1 |
W. Guy and W. Maltz, "Thermal management challenges in the passive cooling of handheld devices", Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on, pp. 344-347, IEEE, 2013.
|
2 |
S. Krishna. "Power and thermal challenges in mobile devices", Proceedings of the 19th Annual International Conference on Mobile Computing & Networking, pp. 363-368, ACM, 2013.
|
3 |
X. Qu, L. Zhang, M. Wu, and S. Ren, "Review of metal matrix composites with high thermal conductivity for thermal management applications", Progress in Natural Science: Materials International, Vol. 21, Issue. 3, pp. 189-197, 2011.
DOI
ScienceOn
|
4 |
P. B. Abel, A. L. Korenyi-Both, F. S. Honecy, and S. V. Pepper, "Study of copper on graphite with titanium or chromium bond layer", J. Mater. Res., Vol. 9, Issue. 3, pp. 617-624, 1994.
DOI
|
5 |
D. F. Lim, J. Fan, L. Peng, K. C. Leong, and C. S. Tan, "Cu-Cu hermetic seal enhancement using self-assembled monolayer passivation", J. Electron. Mater., Vol. 42, No. 3, pp. 502-506, 2013.
DOI
ScienceOn
|
6 |
A. L. Lytle, Angstrom's Method of Measuring Thermal Conductivity, Physics Department, The college of Wooster, Wooster, Ohio, 2000.
|