[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.21289/KSIC.2021.24.4.509

A Study on the Evaluation of Pressure Resistance and Effective Thermal Conductivity of Thin Heat Pipes Using Polymer Compound Sheets for Bonding Metal Thin Plates

Yu, Byeong-Seok (Dept. of Mechanical&Shipbuilding Convergence Engineering, Pukyong National University)
Kim, Jeong-Hun (Aritous. Corportation)
Kim, Dong-Gyu (Dept. of Mechanical&Shipbuilding Convergence Engineering, Pukyong National University)

Publication Information

Journal of the Korean Society of Industry Convergence / v.24, no.4_2, 2021 , pp. 509-515 More about this Journal

Abstract

In this study, a pressure vessel for a heat pipe was fabricated by bonding a metal thin film using a polymer compound sheet. In order to confirm the applicability of the experimentally manufactured copper material thin heat pipe of 0.6 mm or less, the pressure resistance and effective thermal conductivity for pressure generated according to the type of the working fluid of the heat pipe were evaluated to suggest the commercialization potential of the thin heat pipe. As a result of evaluating the pressure resistance and effective thermal conductivity performance of the thin heat pipe, the following conclusions were drawn. 1) Using a PEEK-based polymer compound sheet, it was possible to fabricate a pressure vessel for a thin heat pipe with a pressure resistance of up to 1.0 MPa by bonding a copper thin film, and the possibility of commercialization was confirmed at a temperature below 120 ℃. 2) In the case of the effective thermal conductivity performance evaluation test, the effective thermal conductivity of ethanol was higher than that of FC72 and Novec7000, and in the case of ethanol, the maximum effective thermal conductivity was 2,851 W/mK at 3.0 W of heating.

Keywords

Metal Thin Plates; Thin Heat Pipe; Polymer Compound Sheet; Pressure Vessel; Pressure Resistance; Effective Thermal Conductivity;

Citations & Related Records

Reference

1	J. Q, H. Y. Wu and P. Cheng, "Thermal performance of an oscillating heat pipe with Al2O3-water nanofluids", International Communications in Heat and Mass Transfer, Vol. 37, Issue 2, pp. 111-115, (2010). DOI
2	T. Shioga and Y. Mizuno, "Micro loop heat pipe for mobile electronics applications", IEEE 31st SEMI-THERM Symposium, pp.50-55, (2015).
3	J.H, Kim and D.G, Kim, "The bonding of pressure container for thin heat pipe using a polymer compound sheet", The Korean Society of Automotive Engineers Fall Conference, pp.1022-1023, (2016).
4	T-H. Tran, S. Harmand, and B. Sahut, "Experimental investigation on heat pipe cooling for hybrid electric vehicle and electric vehicle lithium-ion battery", J. Power Sources, Vol. 265, pp. 22-272, (2014).
5	S.H. Moon and Y.H. Park, "Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe Based on Extrusion Fabrication", Trans.Korean Soc. Mech. Eng. B. Vol.40, No.11. pp.755-759, (2016). DOI
6	Y. J. Youn and S. J. Kim, "Fabrication and evaluation of a slicon-based micro pulsating heat spreader", Sensors and Actuators A, Vol. 174, pp. 189-197, (2012). DOI
7	A. B. Solomon, M. Sekar and S. H. Yang, "Analytical expression for thermal conductivity of heat pipe", Applied Thermal Engineering, vol. 100, pp.462-467, (2016). DOI
8	J. Legierski, B. Wie and G. Mey, "Measurements and simulations of transient characteristics of heat pipes", Microelectronics Reliability, Vol. 46, Issue 1, pp. 109-115, (2006). DOI
9	C. Oshman, B. Shi, C. Li, R. Yang, G. P. Peterson, V. M. Bright and Y C L Kee, "The Development of Polymer-Based Flat Heat Pipes", Journal of Microelectromechanical systems, Vol. 20, No. 2, pp. 410-417, (2011). DOI
10	Thin flat heat pipe, KR20160146614A
11	Sameer Khandekar, Nicolas Dollinger, Manfred Groll, "Understanding operational regimes of closed loop pulsating heat pipes: an experimental study", Applied Thermal Engineering 23, pp.707-719, (2003). DOI
12	Thin heat Pipe and Manufacturing Method, WO2016204328A1