• Journal of the Korean institute of surface engineering
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• v.34 no.4
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• pp.281-288
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• 2001

Phosphating treatments have been performed to improve paint adhesion and corrosion resistance of zinc and zinc alloy coated steels for a long time. In this work, the effects of the addition of chelate compound were studied to improve the stability of surface conditioning solution and properties of zinc phosphate films. The coalescence of colloidal Ti-compound and extraneous charged particles (alkaliearth metal cation such as $Mg^{2+}$ , $Ca^{2+}$ ) were suppressed by using a surface conditioning solution with chelate compound. Therefore, after surface conditioning solution containing chelate compound was left standing for one week at room temperature, the formation of a white sediment was decreased comparing to surface conditioning solution without chelate compound. The crystal size of phosphate film was fine and the whiteness value of phosphated zinc coated steel sheets was also high without the decrease of corrosion resistance and anti-patina. It was very effective to use chelate compound improving the stability of surface conditioning solution.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.511-512
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• 2010

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• Journal of the Korea Society of Computer and Information
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• v.22 no.10
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• pp.1-7
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• 2017

In this paper, the separation force measuring system is developed. The separation force aries due to adhesive strength between semiconductor epoxy molding compound(EMC) and the metal plate in semiconductor formed plate. In general, when removing the metal plate in semiconductor formed plate from semiconductor epoxy molding compound, excessive strength can result in a increase in semiconductor defect rates, or conversely, if too little force is exerted on the metal plate in semiconductor formed plate, the semiconductor production rates can decrease. In this study, the design criteria for the selection of the AC servo motor, the role of the ball screw, the relationship between the load cell and the ball screw, and the rate of deceleration are given. In addition, minimizing the reject rate of semiconductors and maximizing the semiconductor production rate are achieved through the standardization of the collected separation force data measured by the proposed system.

• Bulletin of the Korean Chemical Society
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• v.29 no.3
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• pp.567-570
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• 2008

A new pyrene appended diaza-18-crown-6 ether derivative 1 has been prepared and its fluoroionophoric properties toward transition metal ions were investigated. Compound 1 exhibited a high Hg2+-selectivity over other transition metal ions as well as alkali and alkaline earth metal ions in aqueous acetonitrile solution. The ratiometric analysis of the monomer and excimer emissions of pyrene successfully signals the presence of Hg2+ ions. The detection limit for Hg2+ ions was found to be 3.1 ´ 10-6 M in 50% aqueous acetonitrile solution at pH 8.1. Competition experiments also suggest that the compound could be utilized as a selective and sensitive fluorescent chemosensor for the analysis of micromolar Hg2+ ions in physiological and environmental samples.

• Bulletin of the Korean Chemical Society
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• v.17 no.1
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• pp.43-45
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• 1996

Structural and electronic properties of an alkali metal fulleride, Rb1C60, was studied. In spite of the chain structure with shortdistance between balls along the crystallographic a-direction, the electronic structure calculation study with the X-ray defined crystal structure shows that Rb1C60 is a three-dimensional metal at room temperature. This result is different from the magnetic experiments in which the compound was found to behave as a quasi-one-dimensional metal. Partial Fermi surface nesting is supposed to be the reason for the metal-insulator transition found in Rb1C60 at ∼50 K.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.30 no.2
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• pp.87-98
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• 2020

Objective: The purpose of this study was to propose a sequential procedure for the simultaneous analysis of soluble and insoluble metal compounds. Methods: Methods for sampling and analyzing metal compounds such as ISO standards, NIOSH methods, HSE methods, and OSHA methods were reviewed. Results: Some metals have different OELs depending on the solubility of the compound. Therefore, we should take into account these characteristics and perform an exposure assessment. Soluble metal compounds are first extracted from the filter, and then the filter is digested by acids to analyze residual insoluble components. The extraction of soluble compounds can be completed by agitation for about 60 minutes with a leach solution (water) in a water bath at 37℃. For the analysis of insoluble compounds, the sample filter and the filtration filter remaining after the extraction of the soluble compounds are analyzed. This allows simultaneous determination of soluble and insoluble metal compounds. For hexavalent chromium compounds, soluble hexavalent chromium can first be extracted from the filter by using sulfate buffer. The insoluble hexavalent chromium remaining in the filter can then be extracted using carbonate buffer. Conclusion: Workers are often exposed to many hazardous substances with different exposure limits at industrial sites. The OELs for compounds of the same metal can be set differently depending on solubility. This study can help evaluate a worker's exposure to metal compounds by suggesting methods for the simultaneous determination of soluble and insoluble metal compounds.

• Journal of the Korean Chemical Society
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• v.40 no.7
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• pp.509-514
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• 1996

The three-dimensional metal complex inclusion compound $Cd(pn)Ni(CN)_4{\cdot}0.5NO_2C_6H_5$(pn: 1,2-diaminopropane=propylenediamine) crystallizes in the orthorhombic space group, $Pn2_1$a, (a=13.868(5), b=26.591(4), c=7.840(1)${\AA}$, V=2891(1)${\AA}^3$, Z=4), R=0.054 for 2800 independent reflections. The host structure of the inclusion compound appears the same one(T-type) of inclusion compound with branched aliphatic-guest molecule. The nitrobenzeneguest molecule attains the stable position in the nodal channel of T-type by placing the polar nitro group between the pn-amino groups at the node and the bulky aromatic ring in the antinodal zone of the channel. The substituted aromatic guest molecule is accommodated in the host structure of metal complex $Cd(pn)Ni(CN)_4$ with channel cavity.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.4_2
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• pp.509-515
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• 2021

In this study, a pressure vessel for a heat pipe was fabricated by bonding a metal thin film using a polymer compound sheet. In order to confirm the applicability of the experimentally manufactured copper material thin heat pipe of 0.6 mm or less, the pressure resistance and effective thermal conductivity for pressure generated according to the type of the working fluid of the heat pipe were evaluated to suggest the commercialization potential of the thin heat pipe. As a result of evaluating the pressure resistance and effective thermal conductivity performance of the thin heat pipe, the following conclusions were drawn. 1) Using a PEEK-based polymer compound sheet, it was possible to fabricate a pressure vessel for a thin heat pipe with a pressure resistance of up to 1.0 MPa by bonding a copper thin film, and the possibility of commercialization was confirmed at a temperature below 120 ℃. 2) In the case of the effective thermal conductivity performance evaluation test, the effective thermal conductivity of ethanol was higher than that of FC72 and Novec7000, and in the case of ethanol, the maximum effective thermal conductivity was 2,851 W/mK at 3.0 W of heating.

• Bulletin of the Korean Chemical Society
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• v.35 no.6
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• pp.1897-1900
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• 2014