• Title/Summary/Keyword: nanowire channel

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Design Optimization of a Type-I Heterojunction Tunneling Field-Effect Transistor (I-HTFET) for High Performance Logic Technology

  • Cho, Seong-Jae;Sun, Min-Chul;Kim, Ga-Ram;Kamins, Theodore I.;Park, Byung-Gook;Harris, James S. Jr.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.11 no.3
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    • pp.182-189
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    • 2011
  • In this work, a tunneling field-effect transistor (TFET) based on heterojunctions of compound and Group IV semiconductors is introduced and simulated. TFETs based on either silicon or compound semiconductors have been intensively researched due to their merits of robustness against short channel effects (SCEs) and excellent subthreshold swing (SS) characteristics. However, silicon TFETs have the drawback of low on-current and compound ones are difficult to integrate with silicon CMOS circuits. In order to combine the high tunneling efficiency of narrow bandgap material TFETs and the high mobility of III-V TFETs, a Type-I heterojunction tunneling field-effect transistor (I-HTFET) adopting $Ge-Al_xGa_{1-x}As-Ge$ system has been optimized by simulation in terms of aluminum (Al) composition. To maximize device performance, we considered a nanowire structure, and it was shown that high performance (HP) logic technology can be achieved by the proposed device. The optimum Al composition turned out to be around 20% (x=0.2).

Modulation of electrical properties of GaN nanowires (GaN 나노선의 전기적 특성제어)

  • Lee, Jae-Woong;Ham, Moon-Ho;Myoung, Jae-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.11-11
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    • 2007
  • 1차원 구조체인 반도체 나노선은 앙자제한효과 (quantum confinement effect) 등을 이용하여 고밀도/고효율의 소자 개발이 기대되고 있다. GaN는 상온에서 3.4 eV의 밴드갭 에너지를 갖는 III-V 족 반도체 재료로써 박막의 경우 광전자 소자로 폭넓게 응용되고 있다. 최근 GaN 나노선의 합성에 성공하면서 발광소자, 고효율의 태양전지, HEMT 등으로의 응용을 위한 많은 연구가 활발히 이루어지고 있다. 하지만, 아직까지 GaN 나노선의 전기적 특성을 제어하는 기술은 확립되지 않고 있다. 본 연구에서는 Vapor solid (VS)법을 이용하여 GaN 나노선을 합성하였으며, GaN 분말과 함께 $Mg_2N_3$ 분말을 첨가하여 (Ga,Mg)N 나노선을 성공적으로 합성하였다. 합성시에 GaN와 Mg 소스간의 거리 변화를 통해 Mg 도핑농도를 제어하고자 하였다. 이 같은 방법으로 합 된 (Ga,Mg)N 나노선의 Mg 도핑농도에 따른 결정학적 특성을 알아보고, (Ga,Mg)N 나노선을 이용하여 소자를 제작한 후 그 전기적 특성을 살펴보고자 한다. X-ray diffraction (XRD)과 high-resolution transmission electron microscopy (HRTEM), EDX를 이용하여 합성된 나노선의 결정학적 특성과 Mg의 도핑 농도를 확인하였다. Photo lithography와 e-beam lithography법을 이용하여 (Ga,Mg)N 나노선 field-effect transistor (FET)를 제작하고, channel current-drain voltage ($I_{ds}-V_{ds}$) 와 channel current-gate voltage ($I_{ds}-V_g$) 측정을 통해 (Ga,Mg)N 나노선이 도핑 농도에 따라 n형에서 p형으로 전기적 특성이 변화함을 확인하였다.

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Fin의 두께와 높이 변화에 따른 22 nm FinFET Flash Memory에서의 전기적 특성

  • Seo, Seong-Eun;Kim, Tae-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.329-329
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    • 2012
  • Mobile 기기로 둘러싸여있는 현대의 환경에서 Flash memory에 대한 중요성은 날로 더해가고 있다. Flash memory의 가격 경쟁력 강화와 사용되는 기기의 소형화를 위해 flash memory의 비례축소가 중요한 문제로 부각되고 있다. 그러나 다결정 실리콘을 플로팅 게이트로 이용하는planar flash memory 소자의 경우 비례 축소 시 short channel effect 와 leakage current, subthreshold swing의 증가로 인한 성능저하와 같은 문제들로 인해 한계에 다다르고 있다. 이를 해결하기 위해 CTF 메모리 소자, nanowire FET, FinFET과 같은 새로운 구조를 가지는 메모리소자에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 22 nm 게이트 크기의 FinFET 구조를 가지는 플래시 메모리소자에서 fin의 두께와 높이의 변화에 따른 메모리 소자의 전기적 특성을 3-dimensional 구조에서 technology computer aided design ( TCAD ) tool을 이용하여 시뮬레이션 하였다. 본 연구에서는 3D FinFET 구조를 가진 플래시 메모리에 대한 시뮬레이션 하였다. FinFET 구조에서 채널영역은 planar 구조와 다르게 표면층이 multi-orientation을 가지므로 본 계산에서는 multi-orientation Lombardi mobility model을 이용하여 계산하였다. 계산에 사용된 FinFET flash memory 구조는 substrate의 도핑농도는 $1{\times}10^{18}$로 하였으며 source, drain, gate의 도핑농도는 $1{\times}10^{20}$으로 설정하여 계산하였다. Fin 높이는 28 nm로 고정한 상태에서 fin의 두께는 12 nm부터 28nm까지 6단계로 나누어서 각 구조에 대한 프로그램 특성과 전기적 특성을 관찰 하였다. 계산결과 FinFET 구조의 fin 두께가 두꺼워 질수록 채널형성이 늦어져 threshold voltage 값이 커지게 되고 subthreshold swing 값 또한 증가하여 전기적 특성이 나빠짐을 확인하였다. 각 구조에서의 전기장과 전기적 위치에너지의 분포가 fin의 두께에 따라 달라지므로써 이로 인해 프로그램 특성과 전기적 특성이 변화함을 확인하였다.

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Scattering characteristics of metal and dielectric optical nano-antennas

  • Ee, Ho-Seok;Lee, Eun-Khwang;Song, Jung-Hwan;Kim, Jinhyung;Seo, Min-Kyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.76.1-76.1
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    • 2015
  • Optical resonances of metallic or dielectric nanoantennas enable to effectively convert free-propagating electromagnetic waves to localized electromagnetic fields and vice versa. Plasmonic resonances of metal nanoantennas extremely modify the local density of optical states beyond the optical diffraction limit and thus facilitate highly-efficient light-emitting, nonlinear signal conversion, photovoltaics, and optical trapping. The leaky-mode resonances, or termed Mie resonances, allow dielectric nanoantennas to have a compact size even less than the wavelength scale. The dielectric nanoantennas exhibiting low optical losses and supporting both electric and magnetic resonances provide an alternative to their metallic counterparts. To extend the utility of metal and dielectric nanoantennas in further applications, e.g. metasurfaces and metamaterials, it is required to understand and engineer their scattering characteristics. At first, we characterize resonant plasmonic antenna radiations of a single-crystalline Ag nanowire over a wide spectral range from visible to near infrared regions. Dark-field optical microscope and direct far-field scanning measurements successfully identify the FP resonances and mode matching conditions of the antenna radiation, and reveal the mutual relation between the SPP dispersion and the far-field antenna radiation. Secondly, we perform a systematical study on resonant scattering properties of high-refractive-index dielectric nanoantennas. In this research, we examined Si nanoblock and electron-beam induced deposition (EBID) carbonaceous nanorod structures. Scattering spectra of the transverse-electric (TE) and transverse-magnetic (TM) leaky-mode resonances are measured by dark-field microscope spectroscopy. The leaky-mode resonances result a large scattering cross section approaching the theoretical single-channel scattering limit, and their wide tuning ranges enable vivid structural color generation over the full visible spectrum range from blue to green, yellow, and red. In particular, the lowest-order TM01 mode overcomes the diffraction limit. The finite-difference time-domain method and modal dispersion model successfully reproduce the experimental results.

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Steep subthreshold slope at elevated temperature in junctionless and inversion-mode MuGFET (고온에서 무접합 및 반전모드 MuGFET의 문턱전압 이하에서 급격히 작은 기울기 특성)

  • Lee, Seung-Min;Park, Jong-Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.9
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    • pp.2133-2138
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    • 2013
  • In this paper, the variation of a steep subthreshold slope at elevated temperature in nanowire n-channel junctionless and inversion mode MuGFETs has been compared. It has been observed that the subthreshold slopes are increased with the increase of the operation temperature in junctionless and inversio-mode transistors. The variation of a subthreshold slope with operation temperature is more significant in junctionless transistor than inversion-mode transistor. The temperature dependence on the variation of a subthreshold slope for different fin widths shows a similar behavior regardless of fin width. From the temperature dependence on the variation of a subthreshold slope for different substrate biases, it has been observed that the variation of a subthreshold slope is less significant when the substrate bias was applied. It is worth noting that one can achieve a subthreshold slope of below 41mV/dec at elevated temperature of 400K using the junctionless MuGFETs with a positive substrate bias.

Direct Transfer Printing of Nanomaterials for Future Flexible Electronics

  • Lee, Tae-Yun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.3.1-3.1
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    • 2011
  • Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

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Label-free Femtomolar Detection of Cancer Biomarker by Reduced Graphene Oxide Field-effect Transistor

  • Kim, Duck-Jin;Sohn, Il-Yung;Jung, Jin-Heak;Yoon, Ok-Ja;Lee, N.E.;Park, Joon-Shik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.549-549
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    • 2012
  • Early detection of cancer biomarkers in the blood is of vital importance for reducing the mortality and morbidity in a number of cancers. From this point of view, immunosensors based on nanowire (NW) and carbon nanotube (CNT) field-effect transistors (FETs) that allow the ultra-sensitive, highly specific, and label-free electrical detection of biomarkers received much attention. Nevertheless 1D nano-FET biosensors showed high performance, several challenges remain to be resolved for the uncomplicated, reproducible, low-cost and high-throughput nanofabrication. Recently, two-dimensional (2D) graphene and reduced GO (RGO) nanosheets or films find widespread applications such as clean energy storage and conversion devices, optical detector, field-effect transistors, electromechanical resonators, and chemical & biological sensors. In particular, the graphene- and RGO-FETs devices are very promising for sensing applications because of advantages including large detection area, low noise level in solution, ease of fabrication, and the high sensitivity to ions and biomolecules comparable to 1D nano-FETs. Even though a limited number of biosensor applications including chemical vapor deposition (CVD) grown graphene film for DNA detection, single-layer graphene for protein detection and single-layer graphene or solution-processed RGO film for cell monitoring have been reported, development of facile fabrication methods and full understanding of sensing mechanism are still lacking. Furthermore, there have been no reports on demonstration of ultrasensitive electrical detection of a cancer biomarker using the graphene- or RGO-FET. Here we describe scalable and facile fabrication of reduced graphene oxide FET (RGO-FET) with the capability of label-free, ultrasensitive electrical detection of a cancer biomarker, prostate specific antigen/${\alpha}$ 1-antichymotrypsin (PSA-ACT) complex, in which the ultrathin RGO channel was formed by a uniform self-assembly of two-dimensional RGO nanosheets, and also we will discuss about the immunosensing mechanism.

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Comparative Analysis of PBTI Induced Device Degradation in Junctionless and Inversion Mode Multiple-Gate MOSFET (PBTI에 의한 무접합 및 반전모드 다중게이트 MOSFET의 소자 특성 저하 비교 분석)

  • Kim, Jin-Su;Hong, Jin-Woo;Kim, Hye-Mi;Lee, Jae-Ki;Park, Jong-Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.1
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    • pp.151-157
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    • 2013
  • In this paper, a comparative analysis of PBTI induced device degradation in nanowire n-channel junctionless and inversion mode Multiple-Gate MOSFET(MuGFETs) has been performed. It has been observed that the threshold voltage is increased after PBTI stress and the threshold voltage variation of junctionless device is less significant than that of inversion mode device. However the degradation rate of junctionless device is less significant than that of inversion mode device. The activation energy of the device degradation is larger in inversion mode device than junctionless device. In order to analyze the more significant PBTI induced device degradation in inversion mode device than junctionless device, 3-dimensional device simulation has been performed. The electron concentration in inversion mode device is equal to the one in junctionless device but the electric field in inversion mode device is larger than junctionless device.