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http://dx.doi.org/10.5370/KIEE.2015.64.4.592

TSV Fault Detection Technique using Eye Pattern Measurements Based on a Non-Contact Probing Method  

Kim, Youngkyu (Dept. of Information and Communication Engineering, Soonchunhyang University)
Han, Sang-Min (Dept. of Information and Communication Engineering, Soonchunhyang University)
Ahn, Jin-Ho (Dept. of Electronic Engineering, Hoseo University)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.64, no.4, 2015 , pp. 592-597 More about this Journal
Abstract
3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising.
Keywords
TSV Fault; 3D-IC; Non-Contact Test; Eye Pattern; Capacitive Coupling;
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