• Title/Summary/Keyword: nano pillar

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Biomimetics of Nano-pillar (나노섬모의 자연모사 기술)

  • Hur, Shin;Choi, Hong-Soo;Lee, Kyu-Hang;Kim, Wan-Doo
    • Elastomers and Composites
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    • v.44 no.2
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    • pp.98-105
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    • 2009
  • The cochlea of the inner ear has two core components, basilar membrane and hair cells. The basilar membrane disperses incoming sound waves by their frequencies. The hair cells are on the basilar membrane, and they are the sensory receptors generating bioelectric signals. In this paper, a biomimetic technology using ZnO piezoelectric nano-pillar was studied as the part of developing process for artificial cochlea and novel artificial mechanosensory system mimicking human auditory senses. In particular, ZnO piezoelectric nano-pillar was fabricated by both low and high temperature growth methods. ZnO piezoelectric nano-pillars were grown on solid (high temperature growth) and flexible (low temperature growth) substrates. The substrates were patterned prior to ZnO nano-pillar growth so that we can selectively grow ZnO nano-pillar on the substrates. A multi-physical simulation was also conducted to understand the behavior of ZnO nano-pillar. The simulation results show electric potential, von Mises stress, and deformation in the ZnO nano-pillar. Both the experimental and computational works help characterize and optimize ZnO nano-pillar.

Nano-Scale Cu Direct Bonding Technology Using Ultra-High Density, Fine Size Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integrated System

  • Lee, Kang-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.69-77
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    • 2016
  • We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

The formation of nano pillar arrays with p-type silicon using electrochemical etching (Electrochemical etching을 이용한 P형 실리콘에서의 nano pillar arrays 형성)

  • Ryu, Han-Hee;Kong, Seong-Ho;Kim, Jae-Hyun
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1529_1530
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    • 2009
  • The process conditions for fabricating p-type silicon pillars were optimized by controlling current density, bath temperature. To get best process flexibility for pillar arrays formation, three factors affecting pillar formation were changed. First, the solution bath was designed to keep constant temperature during the experiment irrespective of external temperature. Second, the counter Pt electrode was changed from rod type to mesh to obtain uniform distribution of current density. Third, Cr-Cu alloy electrode instead of Cu was used to increase electrode current density.

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Molecular Dynamics Simulation for Compression Test of PMMA Nano Pillars (PMMA 나노 기둥의 압축시험에 대한 분자동역학 해석)

  • Kim, Jung-Yup;Kim, Jae-Hyun;Choi, Byung-Ik
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.502-505
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    • 2007
  • PMMA has been extensively adopted in Nano Imprint Lithography(NIL). PMMA nano-structures experience severe mechanical load and deformation during NIL process, and understanding its mechanical behavior is very important in designing and optimizing NIL process. One of the most promising techniques for characterizing the mechanical behavior of nano structures is nano pillar compression test. In this study, the mechanical behaviors of PMMA pillars during compression test are analyzed using Molecular Dynamics. Two methods for simulation of PMMA nano pillars are proposed. The stress-strain relationship of nano-scale PMMA structure is obtained based on CVFF(Covalent Valence Force Fields) potential and the dependency of the applied strain rate on the stress-strain relationship is analyzed. The obtained stress-strain relationships can be useful in simulating nano-scale PMMA structures using Finite Element Method(FEM) and understanding the experimental results obtained by compression test of PMMA nano pillars.

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Manufacture of High-Aspect-Ratio Polymer Nano-Hair Arrays by UV Nano Embossing Process (UV 나노 엠보싱 공정을 이용한 고종횡비 고분자 나노 섬모 어레이 제작)

  • Kim Dong-Sung;Lee Hyun-Sup;Lee Jung-Hyun;Lee Kun-Hong;Kwon Tai-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.7 s.250
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    • pp.773-778
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    • 2006
  • High-aspect-ratio nano-hair or nano-pillar arrays have great potential in a variety of applications. In this study, we present a simple and cost-effective replication method of high-aspect-ratio polymer nano-hair arrays. Highly ordered nano-porous AAO (anodic aluminum oxide) template was utilized as a reusable nano-mold insert. The AAO nano-mold insert fabricated by the two-step anodization process in this study had close- packed straight nano-pores, which enabled us to replicate densely arranged nano-hairs. The diameter, depth and pore spacing of the nano-pores in the fabricated AAO nano-mold insert were about 200nm, $1{\mu}m$ and 450nm, respectively. For the replication of polymer nano-hair arrays, a UV nano embossing process was applied as a mass production method. The UV nano embossing machine was developed by our group for the purpose of replicating nano-structures by means of non-transparent nano-mold inserts. Densely arranged high-aspect-ratio nano-hair arrays have been successfully manufactured by means of the UV nano embossing process with the AAO nano-mold insert under the optimum processing condition.

Nano Pillar의 두께에 따라 적용된 AlGaInP Vertical LED의 광추출효율 향상 연구

  • Ryu, Ho-Seong;Park, Min-Ju;Baek, Jong-Hyeop;O, Hwa-Seop;Gwak, Jun-Seop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.593-593
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    • 2013
  • 나노패턴 제작은 차세대 초고밀도 반도체 메모리기술과 바이오칩 등 나노기술의 핵심 분야로, 나노패턴 구조를 나노-바이오 전자소자 및 반도체 산업분야에 적용할 경우 시장 선점 및 막대한 부가가치 창출 등을 통해 국가경쟁력 강화에 크게 기여할 것으로 기대된다. 하지만 대면적 패턴형성이 어려워 뿐만 아니라 $300^{\circ}$ 이상의 열처리 과정에 의한 생산성이 떨어진다. 또한 나노구조가 잘 이루어진 차원, 표면상태, 결정성, 화학적 조성을 갖도록 하는 합성 및 제조상의 어려움 때문이다. 이에 반해 자기정렬 ITO Dot 형성은 상기 기술한 1차원 나노구조형성을 하는 것에 비하여, 나노구조를 제작하기 위하여 공정이 단순하며, 비용 및 생산성 측면에서 유리 할 것으로 생각된다. 이에 본 연구는 E-beam을 이용하여 형성된 ITO 박막에 HCl solution을 이용하여 자기정렬 ITO Dot 형성 후 n-AlGaInP Vertical LED[VLED] 표면에 nano pillar의 두께에 각기 다르게 형성하였으며, 최종적으로 제작된 VLED의 전기적, 광학적 특성을 조사하였다.

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Nano-master fabrication for photonic crystal waveguides (광결정 도파로용 나노 마스터 제작)

  • 최춘기;한상필;정명영
    • Journal of the Korean Vacuum Society
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    • v.12 no.4
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    • pp.288-292
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    • 2003
  • The fabrication of silicon nano-master with pillar structures using E-beam lithography and ICP etching was investigated for application of 2-dimensional polymer photonic crystal waveguides with air hole structures. Pillar structures with square, hexagon, dodecagon and circle were successfully fabricated. The diameters and structures of fabricated pillars were measured by CD-SEM and SPM-AFM. It was found that the optimal dose for complete circle pillar structures was 432 $\mu$C/$\textrm{cm}^2$.

The study about phase phase change material at nano-scale using c-AFM method (c-AFM 기술을 이용한 나노급 상변화 소자 특성 평가에 대한 연구)

  • Hong, Sung-Hoon;Lee, Heon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.57-57
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    • 2010
  • In this study, nano-sized phase change materials were evaluated using nanoimprint lithography and c-AFM technique. The 200nm in diameter phase change nano-pillar device of GeSbTe, AgInSbTe, InSe, GeTe, GeSb were successfully fabricated using nanoimprint lithography. And the electrical properties of the phase change nano-pillar device were evaluated using c-AFM with pulse generator and voltage source.

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Fabrication of metallic nano-stamper to replicate nanoscale patterns (나노패턴 성형을 위한 금속 나노 스탬퍼 제작)

  • 김영규;이동철;강신일
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.481-484
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    • 2003
  • In this study, we fabricated the master metallic nano-stamper with nano pillar patterns to apply replication processes which is adequate for mass production. Master nano patterns with various hole diameters between 300 nm and 1000 nm was fabricated by e-beam lithography. After the seed layer was deposited on the master nano patterns using e-beam evaporation, the nickel was electroformed. In each step, the shape and surface roughness of their patterns were analyzed using SEM and AFM.

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