• Journal of the Korean Society for Heat Treatment
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• v.31 no.4
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• pp.171-179
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• 2018

Copper powder dispersed with 4 vol.% of $Cr_2O_3$ was successfully produced by a simple milling at 210 K with a mixture of $Cu_2O$, Cu and Cr elemental powders, followed by Hot Pressing (HP) at 1123 K and 50 MPa for 2h to consolidate the milled powder. The microstructure of the HPed material was characterized by standard metallographic techniques such as XRD (X-ray Diffraction), TEM and STEM-EDS. The results of STEMEDS analysis showed that the HPed materials comprised a mixture of nanocrystalline Cu matrix and $Cr_2O_3$ dispersoid with a homogeneous bimodal size distribution. The mechanical properties of the HPed materials were characterized by micro Vickers hardness test at room temperature. The thermodynamic considerations on the heat of formation, the incubation time to ignite MSR (Mechanically induced Self-sustaining Reaction), and the adiabatic temperature for the heat of displacement reaction between the oxide-metal are made for the delayed formation of $Cr_2O_3$ dispersoid in terms of MSR suppression. The results of TEM observation and hardness test indicated that the relatively large dispersoids in the HPed materials are attributed to the significant coarsening for the high temperature consolidation; this leads to the low Vickers hardness value. Based on the thermodynamic calculation for the operating processes with a limited number of parameters, the formation kinetics and coarsening of the $Cr_2O_3$ dispersoid are discussed.

• Journal of the Korean Ceramic Society
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• v.56 no.1
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• pp.71-76
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• 2019

Monochromatic amber phosphor in glasses (PiGs) for automotive LED applications were fabricated with $YAG:Ce^{3+}$, $CaAlSiN_3:Eu^{2+}$ phosphors and Pb-free silicate glass. After synthesis and thickness-thinning process, PiGs were mounted on high-power blue LED to make monochromatic amber LEDs. PiGs were simple mixtures of 566 nm yellow YAG, 615 nm red $CaAlSiN_3:Eu^{2+}$ phosphor and transparent glass frit. The powders were uniaxially pressed and treated again through CIP (cold isostatic pressing) at 200 MPa for 20 min to increase packing density. After conventional thermal treatment at $550^{\circ}C$ for 30 min, PiGs were applied by using GPS (gas pressure sintering) to obtain a fully dense PiG plate. As the phosphor content increased, the density of the sintered body decreased and PiGs containing 30 wt% phosphor had full sintered density. Changes in photoluminescence spectra and color coordination were investigated by varying the ratio of $YAG/CaAlSiN_3$ and the thickness of the plates. Considering the optical spectrum and color coordinates, PiG plates with $240{\mu}m$ thickness showed a color purity of 98% and a wavelength of about 605 nm. Plates exhibit suitable optical characteristics as amber light-converting material for automotive LED applications.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.47-52
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• 2018

In this study, the effects of the heat treatment and multi-scale hierarchical structures on the durability of the nano-patterned functional PMMA(Poly(methyl-methacrylate)) film was evaluated. The heat treatments that consisted of high-pressure/high-temperature flat pressing and rapid cooling process were employed to improve mechanical property of the PMMA films. Multi-scale hierarchical structures were fabricated by thermal nanoimprint to protect nano-scale structures from the scratch. Examination on surface structures and functionalities such as wetting angle and transmittance revealed that the preopposed heat treatment and multi-scale hierarchical structures are effective to minimize surface damages.

• Journal of Powder Materials
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• v.9 no.6
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• pp.394-408
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• 2002

Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

• Management & Information Systems Review
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• v.34 no.2
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• pp.151-169
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• 2015

Social enterprises that are solving pressing global issues and providing services such as micro-finance, affordable housing, appropriate technology and education for the 'bottom of the pyramid' as well as cultural and community-related businesses that improve the 'quality of life' within a society are the target of impact investments. Among them, a capital financing is one of the most important factor in founding and fostering of social enterprise. However, the capital market for social enterprises in South Korea are not yet sufficiently developed. The Britain and U.S.A. attempted to solve the social problem by the introduction of the social innovation credit model, for example, social impact bonds(SIB), Big Society Capital, DBLIF, and ACCION International, which are considered as an innovative new financing instrument for social program. Instruments are being attempted for the first time in Britain and America. This study have two purposes. The first purpose is abstracting the institutional mechanism for introduction of impact investment such as SIB and DBLIF case in Britain and U.S.A.. Second, analyzing type and mix of policy instrument on impact investment from the perspective of policy instrument.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.1
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• pp.7-12
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• 2017

3YSZ + (x) $Al_2O_3$ composites (x = 20, 40, 60, 80 wt%) were fabricated and the influences of particle sizes of $Al_2O_3$ on their microstructures and mechanical properties were investigated with XRD, SEM, vickers hardness and fracture toughness. $Al_2O_3$-3YSZ composites containing $Al_2O_3$ powder of a $0.3{\mu}m$ and an $1.0{\mu}m$, which are here in after named as $Al_2O_3$($0.3{\mu}m$)-3YSZ and $Al_2O_3$($1.0{\mu}m$)-3YSZ, respectively, were made by mixing raw materials, uni-axial pressing and sintering at $1,400^{\circ}C$, $1,500^{\circ}C$, and $1,600^{\circ}C$. $Al_2O_3$($0.3{\mu}m$)-3YSZ composites show the higher density and the better mechanical properties than $Al_2O_3$($1.0{\mu}m$)-3YSZ composites. The Vickers hardness of the $Al_2O_3$($0.3{\mu}m$)-3YSZ composites show a peak value of 1,997 Hv at the content of 60 wt% $Al_2O_3$, which is a slightly higher value in comparison with 1,938 Hv of the $Al_2O_3$($1.0{\mu}m$)-3YSZ composite. However, the fracture toughness of $Al_2O_3$-3YSZ composites monotonically increases with decreasing the content of $Al_2O_3$ without any peak values. $Al_2O_3$($0.3{\mu}m$)-3YSZ and $Al_2O_3$($1.0{\mu}m$)-3YSZ composites sintered at $1,600^{\circ}C$ have a maximum value of a $6.9MPa{\cdot}m^{1/2}$ and a $6.2MPa{\cdot}m^{1/2}$, respectively at the composition of containing 20 wt% $Al_2O_3$. It should be noticed that the mechanical properties and the sintering density of the $Al_2O_3$-3YSZ composites can be enhanced by using more fine $Al_2O_3$ powder due to their denser microstructure and smaller grain size.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Journal of the Korean Ceramic Society
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• v.40 no.9
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• pp.867-873
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• 2003

$Si_{3}N_{4}$-BN based machinable ceramics were fabricated by hot-pressing at $1800^{\circ}C$ for 2 h under a pressure of 25 MPa. The microstructure, mechanical properties, and machinability were investigated. With increasing h-BN content from 5 vol% to 30 vol%, three point flexural strength decreased from 1000 MPa of monolithic S $i_3$ $N_4$ to 720～400 MPa. The fracture toughness, $K_{IC}$ , was decreased from 7.6 MPaㆍ$m^{1/2}$ of monolithic S $i_3$ $N_4$ to 6.5～4.1 MPaㆍ$m^{1/2}$. The grain size and aspect ratio of $\beta$-S $i_3$ $N_4$ slightly decreased with increasing h-BN content. S $i_3$ $N_4$ monolith could not be machined due to brittle fracture, but S $i_3$ $N_4$-BN based machinable ceramics could be machined without fracture, showing excellent machinability. With increasing h-BN content, the thurst force during cutting and micro-drilling process was decreased.

• Journal of Digital Convergence
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• v.16 no.11
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• pp.149-157
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• 2018

The purpose of this study is to identify the tendency of media reports on the dementia management policy in Korea and to suggest policy implications such as prevention of dementia, improvement of awareness, and management of dementia through network analysis. We analyzed the linkage structure between the main texts centered on the number of citations of the main language related to the dementia management policy and the centrality and mediation as the research procedures and methods. As a result of the analysis, first, a 'micro' perspective is needed to explain practically. Second, it is desirable to understand the dementia management policy in the context of community. Third, the network structure of key words such as 'dementia management policy' suggests the possibility of research study in academic research in future research. Therefore, the phenomenon of dementia management policy will contribute to the direction of future dementia management policy, not local or temporary.