• Current Photovoltaic Research
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• v.7 no.1
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• pp.15-20
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• 2019

Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.276-283
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• 2017

A polysilicon-based metal-semiconductor-metal (MSM) photodetector was fabricated by means of our new methods. Its photoresponse characteristics were analyzed to see if it could be applied to a sensor system. The processes on which this study focused were an alloy-annealing process to form metal-polysilicon contacts, a post-annealing process for better light absorption of as-deposited polysilicon, and a passivation process for lowering defect density in polysilicon. When the alloy annealing was achieved at about $400^{\circ}C$, metal-polysilicon Schottky contacts sustained a stable potential barrier, decreasing the dark current. For better surface morphology of polysilicon, rapid thermal annealing (RTA) or furnace annealing at around $900^{\circ}C$ was suitable as a post-annealing process, because it supplied polysilicon layers with a smoother surface and a proper grain size for photon absorption. For the passivation of defects in polysilicon, hydrogen-ion implantation was chosen, because it is easy to implant hydrogen into the polysilicon. MSM photodetectors based on the suggested processes showed a higher sensitivity for photocurrent detection and a stable Schottky contact barrier to lower the dark current and are therefore applicable to sensor systems.

• Applied Microscopy
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• v.47 no.3
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• pp.176-186
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• 2017

Two-dimensional (2D) materials have been studied widely owing to their outstanding properties since monolayer graphene was isolated in 2004. Especially, among 2D materials, phosphorene, a single atomic layer of black phosphorus (BP), has been highlighted for its electrical properties. This material can serve as a substitute for graphene, which has been revealed as a "semi-metal", in next-generation semiconductors. However, few-layer BP is prone to degradation under ambient conditions owing to its reactivity with oxygen and water, which results in the condensation of water droplets on the surface of the BP flakes. This causes charge transfer from the phosphorus atom to oxygen, resulting in the formation of phosphoric acid (oxide) and degrades the various properties of BP. Therefore, it is necessary to find passivation methods to prevent BP flakes from being degraded under ambient conditions. This review article deals with recent studies on passivation methods for BP and their performance against oxygen and water, effects on the electrical properties of BP, and the extent to how they protect BP.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.11
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• pp.29-35
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• 2015

The photo-response characteristics of polysilicon based metal-semiconductor-metal (MSM) photodetector structure, depending on deuterium treatment method, was analyzed by means of the dark-current and the light-current measurements. Al/Ti bilayer was used as a Schottky metal. Our purpose is to incorporate the deuterium atoms into the absorption layer of undoped polysilicon, effectively, for the defect passivation. We have introduced two deuterium treatment methods, a furnace annealing and an ion implantation. In deuterium furnace annealing, deuterium bond was distributed around polysilicon surface where the light current flows. As for the ion implantation, even thought it was a convenient method to locate the deuterium inside the polysilicon film, it creates some damages around polysilicon surface. This deteriorated the photo-response in our photodetector structure.

• Korean Chemical Engineering Research
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• v.50 no.3
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• pp.574-581
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• 2012

The relatively short lifetime is a major obstruction for the commercial applications of OLED. One of the reason for the short lifetime is that the organic materials are interacted with water or oxygen in the atmosphere. Protection of water or oxygen from diffusing into the organic material layers are necessary to increase the lifetime of OLED. Although encapsulation of OLED with glass or metal cans has been established, passivation methods of OLED by organic/inorganic thin films are still being developed. In this paper we have developed in-situ passivation system and thin film passivation method using PECVD by which deposition can be performed at room temperature. We have analyzed the characteristics of the passivated OLED device also. The WVTR (Water Vapor Transmission Rate) for the inorganic thin film mono-layer can be reached down to $1{\times}10^{-2}g/m^2{\cdot}day$ and improved lifetime can be obtained. Thin film passivation methods are expected to be applied to flexible display.

• Applied Chemistry for Engineering
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• v.17 no.5
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• pp.433-442
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• 2006

Hexavalent chromium passivation, as very effective anti-corrosion method, can not be used in the field of surface treatment for metal, any more. Throughout the world, this regulations which was applied to automotive industries will be extended to all industries including electronics industries in the near future. Therefore a new anti-corrosion method should be established without delay, and trivalent chromium passivation as an alternatives replace the hexavalent chromium passivation for the time being. This paper gives an overview of the currently available trivalent chromium passivation processes, and then it attempts to give an insight to develop a more effective trivalent chromium conversion coating process for possible substitution of the hexavalent chromium passivation process.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1310-1312
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• 2005

Passivation of organic thin-film transistors (OTFTs) using organic and metal thin-film was presented. Parylene-C and titanium were used as an organic and metal layer, respectively. With the proposed passivation method the degradation of electric parameters of OTFTs was relieved compared with non-passivated devices. Several electric parameters such as on/off current, field-effect mobility, and threshold voltage were shown.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.7
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• pp.517-521
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS(X-ray pheotoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, $CHF_3$ plasma treatment subsequent to the etch has been carried put. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after $CHF_3$ treatment, and the layer suppresses effectively the corrosion on the surface as the $CHF_3$treatment in the pressure of 300m Torr.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.1-8
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• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.22 no.1
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• pp.67-80
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• 2024

Fundamental aspects of creating passivation layers for corrosion resistance in nuclear engineering applications, specifically the ability to form complete layers versus porous ones, are being explored in this study. Utilizing a laser ablation technique, 1,064 nm fire at 10 Hz with 60 pulses per shot and 0.5 mm between impact points, aluminum samples are treated in an attempt to create a fully formed passivation layer that will be tested in a LiCl-KCl eutectic salt. By placing these samples into an electrochemical environment mimicking a pyroprocessing system, corrosion rates, resistances and material characteristics are tested for one week and then compared between treated and untreated samples. In initial testing, linear sweep voltammetry indicates corrosion current density for the untreated sample at -0.038 mA·cm^-2 and treated samples at -0.024 mA·cm^-2 and -0.016 mA·cm^-2, respectively. This correlates to a control sample corrosion rate of -0.205 mm·yr^-1 and treated rates of -0.130 mm·yr^-1 and -0.086 mm·yr^-1 for samples 1 and 2. In addition, electrochemical impedance spectroscopy circuits show application of a longer-lasting porous passivation layer on the treated metal, compared to the naturally forming layer. However, the current technique fails to create a uniform protection layer across the sample.