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http://dx.doi.org/10.5369/JSST.2006.15.4.245

Study of sand blaster dry etched glass wafer surface for micro device package  

Kim, Jong-Seok (Department of Micro/Nano system, Korea University)
Nam, Kwang-Woo (Samsung Advanced Institute of Technology)
Choa, Sung-Hoon (Samsung Advanced Institute of Technology)
Kwon, Jae-Hong (School of Electrical Engineering, Korea University)
Ju, Byeong-Kwon (School of Electrical Engineering, Korea University)
Publication Information
Journal of Sensor Science and Technology / v.15, no.4, 2006 , pp. 245-250 More about this Journal
Abstract
In this paper, glass cap wafer for MEMS device package is fabricated by using sand blaster dry etcher and Its surface is studied. The surface of dry etched glass is analyzed by using SEM, and many glass particles and micro cracks are observed. If these kind of particles were dropped from glass to the surface of device, It would make critical failure to the operation of device. So, several cleaning and etching methods are induced to remove these kinds of dormant failure mode and optimized condition is found out.
Keywords
sand blaster; gyro; package; glass; dry etching;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 K. Persson and K. Boustedt, 'Fundamental requirements on MEMS packaging and reliability', Advanced Packaging Materials, 2002. Proceedings, 2002 8th Internationa Symposium, pp. 1-7, Georgia, USA, 3h March 2002
2 Y. T. Cheng, L. Lin, and K. Najafi, 'Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging', Journal of Microelectromechanical Systems, vol. 9, issue 1, pp. 3-8, March, 2000   DOI   ScienceOn
3 주병권, 정회환, 김영조, 한정인, 조경익, 오명환, '실리콘 기판과 ITO가 코팅된 #7059 유리 기판간의 정잔열 접합', 센서학회지, 제7권, 제3호, pp. 65-71, 1998
4 박길수, 서상원, 최우범, 김진상, 남산, 이종흔, 주병권, 'RF-MEMS 소자의 웨이퍼 레벨 밀봉 패키징을 위한 열압축 본딩', 센서학회지, 제15권, 제호, pp. 58-64, 2006   과학기술학회마을   DOI