Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Study of sand blaster dry etched glass wafer surface for micro device package

샌드 블러스터로 건식 식각한 마이크로 소자 패키지용 유리 웨이퍼의 표면 연구

  • 김종석 (고려대학교 마이크로/나노 시스템협동과정) ;
  • 남광우 (삼성종합기술원) ;
  • 좌성훈 (삼성종합기술원) ;
  • 권재홍 (고려대학교 전기전자전파공학부) ;
  • 주병권 (고려대학교 전기전자전파공학부)
  • Published : 2006.07.30
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Abstract

In this paper, glass cap wafer for MEMS device package is fabricated by using sand blaster dry etcher and Its surface is studied. The surface of dry etched glass is analyzed by using SEM, and many glass particles and micro cracks are observed. If these kind of particles were dropped from glass to the surface of device, It would make critical failure to the operation of device. So, several cleaning and etching methods are induced to remove these kinds of dormant failure mode and optimized condition is found out.

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References

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