• Bulletin of the Korean Chemical Society
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• v.34 no.7
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• pp.2171-2175
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• 2013

The electronic structure and elastic properties of the 4d transition metal carbides MC (M = Y, Zr, Nb, Rh) were studied by means of extended H$\ddot{u}$ckel tight-binding band electronic structure calculations. As the valence electron population of M increases, the bulk modulus of the MC compounds in the rocksalt structure does not increase monotonically. The dominant covalent bonding in these compounds is found to be M-C bonding, which mainly arises from the interaction between M 4d and C 2p orbitals. The bonding characteristics between M and C atoms affecting the variation of the bulk modulus can be understood on the basis of their electronic structure. The increasing bulk modulus from YC to NbC is associated with stronger interactions between M 4d and C 2p orbitals and the successive filling of M 4d-C 2p bonding states. The decreased bulk modulus for RhC is related to the partial occupation of Rh-C antibonding states.

• Bulletin of the Korean Chemical Society
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• v.27 no.12
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• pp.2045-2050
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• 2006

The interstitial hydrogen bonding in NiTi solid and its effect on the metal-to-metal bond is investigated by means of the EH tight-binding method. Electronic structures of octahedral clusters $Ti_4Ni_2$ with and without hydrogen in their centers are also calculated using the cluster model. The metal d states that interact with H 1s are mainly metal-metal bonding. The metal-metal bond strength is diminished as the new metal-hydrogen bond is formed. The causes of this bond weakening are analyzed in detail.

• Korean Journal of Materials Research
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• v.24 no.7
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• pp.344-350
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• 2014

Metal films (i.e., Ti, Al and SUH310S) were prepared in a magnetron sputtering apparatus, and their cross-sectional structures were investigated using scanning electron microscopy. The apparatus used consisted of a cylindrical metal target which was electrically grounded, and two anode rings attached to the top and to the bottom of the target. A wire was placed along the center-line of the cylindrical target to provide a substrate. When the electrical potential of the substrate was varied, the metal-film formation rate depended on both the discharge voltage and the electrical potential of the substrate. As we made the magnetic field stronger, the plasma which appeared near the target collected on the plasma wall surface and thereby decreased the bias current. The bias current on the conducting wire was different from that for cation collection. The bias current decreased because the collection of cations decreased when we increased the magnetic-coil current. When the substrate was electrically isolated, the films deposited showed a slightly coarse columnar structure with thin voids between adjacent columns. In contrast, in the case of the grounded substrate, the deposited film did not show any clear columns but instead, showed a densely-packed granular structure. No peeling region was observed between the film and substrate, indicating good adhesion.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.5
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• pp.427-435
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• 2008

Inspection of dissimilar metal welds using phased array ultrasound is not easy at all, because crystalline structure of dissimilar metal welds cause deviation and splitting of the ultrasonic beams. Thus, in order to have focusing and/or steering phased array beams in dissimilar metal welds, proper time delays should be determined by ray tracing. In this paper, we proposed an effective approach to solve this difficult problem. Specifically, we modify the Oglivy's model parameters to describe the crystalline structure of real dissimilar metal welds in a fabricated specimen. And then, we calculate the proper time delay and incident angle of linear phased array transducer in the anisotropic and inhomogeneous material for focusing and/or steering phased array ultrasonic beams on the desired position.

• Journal of Welding and Joining
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• v.26 no.4
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• pp.79-84
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• 2008

Use of sheet metal structure is increased in various fields such as automobile, aerospace and communication equipment industry. When this structure is welded, welding distortion is generated due to the non-uniformity of temperature distribution. Recently welding distortion becomes a matter of great importance in the structure manufacture industry because it deteriorates the product's quality by bringing about shape error. Accordingly many studies for solving the problems by controlling the welding distortion are being performed. However, it is difficult to remove all kinds of distortion by welding process, though various kinds of methods for reducing distortion are applied to production. Consequently, straightening process is operated if the high precision quality is requested after welding. The local heating method induces compression plastic deformation by thermal expansion in the heating stage and then leaves constriction of length direction in the cooling stage. Accordingly, in the case of sheet metal structure, straightening effect is expected by heating for the part of distortion. This study includes numerical analysis of straightening effect by the local heating method in distortion comes from production of welded sheet metal structure. Particularly straightening effect followed by dimensions of heating area is analyzed according to the numerical analysis. The numerical analysis is performed by constructing 3-dimensional finite element model for 0.4mm stainless steel-sheet metal. Results of this study confirm that straightening effect changes as heating area increases and the optimum value of heating area that proves the maximum straightening effect exists.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Design & Manufacturing
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• v.16 no.4
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• pp.24-33
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• 2022

Fiber-reinforced plastics(FRPs) have excellent specific stiffness and strength, so they are usually used as automotive parts that require high rigidity and lightweight instead of metal. However, it is difficult to predict the mechanical properties of injection molded parts due to the fiber orientation and breakage of FRPs. In this paper, the fiber orientation characteristics and mechanical properties of injection molded specimens were evaluated in order to fabricate automotive transmission side covers with FRPs and design a rib structure for improvement of their rigidity. The test molds were designed and manufactured to confirm the fiber orientation characteristics of each position of the injection molded standard plate-shaped specimens, and the tensile properties of the specimens were evaluated according to the injection molding conditions and directions of specimens. A gusset-rib structure was designed to improve the additional structural rigidity of the target products, and a proper rib structure was selected through the flexural tests of the rib-structured specimens. Based on the evaluation of fiber orientation and mechanical characteristics, the optimization analyses of gate location were performed to minimize the warpage of target products. Also, the deformation analyses against the internal pressure of target product were performed to confirm the rigidity improvement by gusset-rib structure. As a result, it could be confirmed that the deformation was reduced by 27~37% compared to the previous model, when the gusset-rib structure was applied to the joining part of the target products.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.1
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• pp.13-17
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• 2006

Self-Assembled Monolayers (SAMs) formed by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecules and bio molecules. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAM structure formation.

• Bulletin of the Korean Chemical Society
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• v.24 no.8
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• pp.1215-1218
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• 2003

An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.12
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• pp.160-166
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• 2004

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated fer applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecule and bio molecule. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance of Self-Assembled Monolayers in selective etching of thin metal film. In this report, we present the several machining method to form the nanoscale structure by Mask-Less laser patterning using alknanethiolate Self-Assembled Monolayers such as thin metal film etching and heterogeneous SAMs structure formation.