• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.954-960
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• 2008

The effects of elastic modulus coefficient and linear expansion coefficient of overhead distribution power line(ACSR $58 mm^2$) on sag behavior in distribution line have been investigated to clarify the difference between specification and experimental level. The elastic modulus coefficients of Al wire and steel wire were $5,182.6 kgf/mm^2,\;18,348.8 kgf/mm^2$, respectively Therefore, the computational composition elastic modulus coefficient of the power line was $7,063.5 kgf/mm^2$, while that of experimentally measured was $7681.1 kgf/mm^2$. As a result, we found that elastic modulus coefficient which was experimentally measured was higher than that of computational by 8.7 %. However, when planner designs the sag of disoibution line, the elastic modulus coefficient of power line $8,400 kgf/mm^2$ should be generally adopted. These two different using values lead to the sag difference of 0.62 m. The other results will be discussed.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2005.11a
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• pp.183-186
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• 2005

This study investigates material properties of epoxy resins and reinforced materials for adhesion repairing-reinforced of RC construction. According to the test. elasticity modulus of mortar indicated 16-26(GPa) and that of concrete was 18-27(GPa). It became decreased as mixture proportion, W/C and fluidity of both mortar and concrete increased In addition the elasticity modulus of epoxy resins exhibited around 45.3-220(GPa), while that of steel plate and Carbon Bar indicated 338(GPa) and 34.1 (GPa), respectively. It is obvious that individual materials had big different value of elasticity modulus. Meanwhile, thermal expansion coefficients of mortar was 10-13 ${\mu}\varepsilon$ /$^{\circ}C$ and that of concrete was 9-11 $\mu \varepsilon$ /$^{\circ}C$ The increase of mixture Voportion and W/C resulted in lower value of thermal expansion coefficients and the increase of flow and slump exhibited slightly higher value. The epoxy resin indicated 41-54 ${\mu}\varepsilon$ /$^{\circ}C$ which is 4-5 times larger value than concrete and steel plate and Carbon Bar was 11.93 ${\mu}\varepsilon$ /$^{\circ}C$ and -1.68 ${\mu}\varepsilon$ /$^{\circ}C$ respectively. Hence, the adhesion strength of the epoxy resins should be considered before it is used in field condition, due to different thermal expansion coefficient of each material.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.82-88
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• 2007

This work is to fabricate a precise optical fiber array using polymer composite for optical interconnection. Optical fiber array has to satisfy low optical loss requirement less than 0.4 dB according to temperature change. For this purpose, design criteria for an optical fiber array was derived. The coefficient of thermal expansion of silica particulate epoxy composites was affected by volume fraction of silica particles. And also, elastic modulus of silica particulate epoxy composites was affected by volume fraction of silica particles. To obtain the coefficients of thermal expansion below $10{\times}10E-6/^{\circ}C$ and elastic modulus more than 20 GPa , we chose the volume fraction more than 76%. Using silica particulate epoxy composites with the volume fraction 76%, 8-channel optical fiber array with dimensional tolerances below $1\;{\mu}m$ was manufactured by transfer molding technique using dies with the uniquely-designed core pin and precisely-machined zirconia ceramic V block. These optical fiber arrays showed optical loss variations within 0.4 dB under thermal cycling test and high temperature test.

• Journal of Korea Foundry Society
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• v.17 no.1
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• pp.51-57
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• 1997

Effects of the amount of flake type graphite, morphology and (V,Mo)carbides on the specific damping capacity of austenitic low thermal expansion cast irons were investigated. Specific damping capacity(SDC) of low thermal expansion cast irons increased with the increased amount of graphite. Specific damping capacity of low thermal expansion cast iron decreased with the increased Young's modulus. In the case of V and Mo addition, SDC decreased with the increased amount of carbides. Specific damping capacity increased about 2% by the movement of magenetic domains which appeared in ferromagnetic materials.

• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.4
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• pp.192-199
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• 2004

Elastic-factor of elastic epoxy were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis), TGA (Thermogravimetric Analysis) and FESEM (Field Emission Scanning Electron Microscope) for structure-images analysis as toughness-investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20($^{\circ}C$) to $200^{\circ}(C)$, and TGA was changed from $0^{\circ}(C)$ to $600^{\circ}(C)$. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices with the content of 0(phr), 20(phr) and 35(phr). Also, thermal expansion coefficient (a), high temperature, modulus and loss factor were investigated through TMA, TGA, and DMTA. In addition, the structure of specimens was analyzed through FESEM, and then elastic-factor of elastic epoxy was visually showed by FESEM. As thermal analysis results, 20(phr) was more excellent than 30(phr) thermally and mechanically. Specially, thermal expansion coefficient, high temperature, modulus, and damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.128-130
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• 2003

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.310-315
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• 2000

We analyzed thermal stress of the STS VOD ladle by the variation of material property of refractory, and determined the location of back filler using FE analysis. Thermal distribution of refractory of ladle between hot face and back face were decreased by the increasing the thermal conductivity, and thermal stress of refractory were decreased about 2 to 4 times with the decreasing the young's modulus coefficients. Back filler, which is constructed to absorb the thermal expansion of dolomite refractory, has relatively low thermal conductivity. Inner side of refractory of ladle maintained high temperature, but temperature of outer side of ladle decreased low. Consequently, inner expansion and outer contraction were appeared. and thermal stress were increased, so thermal stress by the construction of back filler were increased.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.150-152
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• 2007

It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1609-1618
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• 1997

Thermo-mechanical behaviors of polymer matrix composite(PMC) with continuous TiNi fiber are studied using theoretical analysis with 1-D analytical model and numerical analysis with 2-D multi-fiber finite element(FE) model. It is found that both compressive stress in matrix and tensile stress in TiNi fiber are the source of strengthening mechanisms and thermo-mechanical coupling. Thermal expansion of continuous TiNi fiber reinforced PMC has been compared with various mechanical behaviors as a function of fiber volume fraction, degree of pre-strain and modulus ratio between TiNi fiber and polymer matrix. Based on the concept of so-called shape memory composite(SMC) with a permanent shape memory effect, the critical modulus ratio is determined to obtain a smart composite with no or minimum thermal deformation. The critical modulus ratio should be a major factor for design and manufacturing of SMC.