• Title/Summary/Keyword: metal foil

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Fabrication of ZnO Nanorod based Robust Nanogenerator Metal Substrate (금속 기판적용을 통한 ZnO 나노로드기반 나노제너레이터 제조)

  • Baek, Seong-Ho;Park, Il-Kyu
    • Journal of Powder Materials
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    • v.22 no.5
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    • pp.331-336
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    • 2015
  • We report on the succesful fabrication of ZnO nanorod (NR)-based robust piezoelectric nanogenerators (PNGs) by using Cu foil substrate. The ZnO NRs are successfully grown on the Cu foil substrate by using all solution based method, a two step hydrothermal synthesis. The ZnO NRs are grown along c-axis well with an average diameter of 75~80 nm and length of $1{\sim}1.5{\mu}m$. The ZnO NRs showed abnormal photoluminescence specrta which is attributed from surface plasmon resonance assistant enhancement at specific wavelength. The PNGs on the SUS substrates show typical piezoelectric output performance which showing a frequency dependent voltage enhancement and polarity dependent charging and discharging characteristics. The output voltage range is 0.79~2.28 V with variation of input strain frequency of 1.8~3.9 Hz. The PNG on Cu foil shows reliable output performance even at the operation over 200 times without showing degradation of output voltage. The current output from the PNG is $0.7{\mu}A/cm^2$ which is a typical out-put range from the ZnO NR-based PNGs. These performance enhancement is attributed from the high flexibility, high electrical conductivity and excellent heat dissipation properties of the Cu foil as a substrate.

Silicon Thin-film Transistors on Flexible Foil Substrates

  • Wagner, Sigurd;Gleskova, Helena
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.263-267
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    • 2002
  • We are standing at the beginning of the industrialization of flexible thin-film transistor backplanes. An important group of candidates is based on silicon thin films made on metal or plastic foils. The main features of amorphous, nanocrystalline and microcrystalline silicon films for TFTs are summarized, and their compatibility with foil substrate materials is discussed.

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Photoneutron yield for an electron beam on tantalum and erbium deuteride

  • Andrew K. Gillespie;Cuikun Lin;R.V. Duncan
    • Nuclear Engineering and Technology
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    • v.56 no.8
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    • pp.3084-3089
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    • 2024
  • An electron beam may be used to generate bremsstrahlung photons that go on to create photoneutrons within metals. This serves as a low-energy neutron source for irradiation experiments. In this article, we present simulation results for optimizing photoneutron yield for a 10-MeV electron beam on tantalum foil and erbium deuteride (ErD3). The thickness of the metal layers was varied. A tantalum foil thickness of 1.5 mm resulted in the most photons reaching the second metal layer. When a second metal layer of ErD3 was included, the photoneutron yield increased with the thickness of the secondary layer. When the electron beam was directly incident upon a layer of ErD3, the photoneutron yield did not differ significantly from the yield when a layer of tantalum was included. The directional photoneutron yield reached a maximum level when the thickness of the ErD3 layer was around 12 cm. About 1 neutron was generated per 104 source electrons. When using a 2-mA beam current, it is possible to generate up to 1012 neutrons per second, making this combination a relatively-inexpensive neutron generator.

A Study on the Micro-mechanical Characteristics of Vacuum Hot Pressed Titanium Metal Matrix Composites (고온진공가압 티타늄 금속기 복합재료의 미시-기계적 특성에 관한 연구)

  • 하태준;김태원
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2003.10a
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    • pp.207-210
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    • 2003
  • Vacuum hot pressing has been used for the development of Ti-MMCs using foil-fiber-foil method, and subsequent micro-mechanical characteristics of the composites are evaluated by means of several experimental processes. As shown by the results, fiber strength degradation occurs during the consolidation, and particularly residual stresses results from the thermal expansion mismatch between fiber and matrix materials during cooling process are incorporated in the changes of mechanical properties of the composites. In industrial applications, the processing conditions avoiding micro-material failures are important together with the properties of finished products, and therefore should be included in the assesment of the material characterization.

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A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing (355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구)

  • Oh, Jae-Yong;Shin, Bo-Sung
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.2 s.191
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

High frequency partial discharge measurement by metal foil electrode (박전극을 이용한 고주파 부분방전 측정 연구)

  • Kim, C.S.;Shin, D.S.;Lee, C.Y.;Kim, J.N.;Baek, J.H.;Kim, D.W.;Park, W.K.
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.1081-1083
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    • 1999
  • The capacitive coupling technique has been used as conventional method for PD detection on the power cable line. Recently, however PD measurement using by high frequency is known to have an excellent sensitivity comparison with low frequency on-site. In this paper, the high frequency characteristic of two type of metal foil sensor was studied and the technique was proved to be more effective diagnostic method than conventional method for qualification of EHV cable and accessories.

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Thick Graphene Embedded Metal Heat Spreader with Enhanced Thermal Conductivity

  • Park, Minsoo;Chun, Kukjin
    • Journal of Sensor Science and Technology
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    • v.23 no.4
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    • pp.234-237
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    • 2014
  • In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

Fabrication Method Of Micro Embossing Patterned Metallic Thin Foil Using CIP Process and It's Mechanical Property (냉간 등방압 성형공정을 이용한 마이크로 엠보싱 패턴 성형 및 기계적 물성 측정)

  • Lee, H.J.;Lee, N.K.;Lee, G.A.;Lee, H.W.;Choi, S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.243-246
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    • 2006
  • In this paper, Experimental results on the measurement of mechanical properties of fine patterns in the MEMS structure are described. The mechanical properties of embossing patterns on metallic thin foil is measured using the nano indentation system, that is developed by Korea Institute of Industrial Technology(KITECH). These micro embossing patterns are fabricated using CIP(Cold Isostatic Press) process on micro metallic thin foils(Al-1100) that are made by rolling process. These embossing patterned metallic thin foils(Al-1100) are used in the reflecting plate of BLU(Back Light Unit) and electrical/mechanical MEMS components. If these mechanical properties of fine patterns are utilized in a design procedure, the optimal design can be achieved in aspects of reliability as well as economy.

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Study of Peel Strength Property of Aluminum/Organic Composite (알루미늄/유기물 복합재료의 Peel 강도 특성에 대한 연구)

  • Kim, Jun-Young;Yoo, Myong-Jae;Kim, Seoung-Taek;Lee, Woo-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.217-218
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    • 2007
  • Aluminum 분말과 고분자를 혼합하여 고분자-금속 복합재료(polymer-metal composite)를 만들어 copper foil과 기판의 접착력을 평가하였다. Tape casting 방법을 이용하여 sheet 만들고 vacuum lamination으로 PCB(Printed Circuit Board)기판을 제조한 후 포토공정으로 peel strength pattern을 형성하였으며, 본 연구에서는 최적의 aluminum 조건을 찾기 위하여 압력, 온도, copper foil의 표면 상태와 silane 표면 코팅에 따른 aluminum-polymer복합재료의 peel strength의 변화를 확인하였다. 최적의 조건은 silane 표면 코팅 처리를 한 aluminum 분말로 $210^{\circ}C$에서 $9.7kg/cm^2$ 압력으로 matte면의 돌기 크기가 크며, 응집이 잘 되어있는 copper foil을 사용하여 13.89N의 우수한 peel strength를 구현 할 수 있었다.

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