  • The role and effect of Sb surfactant on structure and properties of p type gallium nitride (GaN) epilayers have been investigated. It was found that there was a increase of hole concentration with Sb surfactant, compared to typical Mg-doped p-GaN. The structural and optical quality of p-GaN epilayers were accessed by x-ray diffraction, photoluminescence and atomic force microscope measurements. The results clearly show that the increase in hole concentration with Sb surfactant can be resulted from decrease in the dislocations and nitrogen point defects.

Effect of Rapid Thermal Annealing on the Properties of Nitrogen-doped $In_2O_3$ Thin Films

  • Tak, Seong-Geon;Kim, Jun-Yeong;O, Seok-Hyeon;Jeong, Min-Jae;Kim, Chun-Su;Jo, Sin-Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.243-244
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    • 2011
  • 최근에 산화물 반도체를 평판 디스플레이와 태양 전지의 투명 전극으로 응용하기 위해 많은 연구가 진행중에 있다. 특히, $In_2O_3$ 박막은 투명 전도 산화막으로써 3.7 eV의 직접 전이 밴드갭 에너지를 갖고 가시광 영역에서 높은 투과도를 갖는 반도체이어서 다양한 영역에서 응용 가능하다. 본 연구는 낮은 비저항과 높은 투과율을 갖는 최적의 투명 전도막을 성장시키기 위하여 라디오파 반응성 마그네트론 스퍼터링 방법을 사용하여 질소 도핑된 $In_2O_3$ 박막을 유리 기판 상부에 증착하였고, 후열처리로 온도 400, 450, 500, 550$^{\circ}C$에서 급속 열처리를 수행하여, 증착된 박막의 구조, 표면, 광학, 전기적 특성을 조사하였다. 증착된 박막은 XRD를 사용하여 구조적 특성을 조사한 결과, $2{\theta}=30.2^{\circ}$와 43.95$^{\circ}$에서 상대적으로 강한 피크가 관측되었다(Fig. 1). 전자는 (222)면에서 회절된 피크이며, 후자는 (100)면에서 발생한 회절 피크이다. 열처리 온도가 0$^{\circ}C$에서 500$^{\circ}C$로 증가함에 따라 (222) 면의 회절 신호의 세기는 상대적으로 증가하였고, 550$^{\circ}C$에서 급격하게 감소하였다. 박막의 광학적 특성은 자외선-가시광선 분광기를 사용하여 광학 흡수율과 투과율을 측정하였다(Fig. 2). 열처리를 하지 않은 박막의 경우에, 파장 200~1,100 nm 범위에서 측정된 평균투과율은 76%이었다. 광학 흡수 계수와 광자 에너지의 관계를 나타내는 포물선 관계식을 기초로 하여 광학 밴드갭 에너지를 계산하였다. 박막의 전기적 특성의 경우에, Hall 효과를 측정하여 전하 운반자 농도, 홀 이동도, 전기 비저항을 조사한 결과, 전기적 특성은 열처리 온도에 상당한 의존성을 나타냄을 알 수 있었고, 열처리 온도 500$^{\circ}C$에서 박막의 비저항값은 $4.0{\times}10^{-3}{\Omega}cm$이었다.

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Investigation on Liquid Crystal Alignment Effects of SiNx Thin Film Irradiated by Ion Beam (이온 빔 조사된 SiNx 박막의 액정 배향 효과에 관한 연구)

  • Lee, Sang-Keuk;Kim, Young-Hwan;Kim, Byoung-Yong;Han, Jin-Woo;Kang, Dong-Hun;Kim, Jong-Hwan;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.398-398
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    • 2007
  • Most recently, the Liquid Crystal (LC) aligning capabilities achieved by ion beam exposure on the diamond-like carbon (DLC) thin film layer have been successfully studied. The DLC thin films have a high mechanical hardness, a high electrical resistance, optical transparency and chemical inertness. Nitrogen doped Diamond Like Carbon (NDLC) thin films exhibit properties similar to those of the DLC films and better thermal stability than the DLC films because C:N bonding in the NDLC film is stronger against thermal stress than C:H bonding in the DLC thin films. Moreover, our research group has already studied ion beam alignment method using the NDLC thin films. The nematic liquid crystal (NLC) alignment effects treated on the SiNx thin film layers using ion beam irradiation for three kinds of N rations was successfully studied for the first time. The SiNx thin film was deposited by plasma-enhanced chemical vapor deposition (PECVD) and used three kinds of N rations. In order to characterize the films, the atomic force microscopy (AFM) image was observed. The good LC aligning capabilities treated on the SiNx thin film with ion beam exposure for all N rations can be achieved. The low pretilt angles for a NLC treated on the SiNx thin film with ion beam irradiation were measure.

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Effects of Film Thickness and Annealing Temperature on the Specific Contact Resistivity and the Transmittance of the IZO Layers Grown on p-GaN by Roll-to-Roll Sputtering (p-GaN 위에 Roll-to-Roll sputter로 성장된 IZO의 접촉 비저항 및 투과도에 대한 박막 두께와 열처리 온도의 영향)

  • Kim, Jun Young;Kim, Jae-Kwan;Han, Seung-Cheol;Kim, Han Ki;Lee, Ji-Myon
    • Korean Journal of Metals and Materials
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    • v.48 no.6
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    • pp.565-569
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    • 2010
  • We report on the characteristics of indium-oxide-doped ZnO (IZO) ohmic contact to p-GaN. The IZO ohmic contact layer was deposited on p-GaN by a Roll-to-Roll (RTR) sputter method. IZO contact film with a thickness of 360, 230 and 100 nm yielded an ohmic contact resistance of $4.70{\times}10^{-4}$, $5.95{\times}10^{-2}$, $4.85{\times}10^{-1}\;{\Omega}cm^{2}$ on p-GaN when annealed at $600{^{\circ}C}$ for 1 min under a nitrogen ambient, respectively. While the transmittance of IZO film with a thickness of 360 nm slightly increased in the wavelength range of 380-800 nm after annealing, the transmittance rapidly increased up to 80% after annealing at $600{^{\circ}C}$ in the wavelength range of 380~430 nm because the crystallization of IZO film and created Ga vacancies near the p-GaN surface region were affected by the annealing. These results indicate that ohmic contact resistance and transmittance of the IZO films improved.