Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Interfacial Reaction and Shear Properties with Reflow Conditions for In-48Sn Solder on BGA Package

리플로우 조건에 따른 In-48Sn 솔더와 BGA 패키지의 계면반응 및 전단 특성 변화

  • 구자명 (성균관대학교 신소재공학과) ;
  • 이영호 (성균관대학교 신소재공학과) ;
  • 김대곤 (성균관대학교 신소재공학과) ;
  • 김대업 (현대모비스(주) 기술연구소) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Published : 2003.05.01
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Abstract

Micro-structure and shear properties with reflow conditions, reflow temperature and time, for In-48Sn solder on BGA package were examined at the temperature between 140 and 170$^{\circ}C$ for 10 to 3600sec. With increasing reflow temperature and time, the thickness of intermetallic compound formed between solder and pad increased. Shear test indicated shear force increased in the range to a critical value of reflow time, and decreased over a critical reflow time. With increasing reflow temperature and time, the crater occurred on fracture surface because of a increase of crater by voids and IMC particles precipitated in solder.

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