• Title/Summary/Keyword: micro-voids

Search Result 98, Processing Time 0.026 seconds

Bending analysis of an imperfect FGM plates under hygro-thermo-mechanical loading with analytical validation

  • Daouadji, Tahar Hassaine;Adim, Belkacem;Benferhat, Rabia
    • Advances in materials Research
    • /
    • v.5 no.1
    • /
    • pp.35-53
    • /
    • 2016
  • Flexural bending analysis of perfect and imperfect functionally graded materials plates under hygro-thermo-mechanical loading are investigated in this present paper. Due to technical problems during FGM fabrication, porosities and micro-voids can be created inside FGM samples which may lead to the reduction in density and strength of materials. In this investigation, the FGM plates are assumed to have even and uneven distributions of porosities over the plate cross-section. The modified rule of mixture is used to approximate material properties of the FGM plates including the porosity volume fraction. In order the elastic coefficients, thermal coefficient and moisture expansion coefficient of the plate are assumed to be graded in the thickness direction. The elastic foundation is modeled as two-parameter Pasternak foundation. The equilibrium equations are given and a number of examples are solved to illustrate bending response of Metal-Ceramic plates subjected to hygro-thermo-mechanical effects and resting on elastic foundations. The influences played by many parameters are investigated.

A Study on Eulerian Finite Element Analysis for the Steady State Rolling Process (정상상태 압연공정의 유한요소 해석에 관한 연구)

  • Lee Y. S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2004.08a
    • /
    • pp.184-196
    • /
    • 2004
  • An Eulerian finite element analysis for the steady state rolling process is addressed. This analysis combines the crystal plasticity theory fur texture development as well as the continuum damage mechanics for growth of micro voids. Although an Eulerian analysis for steady state rolling has many advantages, it needs an initial assumption about the shape of control volume. However, the assumed control volume does not match the final shapes. To effectively predict the correct shape in an assumed control volume, a free surface correction algorithm and a streamline technique are introduced. Applications to plate rolling, clad rolling, and shape rolling will be given and the results will be discussed in detail.

  • PDF

A Study on Servo DC Resistance Spot Welding of Mg Alloy Sheet(1) (Mg합금판재의 서보가압식 DC점용접에 관한 연구(1))

  • Jung, Sun-Nyeo;Chang, Hee-Seok;Lee, Mok-Young
    • Journal of Welding and Joining
    • /
    • v.27 no.1
    • /
    • pp.102-107
    • /
    • 2009
  • Weldability of Mg alloy was investigated using servo-actuated DC resistance spot welder. Due to its uncommon electrical and mechanical properties, lots of voids and cracks were observed inside nugget with conventional weld schedule. Lobe curve was proposed to clarify proper electrode force and weld current, which guarantee reasonable weld strength and fatigue life. Macro structure of sectioned specimen was examined to count total number of void and crack. Post weld schedule is also proposed to reduce micro victors hardness value of weld zone.

Interfacial Reaction and Shear Properties with Reflow Conditions for In-48Sn Solder on BGA Package (리플로우 조건에 따른 In-48Sn 솔더와 BGA 패키지의 계면반응 및 전단 특성 변화)

  • 구자명;이영호;김대곤;김대업;정승부
    • Proceedings of the KWS Conference
    • /
    • 2003.05a
    • /
    • pp.193-195
    • /
    • 2003
  • Micro-structure and shear properties with reflow conditions, reflow temperature and time, for In-48Sn solder on BGA package were examined at the temperature between 140 and 170$^{\circ}C$ for 10 to 3600sec. With increasing reflow temperature and time, the thickness of intermetallic compound formed between solder and pad increased. Shear test indicated shear force increased in the range to a critical value of reflow time, and decreased over a critical reflow time. With increasing reflow temperature and time, the crater occurred on fracture surface because of a increase of crater by voids and IMC particles precipitated in solder.

  • PDF

Electrical characteristics on the interfacial heat treatment time between XLPE/EPDM laminates (XLPE/EPDM 계면의 열처리 시간에 따른 전기적 특성)

  • Choi, W.C.;Lee, C.J.;Kim, S.K.;Jo, D.S.;Park, K.S.;Kim, J.S.;Han, S.O.
    • Proceedings of the KIEE Conference
    • /
    • 1997.07d
    • /
    • pp.1503-1506
    • /
    • 1997
  • The main fault in this interface is that power cable insulating materials are mainly composed of a double layered structure, XLPE/EPDM laminates in cable joint. In this paper, we instituted the interface of normal and degassed XLPE/EPDM and then investigated the breakdown and conduction characteristics as a function of heat treatment time. The results showed that conduction and breakdown strength was influenced by volatile crosslinking by-products which remained inside the insulating material during the production of XLPE and EPDM, especially during heat treatment process. And micro voids and surface roughness also influenced the conduction current and breakdown strength.

  • PDF

A Study on the Solid State Diffusion Bonding of Ti-6Al-4V Alloy (Ti-6Al-4V합금의 고상 확산접합에 관한 연구)

  • 강호정;강춘식
    • Journal of Welding and Joining
    • /
    • v.15 no.6
    • /
    • pp.32-40
    • /
    • 1997
  • Solid state diffusion bonding is the joining process performed by creep and diffusion, which is accelerated by heating below melting temperature and proper pressing, in vacuum or shielding gas atmosphere. By this process we can obtain sufficient joint which can't be expected from the fusion welding. For Ti-6Al-4V alloy, the optimum solid state diffusion bonding condition and mechanical properties of the joint were found, and micro void morphology at bond interface was observed by SEM. The results of tensile test showed sufficient joint, whose mechanical properties are similar to that of base metal. 850$^{\circ}$C, 3MPa is considered as the optimum bonding condition. Void morphology at interface is long and flat at the initial stage. As the percentage of bonded area increases, however, small and round voids are found. Variation of void shape can be explained as follows. As for the void shrinkage mechanism, at the initial stage, power law creep is the dominant, but diffusion mechanism is dominant when the percentage of bonded area is increased.

  • PDF

TSV Fault Detection Technique using Eye Pattern Measurements Based on a Non-Contact Probing Method (Eye 패턴을 사용한 비접촉 형태의 TSV 고장 검출 기법)

  • Kim, Youngkyu;Han, Sang-Min;Ahn, Jin-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.64 no.4
    • /
    • pp.592-597
    • /
    • 2015
  • 3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising.

Si Micromachining for MEMS-lR Sensor Application (결정의존성 식각/기판접합을 이용한 MEMS용 구조물의 제작)

  • 박흥우;주병권;박윤권;박정호;김철주;염상섭;서상의;오명환
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1998.06a
    • /
    • pp.411-414
    • /
    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PT layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PT layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PT layer of c-axial orientation rained thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PT layer were measured, too.

  • PDF

Si Micromachining for MEMS-IR Sensor Application (결정의존성 식각/기판접합을 이용한 MEMS용 구조물의 제작)

  • 박홍우;주병권;박윤권;박정호;김철주;염상섭;서상회;오명환
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.10
    • /
    • pp.815-819
    • /
    • 1998
  • The silicon-nirtide membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PRO($PbTiO_3$ ) layer for a IR detection was coated on the membrane and its characteristics were measured. The a attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer were eliminated through the method of bonding/etching of silicon wafer. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by the PTO layer were measured, too.

  • PDF

Vibration analysis of nonlocal porous nanobeams made of functionally graded material

  • Berghouti, Hana;Adda Bedia, E.A.;Benkhedda, Amina;Tounsi, Abdelouahed
    • Advances in nano research
    • /
    • v.7 no.5
    • /
    • pp.351-364
    • /
    • 2019
  • In this work, dynamic behavior of functionally graded (FG) porous nano-beams is studied based on nonlocal nth-order shear deformation theory which takes into the effect of shear deformation without considering shear correction factors. It has been observed that during the manufacture of "functionally graded materials" (FGMs), micro-voids and porosities can occur inside the material. Thus, in this work, the investigation of the dynamic analysis of FG beams taking into account the influence of these imperfections is established. Material characteristics of the FG beam are supposed to be vary continuously within thickness direction according to a "power-law scheme" which is modified to approximate material characteristics for considering the influence of porosities. A comparative study with the known results in the literature confirms the accuracy and efficiency of the current nonlocal nth-order shear deformation theory.