• Journal of the Korea Institute of Information and Communication Engineering
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• v.4 no.5
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• pp.1151-1156
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• 2000

In this paper, we report a fabrication of InP-based microstructurs for III-V compound semiconductor micromachining. Vertical liquid phase epitaxy(LPE) system was used in order to grow the InP/lnGaAsP/InP layers. The thicknesses of InP top-layer and InGaAsP were $1\mum \;and \;0.4\mum$, respectively. The fabrication of InGaAsP microstructures involves front-side bulk micromachining. The experimental result showed the beams must be carefully aligned in the <100> direction since the etching of the beam in the <100> direction is more faster than that of the beam in the <110> and <110> direction.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2000.05a
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• pp.447-450
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• 2000

In this paper, we report a fabrication of InP-based microstructurs for III-V compound semiconductor micromachining. Vertical liquid phase epitaxy(LPE) system was used in order to grow the Inp/InGaAsP/InP layers. The thicknesses of InP top-layer and InGaAsP were 1$\mu\textrm{m}$ and 0.4$\mu\textrm{m}$ respectively. The fabrication of InGaAsP microstructures involves front side bulk micromachining. The experimental result showed the beams must be carefully aligned in the <110> direction since the lateral etching of the beam in the <110> direction is more faster than that of the beam in the <100> direction.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.958-962
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• 2002

This paper reports on the fabrication of free-standing microstructures by DRIE (deep reactive ion etching). SOI (Si-on-insulator) structures with buried cavities are fabricated by SDB (Si-wafer direct bonding) technology and electrochemical etch-stop. The cavity was formed the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the formed cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing (100$0^{\circ}C$, 60 min.), the SDB SOI structure with a accurate thickness and a good roughness was thinned by electrochemical etch-stop in TMAH solution. Finally, it was fabricated free-standing microstructures by DRIE. This result indicates that the fabrication technology of free-standing microstructures by combination SDB, electrochemical etch-stop and DRIE provides a powerful and versatile alternative process for high-performance bulk micromachining in MEMS fields.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.3
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• pp.529-536
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• 2001

We investigate a surface-micromachined capacitive accelerometer with the grid-type electrodes surrounded by a perforated proof-mass frame. An electromechanical analysis of the microaccelerometer has been performed to obtain analytical formulae for natural frequency and output sensitivity response estimation. A set of prototype devices has been designed and fabricated based on a 4-mask surface-micromachining process. The resonant frequency of 5.8$\pm$0.17kHz and the detection sensitivity of 0.28$\pm$0.03mV/g have been measured from the fabricated devices. The parasitic capacitance of the detection circuit with a charge amplifier has been measured as 3.34$\pm$1.16pF. From the uncertainty analysis, we find that the major uncertainty in the natural frequency of the accelerometer comes from the micromachining error in the beam width patterning process. The major source of the sensitivity uncertainty includes uncertainty of the parasitic capacitance, the inter-electrode gap and the resonant frequency, contributing to the overall sensitivity uncertainty in the portions of 75%, 14% and 11%, respectively.

• International Journal of CAD/CAM
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• v.6 no.1
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• pp.183-192
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• 2006

A CAD/CAM system has been developed for rapid prototyping (RP) of microfluidic devices based on excimer laser micromachining. The system comprises of two complementary softwares. One, the CAM tool, creates part programs from CAD models. The other, the Simulator Tool, uses a part program to generate the laser tool path and the 2D and 3D graphical representation of the machined microstructure. The CAM tool's algorithms use the 3D geometry of a microstructure, defined as an STL file exported from a CAD system, and process parameters (laser fluence, pulse repetition frequency, number of shots per area, wall angle), to automatically generate Numerical Control (NC) part programs for the machine controller. The performance of the system has been verified and demonstrated by machining a particle transportation device. The CAM tool simplifies part programming and replaces the tedious trial-and-error approach to creating programs. The simulator tool accepts manual or computer generated part programs, and displays the tool path and the machined structure. This enables error checking and editing of the program before machining, and development of programs for complex microstructures. Combined, the tools provide a user-friendly CAD/CAM system environment for rapid prototyping of microfluidic devices.

• Laser Solutions
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• v.16 no.2
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• pp.1-6
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• 2013

Picosecond lasers are a very effective tool for micromachining metals, especially when high accuracy, high surface roughness and no heat affected zone are required. However, low productivity has been a limit to broadening the spectrum of their industrial applications. Recently it was reported that in the micromachining of copper with a 1064nm picosecond laser, there exist the optimal pulse energy and repetition rate to achieve the maximum volume ablation rate. In this paper, we used a 515nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, to obtain its optimal pulse energy and repetition rate. Theoretical analysis based on the experimental data on copper ablation showed that using a 515nm picosecond laser instead of a 1064nm picosecond laser is more favorable in that the calculated threshold fluence is 75% lower and optical penetration depth is 50% deeper.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.190-196
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• 2006

Transparent materials are widely used in the fields of optic parts and bio industry. We have experiment to find out the characteristics of the micromachining inside transparent materials using femtosecond laser pulses. With its non-linear effects by very high peak intensity, filament (plasma channel) was formed by the cause of the self-focusing and the self-defocusing. Physical damage could be found when the intensity is high enough to give rise to the thermal stress or evaporation. At the vicinity of the power which makes the visible damage or modification, the structural modification occurs with the slow scanning speed. According to the polarization direction to the scanning direction, the filament quality is quite different. There is a good quality when the polarization direction is parallel to the scanning direction. For fine filament, we could suggest the conditions of the high numerical aperture lens, the short shift of focusing point, the low scanning speed and the low power below 20 mW. As the examples of optics parts, we fabricated the fresnel zone plate with the $225{\mu}m$ diameter and Y-bend optical wave guide with the $5{\mu}m$ width.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.10
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• pp.108-115
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• 2009

Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.2
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• pp.132-139
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• 2000

This paper reports a novel micromachining process based on UV-LIGA process and (110) silicon anisotropic etching for fabrication of a high-aspect-ratio comb actuator. The comb electrodes are fabricated by (110) SILICON comb structure considering the etch-rate-ratio between (110) and (111) planes and lateral etch rate of a beam-type structure. The fabricated structure was$ 400\mum \; thick\; and\; 18\mum$ wide comb electrodes separated by $7\mim$ so that the height-gap ratio was about 57. Also considering resonant frequency of the comb actuator and the frequency-matching between sensing and driving mode for gyroscope application, we designed the number, width, height and length of the spring structures. Electroplated gold springs on both sides of the seismic mass were $15\mum\; wide,\; 14\mum\; thick\; and \; 500\mum$ long. The fabricated comb actuator had resonant frequency ay 1430Hz, which was calculated to be 1441Hz. The proposed fabrication process can be applicable to the fabrication of a high-aspect-ratio comb actuator for a large displacement actuator and precision sensors. Moreover, this combined process enables to fabricate a more complex structure which cannot be fabricate only by surface or bulk micromachining.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.792-796
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• 2001

For electron beam lithography and SEM(scanning electron microscopy) applications, miniaturized electrostatic lenses called a microcolumn have been fabricated. In this paper, we report the fabrication technique for 20~30$\mu\textrm{m}$ apertures of electron lenses based on silicon and Mo membrane using an active Q-switched Nd:YAG laser. Experimental conditions of laser micromachining for silicon and Mo membrane are improved. The geometrical structures, such as the diameter and the preciseness of the micron-size aperture are dependent upon the total energy of the laser pulse train, laser pulse width, and the diameter of laser spot.