• Journal of the Korean Society for Precision Engineering
• /
• v.1 no.3
• /
• pp.52-70
• /
• 1984

This paper presents a micro-computer simulation package for the various vibratory systems. The Package consists of 10 programs which describe the dynamical characteristics of the vibratory system. The programs have been written in BASIC (Appoesoft) language and programmed on the 6502 CPU with 48 KRAM. This simulation package is stored in 5 $^1/_4$ inch floppy disk. The user requires no simulation expertise on the part of designer. Through a process of disk operation, the user can easily under- stand how to use this package.

• Journal of Sensor Science and Technology
• /
• v.15 no.4
• /
• pp.245-250
• /
• 2006

In this paper, glass cap wafer for MEMS device package is fabricated by using sand blaster dry etcher and Its surface is studied. The surface of dry etched glass is analyzed by using SEM, and many glass particles and micro cracks are observed. If these kind of particles were dropped from glass to the surface of device, It would make critical failure to the operation of device. So, several cleaning and etching methods are induced to remove these kinds of dormant failure mode and optimized condition is found out.

• Proceedings of the KIEE Conference
• /
• 2011.07a
• /
• pp.1702-1703
• /
• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• Electrical & Electronic Materials
• /
• v.10 no.6
• /
• pp.519-527
• /
• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.1
• /
• pp.39-44
• /
• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• Food Engineering Progress
• /
• v.14 no.4
• /
• pp.354-358
• /
• 2010

The methods for determining the diffusion parameters for the diffusion of d-limonene, a major volatile compound of orange juice, through a multi-layered food packaging material and predicting its absorption into the packaging material have been investigated. The packaging material used was the 1.5-mm thick multi-layered packaging material composed of high impact polystyrene (HIPS), polyvinylidene chloride (PVDC), and low density polyethylene (LDPE). Orange juice was placed in a cell where volatiles were absorbed in the sample package and kept at $23{\pm}2^{\circ}C$ for 72 hr. The d-limonene absorbed in a 1.5-mm thick multi-layered food packaging material was analyzed by a solid phase micro-extraction (SPME). The absorption parameters for the absorption of d-limonene in the packaging material were determined and absorption of d-limonene into the packaging material was predicted using absorption storage data. The SPME desorption at $60^{\circ}C$ for 1 hr resulted in the most sensitive and reproducible results. The diffusion coefficients of d-limonene in the packaging material and the partition coefficient at $23{\pm}2^{\circ}C$ were approximately $1-2{\times}10^{12}m^2$/s and 0.03, respectively. The absorption profile no earlier than 30 hr was fit well by a model derived from the Fick's law.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.50 no.7
• /
• pp.351-363
• /
• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• The Journal of the Convergence on Culture Technology
• /
• v.8 no.2
• /
• pp.355-360
• /
• 2022

In this paper, we present design and developing method for EMS(environment monitoring system) of micro data center. This developing EMS monitors operating environment of micro data center and analyze sensing data through IoT(Internet of things) sensors in real time. Firstly we present configuration method of IoT sensing package and design method EMS hardware platform. Secondly we design data collector software for data collection of IoT sensor with different protocol and develop monitoring software of EMS. The data collector software consists of sensor collector module and collector manager module. Also we design EMS software which has micro service architecture structural style and component based business logic.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 1999.12a
• /
• pp.127-154
• /
• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 1999.11a
• /
• pp.13-21
• /
• 1999