• 센서학회지
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• 제14권1호
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• pp.22-27
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• 2005

A thermoelectric flow sensor for small quantity of gas flow rate was fabricated using silicon wafer semiconductor process and bulk micromachining technology. Evanohm R alloy heater and chromel-constantan thermocouples were used as a generation heat unit and sensing parts, respectively. The heater and thermocouples are thermally isolated on the $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$ laminated membrane. The characteristics of this sensor were observed in the flow rate range from 0.2 slm to 1.0 slm and the heater power from 0.72 mW to 5.63 mW. The results showed that the sensitivities $(({\partial}({\Delta}V)/{\partial}(\dot{q}));{\;}{\Delta}V$ : voltage difference, $\dot{q}$ : flow rate) were increased in accordance with heater power rise and decreasing of flow rate.

• 센서학회지
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• 제9권3호
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• pp.196-202
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• 2000

본 논문에서는 3축의 가속도를 검출하기 위한 새로운 방식인 브리지조합 검출원리를 제안하고, SOI 구조의 웨이퍼를 이용하여 $200^{\circ}C$ 이상 고온에서 동작이 가능한 압저항형 실리콘 가속도센서를 제작하였다. 제작된 센서의 감도는 x 및 y축이 8mV/V G, z 축이 40mV/V G 이였다. 그리고 출력전압의 비선형성은 1.6%FS, 타축감도는 약 4.6% 이하였다. 이것은 외부 연산회로를 이용하여 3축의 가속도성분을 검출하는 방법에 비해 검출방식은 간단하면서도, 특성은 거의 동일하였다. 또한 SOI 구조를 이용하여 고온에서도 안정한 동작을 하였다. 제작된 가속도센서의 오프셋전압 온도계수와 감도 온도계수는 $27^{\circ}C$에서 각각 $1033ppm^{\circ}C^{-1}$와 $1145ppm^{\circ}C^{-1}$이였다.

• 대한기계학회논문집A
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• 제26권3호
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• pp.428-435
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• 2002

Pyroelectric $Pb(Zr_{0.3}Ti_{0.7})O_3$ (PZT30/70) thin film IR detectors has been fabricated and characterised. The PZT30/70 thin film was deposited onto $Pt/Ti/Si_3N_4/SiO_2/Si$ substrate by the sol-gel process. Four different substrate conditions were studied for their effects on the pyroelectric responses of the IR detectors. The substrate conditions were the combinations of the Si etching and the Pt/Ti patterning. In the Si etched substrate, the $Si_3N_4/SiO_2$ composite layer was used as silicon etch-stop, and was used as the membrane to support the PZT pyroelectric film element as well. The measured pyroelectric current and voltage responses of detectors fabricated on the micro-machined thin $Si_3N_4/SiO_2$ membrane were two orders higher than those of the detectors on the bulk-silicon. For detectors on the membrane substrate, the Pt/Ti patterned detectors showed a 2-times higher pyroelectric response than that of not-patterned detectors. On the other hand, the pyroelectric response of the detectors on the not-etched Si substrate was almost the same, regardless of the Pt/Ti patterning. It was also found that the rise time strongly depended on the substrate thickness: the thicker the substrate was, the longer the rise-time.

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.31-36
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• 2009

In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.

• 센서학회지
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• 제9권5호
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• pp.380-388
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• 2000

LIGA-like 공정을 이용하여 고종횡비를 갖는 초소형 니켈 터빈을 제작하기 위하여 블레이드에 대한 유한 요소 해석을 수행하여 안전한 운전 조건을 연구하였다. 이 해석으로부터 터빈의 입구와 출구의 압력 차이가 44kPa 정도일 때에 항복강도를 넘지 않도록 해야 하며 축의 외경과 터빈 날개의 내경 사이의 접촉에 의한 마찰계수와 최대 응력 사이의 관계는 약간 반비례하는 경향을 보였다. 즉, 터빈이 회전하는 상태에서 최대 응력은 접촉 마찰이 증가함에 따라 감소했다. 터빈과 같이 반복하중을 받는 부분은 취성이 강한 실리콘보다는 금속으로 제작해야 하며 이를 위해서는 표면 미세 가공 보다 LTGA-like 공정으로 제작되어야 한다. 본 연구는 초소형 구조물에서 움직이는 부분과 고정된 부분의 접촉 문제를 갖는 여러 종류의 문제를 다루는 데에 이용될 수 있다.

• 대한융합한의학회지
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• 제2권1호
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• pp.5-12
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• 2021

Objectives: The purpose of this study is to fabricate an ultra-fine ginsenoside particle atomizer that can provide a new treatment method by delivering ginsenoside components that have a therapeutic effect on respiratory diseases directly to the lungs. Methods: We fabricated the AAO vibrating mesh by using the micromachining process. The starting substrate of an AAO wafer has a 350nm pore diameter with 50㎛ thickness. A photomask having several 5㎛ opening holes with a 100㎛ pitch was used to separate each nanopore nozzle. The photoresist structure was optimized to pattern the nozzle area during the lift-off process precisely. The commercial vibrating mesh was removed from OMRON's NE-U100 product, and the fabricated AAO vibrating mesh was installed. A diluted sample of 20mL with 30% red ginseng concentrate was prepared to atomize from the device. Results: As a result of liquid chromatography analysis before spraying the ginsenoside solution, ginsenoside components such as 20S-Rg3, 20R-Rg3, and Rg5 were detected. After spraying through the AAO vibrating mesh, ginsenosides of the same component could be detected. Conclusion: A nutrient solution containing ginsenosides was successfully sprayed through the AAO vibrating mesh with 350 nm selective pores. In particular, during the atomizing experiment of ginsenoside drug solution having excellent efficacy in respiratory diseases, it was confirmed that atomizing through the AAO vibrating mesh while maintaining most of the active ingredients was carried out.

• 대한기계학회논문집A
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• 제36권10호
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• pp.1189-1193
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• 2012

본 연구는 초소형 광학 시스템을 구현할 수 있는 설계 및 제작의 방법론을 제시하고자 한다. 초소형 광학계에서는 조명 및 결상 광학소자의 성능과 소형화가 조광면의 균질도와 결상 된 이미지의 선명도에 중요한 영향을 미치게 된다. 본 연구에서는 얇은 두께로 실효 광도를 배가시키기 위한 초박형의 LED 빔조형 렌즈를 설계 제작하였다. 상기 렌즈는 중앙부의 비구면렌즈와 외각의 전반사 프레넬 가장자리 부로 구성되어 있다. 설계된 LED 빔조형 렌즈(직경 4.7 mm, 두께 0.6 mm)는 다이아몬드 선삭으로 중앙 비구면부의 전반사(TIR) 가장자리가 정밀하게 가공되었으며, LED 의 빔각을 150 도에서 17.5 도로 축소 시켰다. 다른 광학소자들 마이크로 프리즘, 결상광학용 프레넬 렌즈, 광가이드는 다양한 마이크로 나노 크기의 제조공정으로 일체형으로 성형되었다. 시작품으로 제작된 초소형 광학계($6.8{\times}2.2{\times}2.5mm$)는 마이크로 패턴을 결상의 가능성을 보여주었고, 지문인식용 초소형광학계로서의 성능을 검증하였다.

• 센서학회지
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• 제6권1호
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• pp.72-80
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• 1997

실리콘 공정을 이용하여 마이크로 밸브(valve)를 제작할 때에 역방향 누설 유량은 중요한 문제중 하나이다. 본 논문에서는 플래퍼(flapper)와 노즐(nozzle)을 이용하여 누설 유량이 없는 마이크로 밸브를 설계하고, 실리콘 공정을 이용하여 제작하였다. 제작된 마이크로 밸브의 작동원리는 정방향 압력이 가해질 때에는 유체의 압력이 플래퍼를 위로 밀어서 유체를 흐르게 하고, 역방향 압력이 가해질 때에는 플래퍼를 밀지만 이때는 노즐의 입구에 의해 지지되므로 플래퍼나 노즐이 깨지지 않는 한 유체가 흐를 수 없게 된다. 노즐은 (100) 웨이퍼를 습식식각하여 제작하였고, 플래퍼는 역형상을 $20{\mu}m$만큼 플라즈마 식각장비(RIE)로 수직 식각한 뒤 뒷면에서부터 습식식각을 하여 제작하였다. 제작된 마이크로 플래퍼-노즐 밸브의 정적특성을 해석하였고, 순수를 사용한 실험결과와 비교하였다. 실험결과는 제작된 마이크로 플래퍼-노즐 밸브가 완전한 다이오드적인 특성을 가진다는 것을 보여 주었다.

• 한국표면공학회지
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• 제46권3호
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• pp.99-104
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• 2013

The simple and cost-effective microfabrication method of photosensitive glass (PSG) using metal patterning and blank exposure was proposed. Conventional photolithography for micromachining of PSG needs a costly quartz mask which has high transmittance as an optical property. However, in this study the process was improved through the combination of micro-patterned Ti thin film and blank UV exposure without quartz mask. The effect of UV exposure time as well as the DHF etching condition was investigated. UV exposure test was performed within the range from 3 min to 9 min. The color and etch result of PSG exposed for 5 min were the most clear and effective to etch more precisely, respectively. The etching results of PSG in diluted hydrofluoric acid (DHF) with a concentration of 5, 10, 15 vol% were compared. The effect on the side etch was insignificant while the etch rate was proportional as the concentration increased. 10 vol% DHF results not only high etch rate of 75 ${\mu}m/min$ also lower side etch value after PSG etching. This method facilitates the microfabrication of PSG with various patterns and high aspect ratio for applying to advanced applications.